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Proceedings Papers

Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity

Bidzina Kekelia, J. Emily Cousineau, Rajneesh Chaudhary, Jeff Tomerlin, Sreekant Narumanchi, Vandana Rallabandi, Jon Wilkins, Shajjad Chowdhury, Himel Barua, Mostak Mohammad, Burak Ozpineci
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141631
https://doi.org/10.1115/IPACK2024-141631
View Paper titled, Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity
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Topics: Cavities, Cooling, Electric motors, Electronics, Engines, Motors, Rotors, Thermal management, Traction
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
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Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

Josef Frankhouse, Jackson Marsh, Han Hu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111922
https://doi.org/10.1115/IPACK2023-111922
View Paper titled, Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors
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Topics: Acoustic emissions, Condition monitoring, Semiconductors (Materials), Sensors, Electric vertical take-off and landing aircraft, Electronics, Aircraft, Density, Electric vehicles, Electromagnetic interference
Proceedings Papers

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Nikhil R. Lakhkar
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68870
https://doi.org/10.1115/IPACK2021-68870
View Paper titled, Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications
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Topics: Cooling, Design, Electric vehicles, Hybrid electric vehicles, Vehicles, Compressors, Batteries, Electrification, HVAC equipment, Internal combustion engines
Proceedings Papers

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2524
https://doi.org/10.1115/IPACK2020-2524
View Paper titled, Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles
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Topics: Electric vehicles, Thermal management, Traction, Electronics, Machinery, Cooling, Cooling systems, Engines, Finite element analysis, Fluids
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A016, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6443
https://doi.org/10.1115/IPACK2019-6443
View Paper titled, Comparative Study on Power Module Architectures for Modularity and Scalability
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Topics: Architecture, Electric vehicles, Silicon, Electronics, Hybrid electric vehicles, Carbon, Cooling, Design, Emissions, Energy gap
Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6429
https://doi.org/10.1115/IPACK2019-6429
View Paper titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles
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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles
Proceedings Papers

Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters

Bakhtiyar Mohammad Nafis, Ange Iradukunda, David Huitink
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8280
https://doi.org/10.1115/IPACK2018-8280
View Paper titled, Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters
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Topics: Design, Electric vehicles, Reliability, Traction, Temperature, Cooling, Roads, Temperature profiles, Batteries, Electric motors
Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74208
https://doi.org/10.1115/IPACK2017-74208
View Paper titled, Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
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Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles
Proceedings Papers

Challenges in 3D Printing of High Conductivity Copper

Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74306
https://doi.org/10.1115/IPACK2017-74306
View Paper titled, Challenges in 3D Printing of High Conductivity Copper
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Topics: Additive manufacturing, Copper, Electrical conductivity, Thermal conductivity, Engines, Motors, Electromagnetic induction, Machinery, Aerospace industry, Electric vehicles
Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48382
https://doi.org/10.1115/IPACK2015-48382
View Paper titled, Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management
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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems
Proceedings Papers

System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles

Kraig J. Olejniczak, Tom Flint, David Simco, Sergei Storkov, Brad McGee, Kenny George, Peter Killeen, Austin Curbow, Robert S. Shaw, Brandon Passmore, Ty R. McNutt
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48602
https://doi.org/10.1115/IPACK2015-48602
View Paper titled, System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles
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Topics: Energy gap, Packaging, Traction, Vehicles, Silicon, Reliability, Capacitors, Cooling, High temperature, Junctions
Proceedings Papers

Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing

Richard Barnett, Dave Thomas, Oliver Ansell
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48749
https://doi.org/10.1115/IPACK2015-48749
View Paper titled, Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing
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Topics: Blades, Damage, Flow (Dynamics), Lasers, Plasma etching, Plasmas (Ionized gases), Reliability, Semiconductor wafers, Traction
Proceedings Papers

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48709
https://doi.org/10.1115/IPACK2015-48709
View Paper titled, Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation
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Topics: Durability, Electronic components, Excitation, Testing, Circuits, Printed circuit boards, Degrees of freedom, Dynamics (Mechanics), Vibration, Damage
Proceedings Papers

On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader, Thomas J. Breen, Ed J. Walsh, Jeff Punch
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 541-551, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52140
https://doi.org/10.1115/IPACK2011-52140
View Paper titled, On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures
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Topics: Energy efficiency, Data centers, Energy consumption, Traction
Proceedings Papers

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

Pradeep Lall, Prashant Gupta, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 857-871, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89298
https://doi.org/10.1115/InterPACK2009-89298
View Paper titled, Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration
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Topics: Electronics, Shock (Mechanics), Vibration, Failure, Damage, Solders, Principal component analysis, Failure mechanisms, Fracture (Process), Alloys
Proceedings Papers

Effective Thermal Management of Data Centers Using Efficient Cabinet Designs

Veerendra Mulay, Dereje Agonafer, Gary Irwin, Darshan Patell
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 993-999, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89351
https://doi.org/10.1115/InterPACK2009-89351
View Paper titled, Effective Thermal Management of Data Centers Using Efficient Cabinet Designs
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Topics: Data centers, Thermal management, Energy consumption, Design, Combined heat and power, Cooling, Environmental Protection Agency, Exhaust systems, Heat, Stress