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Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6417
https://doi.org/10.1115/IPACK2019-6417
View Paper titled, Thermal Analysis of 3D ICs With TSVs Placement Optimization
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Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing
Proceedings Papers

Practical Concerns for Adoption of Microjet Cooling

Stephen M. Walsh, James P. Smith, Eric A. Browne, Timothy W. Hennighausen, Bernard A. Malouin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A026, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8468
https://doi.org/10.1115/IPACK2018-8468
View Paper titled, Practical Concerns for Adoption of Microjet Cooling
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Topics: Cooling, Electronics, Erosion, Flux (Metallurgy), Heat, Numerical analysis, Operating temperature, Power density, Pressure, Robustness
Proceedings Papers

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8358
https://doi.org/10.1115/IPACK2018-8358
View Paper titled, Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
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Topics: Copper, Reliability, Silver, Wire, Failure mechanisms, Shear strength, High temperature, Shear (Mechanics), Wire bonding, Aluminum
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74244
https://doi.org/10.1115/IPACK2017-74244
View Paper titled, Optimization of Graphite Composite Latent Heat Storage Systems
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48242
https://doi.org/10.1115/IPACK2015-48242
View Paper titled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils
Proceedings Papers

Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures

Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A080, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48682
https://doi.org/10.1115/IPACK2015-48682
View Paper titled, Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures
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Topics: Design, Heat pumps, Temperature, Cooling, Heat, Heat sinks, Diluents, Energy generation, Reservoirs, Computer cooling
Proceedings Papers

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

Ru Han, Milena Vujosevic, Min Pei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A038, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48578
https://doi.org/10.1115/IPACK2015-48578
View Paper titled, Physics Based Requirements for Qualification of BGA Components in Temperature Cycling
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Topics: Ball-Grid-Array packaging, Physics, Temperature, Adhesives, Package on package, Deformation, Reliability, Solder joints, Computer simulation, Damage
Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

James W. VanGilder, Xuanhang (Simon) Zhang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48432
https://doi.org/10.1115/IPACK2015-48432
View Paper titled, Development of a Raised-Floor Plenum Design Tool
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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage
Proceedings Papers

Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A068, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48316
https://doi.org/10.1115/IPACK2015-48316
View Paper titled, Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages
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Topics: Experimental characterization, Heat transfer, Complementary metal oxide semiconductors, Cooling, Epoxy adhesives, Epoxy resins, Heating, Thermal conductivity, Thermal properties, Thermal resistance
Proceedings Papers

Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation

Kazuaki Yazawa, Stephen D. Heister, Timothy S. Fisher
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A081, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48692
https://doi.org/10.1115/IPACK2015-48692
View Paper titled, Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation
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Topics: Energy generation, Heat transfer, Optimization, Flow (Dynamics), Fluids, Design, Temperature, Heat exchangers, Generators, Orifices
Proceedings Papers

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Sohail R. Reddy, George S. Dulikravich
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48346
https://doi.org/10.1115/IPACK2015-48346
View Paper titled, Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature
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Topics: Coolants, Cooling, Design, Temperature, Heat, Heat flux, Fluids, Flux (Metallurgy), Airfoils, Computer cooling
Proceedings Papers

Analytic Optimization of Cost Effective Thermoelectric Generation on Top of Rankine Cycle

Kazuaki Yazawa, Yee Rui Koh, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73195
https://doi.org/10.1115/IPACK2013-73195
View Paper titled, Analytic Optimization of Cost Effective Thermoelectric Generation on Top of Rankine Cycle
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Topics: Optimization, Rankine cycle, Generators, Temperature, Design, Steam, Carbon dioxide, Fuel efficiency, Steam turbines, Climate change
Proceedings Papers

Highly Manufacturable and Reliable CZT Detectors

Bill Burdick, Jeff Erlbaum, Kaustubh Nagarkar, Brian Yanoff, Liang Yin, Raj Bahadur, Esmaeil Heidari, Donna Sherman, James E. Simpson
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73314
https://doi.org/10.1115/IPACK2013-73314
View Paper titled, Highly Manufacturable and Reliable CZT Detectors
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Topics: Sensors, Reliability, Design, Finite element model, Manufacturing, Packaging, Radiation detectors, Semiconductors (Materials), Accelerated life testing, Ceramics
Proceedings Papers

New Method for Evaluating Heat Transfer Material

Yasuhiro Saito, Hiroyuki Emoto, Yuuki Tuji, Takanori Komuro
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73051
https://doi.org/10.1115/IPACK2013-73051
View Paper titled, New Method for Evaluating Heat Transfer Material
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Topics: Heat transfer, Pressure, Aluminum plate, Heat sinks, Thermal conductivity, Shapes, Flow (Dynamics), Insulation, Machinery, Reliability
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73214
https://doi.org/10.1115/IPACK2013-73214
View Paper titled, Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement
Proceedings Papers

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

Frank Fan Wang
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A047, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73262
https://doi.org/10.1115/IPACK2013-73262
View Paper titled, Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation
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Topics: Aerospace industry, Design, Electronics, Fluids, Cooling, Computational fluid dynamics, Computer software, Pressure drop, Computers, Dimensions
Proceedings Papers

Design of Cost-Effective Water-Cooled Pinfin Heatsinks

Keisuke Horiuchi, Atsuo Nishihara, Kazuyuki Sugimura
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A041, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73194
https://doi.org/10.1115/IPACK2013-73194
View Paper titled, Design of Cost-Effective Water-Cooled Pinfin Heatsinks
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Topics: Design, Water, Heat transfer, Pressure drop, Optimization, Pareto optimization, Tradeoffs
Proceedings Papers

Energy Modeling of Air-Cooled Data Centers: Part II—The Effect of Recirculation on the Energy Optimization of Open-Aisle, Air-Cooled Data Centers

Dustin W. Demetriou, H. Ezzat Khalifa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 395-404, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52004
https://doi.org/10.1115/IPACK2011-52004
View Paper titled, Energy Modeling of Air-Cooled Data Centers: Part II—The Effect of Recirculation on the Energy Optimization of Open-Aisle, Air-Cooled Data Centers
Open the PDF for Energy Modeling of Air-Cooled Data Centers: Part II—The Effect of Recirculation on the Energy Optimization of Open-Aisle, Air-Cooled Data Centers in another window
Topics: Data centers, Modeling, Optimization, Cooling, Temperature, Energy consumption, Air flow, Flow (Dynamics), High temperature, Temperature nonunifomity
Proceedings Papers

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 553-563, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52141
https://doi.org/10.1115/IPACK2011-52141
View Paper titled, Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency
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Topics: Data centers, Energy efficiency, Uncertainty, Stress, Temperature, Design, Experimental analysis, Flow (Dynamics), Air flow, Compressors