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Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96635
https://doi.org/10.1115/IPACK2022-96635
View Paper titled, Dual Converging Jets for Enhanced Liquid Impingement Cooling
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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97218
https://doi.org/10.1115/IPACK2022-97218
View Paper titled, Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process
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Topics: Bonding, Computation, Computer simulation, Deformation, Design, Engineering prototypes, Flow (Dynamics), Levitation, Optimization, Physics
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes

Wei Li, Chuancai Zhang, Zhichuan Sun, Zhichun Liu, Lianxiang Ma, Yan He, Bin Zhang, Wei Chen, David J. Kukulka
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A024, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8454
https://doi.org/10.1115/IPACK2018-8454
View Paper titled, Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes
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Topics: Evaporation, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Temperature, Turbulence, Vapors
Proceedings Papers

Unsteady Heat Flux Measurements in Agitated Channel Flows

Smita Agrawal, Terrence Simon, Mark North, Tianhong Cui
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48753
https://doi.org/10.1115/IPACK2015-48753
View Paper titled, Unsteady Heat Flux Measurements in Agitated Channel Flows
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Topics: Channel flow, Heat flux, Flow (Dynamics), Cycles, Heat sinks, Convection, Fluctuations (Physics), Heat exchangers, Heat transfer, Turbulence
Proceedings Papers

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

Kazuma Obata, Takashi Fukue, Koichi Hirose, Mamoru Kikuchi, Yasuhiko Ueda, Shigekado Kusabuka, Tomoyasu Miyahara
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A045, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48607
https://doi.org/10.1115/IPACK2015-48607
View Paper titled, Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators
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Topics: Cooling, Flow (Dynamics), Generators, Heat sinks, Vortices, Water, Heat, Density, Electric vehicles, Energy dissipation
Proceedings Papers

Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center

Sami A. Alkharabsheh, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73216
https://doi.org/10.1115/IPACK2013-73216
View Paper titled, Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center
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Topics: Containment, Data centers, Flow (Dynamics), Leakage, Temperature, Containment systems, Air flow, Approximation, Buoyancy, Computational fluid dynamics
Proceedings Papers

A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers

Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael Ellsworth, Milnes David, Roger Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73217
https://doi.org/10.1115/IPACK2013-73217
View Paper titled, A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers
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Topics: Data centers, Steady state, Flow (Dynamics), Temperature, Buoyancy, Dynamic models, Energy dissipation, Failure, Air flow, Approximation
Proceedings Papers

Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow

David M. Sykes, Andrew L. Carpenter, Gregory S. Cole
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A044, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73204
https://doi.org/10.1115/IPACK2013-73204
View Paper titled, Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow
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Topics: Boiling, Flow (Dynamics), Jets, Subcooling, Heat transfer coefficients, Heat transfer, Microchannels, Momentum, Wall temperature, Boundary layers
Proceedings Papers

Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink

Afzal Husain, Jun-Hee Kim, Kwang-Yong Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73063
https://doi.org/10.1115/IPACK2013-73063
View Paper titled, Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink
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Topics: Heat sinks, Silicon, Flow (Dynamics), Laminar flow, Design, Boundary-value problems, Cross-flow, Electronics, Heat flux, Heat transfer
Proceedings Papers

Potential-Flow Modeling for Data Center Applications

Christopher M. Healey, James W. VanGilder, Zachary R. Sheffer, Xuanhang Simon Zhang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 527-534, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52136
https://doi.org/10.1115/IPACK2011-52136
View Paper titled, Potential-Flow Modeling for Data Center Applications
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Topics: Data centers, Flow (Dynamics), Modeling, Computational fluid dynamics, Friction, Air flow, Buoyancy, Design, Fluid dynamics, Heat transfer
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 953-961, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89306
https://doi.org/10.1115/InterPACK2009-89306
View Paper titled, Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell
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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Flow (Dynamics), Temperature, Compacting, Cooling, Design, Heat transfer
Proceedings Papers

Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell

Madhusudan Iyengar, Roger R. Schmidt, Hendrik Hamann, Jim VanGilder
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 819-826, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33508
https://doi.org/10.1115/IPACK2007-33508
View Paper titled, Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell
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Topics: Data centers, Temperature distribution, Errors, Server racks, Temperature, Air conditioning, Computer simulation, Exhaust systems, Flow (Dynamics), Modeling
Proceedings Papers

Fluid Flow Behavior for a Confined Rotating MCM Disk With Round Jet Array Impingement

C. J. Fang, C. Y. Lee, C. H. Peng, T. W. Lin, Y. H. Hung
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 917-924, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33278
https://doi.org/10.1115/IPACK2007-33278
View Paper titled, Fluid Flow Behavior for a Confined Rotating MCM Disk With Round Jet Array Impingement
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Topics: Disks, Fluid dynamics, Nozzles, Reynolds number, Separation (Technology), Turbulence
Proceedings Papers

Experimental Thermal Characterization of Pin Fin Heat Sinks With Top and Side Bypass

Ning Lei, Alfonso Ortega
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 291-298, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73222
https://doi.org/10.1115/IPACK2005-73222
View Paper titled, Experimental Thermal Characterization of Pin Fin Heat Sinks With Top and Side Bypass
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Topics: Heat sinks, Thermal characterization, Clearances (Engineering), Flow (Dynamics), Thermal resistance, Heat transfer coefficients, Aluminum, Heat flux, Pins (Engineering), Temperature
Proceedings Papers

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

Felipe E. Ortega Gutierrez, Alfonso Ortega, Guoping Xu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 315-327, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73228
https://doi.org/10.1115/IPACK2005-73228
View Paper titled, Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Heat, Temperature measurement, Boundary-value problems, Clearances (Engineering), Copper, Cross-flow, Finishes
Proceedings Papers

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks Are Removed

Roger Schmidt, Ethan Cruz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 481-493, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35240
https://doi.org/10.1115/IPACK2003-35240
View Paper titled, Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks Are Removed
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Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Temperature distribution
Proceedings Papers

Low-Profile Synthetic Jet Cooling for Portable Computers

Raghav Mahalingam, Ari Glezer
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 147-151, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35069
https://doi.org/10.1115/IPACK2003-35069
View Paper titled, Low-Profile Synthetic Jet Cooling for Portable Computers
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Topics: Computers, Cooling, Cavities, Ejectors, Fluids, Channel flow, Diaphragms (Mechanical devices), Diaphragms (Structural), Ducts, Electronic systems
Proceedings Papers

Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels

Ralph L. Webb
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 527-535, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35251
https://doi.org/10.1115/IPACK2003-35251
View Paper titled, Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels
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Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Friction, Manufacturing, Microelectromechanical systems, Cooling, Reynolds number, Shapes
Proceedings Papers

Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced

Roger Schmidt, Ethan Cruz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 495-508, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35241
https://doi.org/10.1115/IPACK2003-35241
View Paper titled, Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced
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Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Exhaust systems