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Proceedings Papers

Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics

Janhavi Giri, Attila Lengyel
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111525
https://doi.org/10.1115/IPACK2023-111525
View Paper titled, Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics
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Topics: Machine learning, Manufacturing, Semiconductor wafers, Topology
Proceedings Papers

Additively Manufactured Liquid-Cooled Heat Sink: Gyroid-Based Design, Fabrication, and Testing

Adrian Jourdan, Alexander Sarvadi, Hector R. Siller, Huseyin Bostanci
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97476
https://doi.org/10.1115/IPACK2022-97476
View Paper titled, Additively Manufactured Liquid-Cooled Heat Sink: Gyroid-Based Design, Fabrication, and Testing
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Topics: Additive manufacturing, Design, Heat sinks, Manufacturing, Testing, Topology
Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-98066
https://doi.org/10.1115/IPACK2022-98066
View Paper titled, Topology Optimization of Heat Sink for 3d Integrated Power Converters
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Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration
Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94052
https://doi.org/10.1115/IPACK2022-94052
View Paper titled, Additive Manufacturing of Electronic Patterns for Harsh Environments
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem

Chun Wang, Xiaoguang Sun, Jun Zhang, Nishi Ahuja
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74033
https://doi.org/10.1115/IPACK2017-74033
View Paper titled, An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem
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Topics: Batteries, Design, Data centers, Energy efficiency, Energy consumption, Data collection, Design methodology, Lead-acid batteries, Optimization, Topology
Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48027
https://doi.org/10.1115/IPACK2015-48027
View Paper titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
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Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling
Proceedings Papers

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48427
https://doi.org/10.1115/IPACK2015-48427
View Paper titled, Lid-Integral Cold Plate Topology Integration, Performance, and Reliability
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Topics: Reliability, Topology, Silicon, Packaging, Composite materials, Cooling, Finite element model, Fracture (Materials), Fracture (Process), Gaskets
Proceedings Papers

Experimental Investigation of the Thermal Performance of a Manifold Hierarchical Microchannel Cold Plate

Ercan M. Dede
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 59-67, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52023
https://doi.org/10.1115/IPACK2011-52023
View Paper titled, Experimental Investigation of the Thermal Performance of a Manifold Hierarchical Microchannel Cold Plate
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Topics: Manifolds, Microchannels, Flat plates, Pressure drop, Heat transfer, Optimization, Pressure, Temperature, Thermal resistance, Thermofluids
Proceedings Papers

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

Chang Yong Ha, Soo Il Lee
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 179-184, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52100
https://doi.org/10.1115/IPACK2011-52100
View Paper titled, Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging
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Topics: Bonding, Integrated circuits, Optimization, Packaging, Topology, Design, Modal assurance criterion, Vibration, Errors, Finite element model
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89092
https://doi.org/10.1115/InterPACK2009-89092
View Paper titled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization
Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89232
https://doi.org/10.1115/InterPACK2009-89232
View Paper titled, Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package
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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation
Proceedings Papers

Flat Tree Networks

P. Khanduri, A. Wood, D. Cohen, I. Birkeli, F. Sem-Jacobsen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 49-55, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89336
https://doi.org/10.1115/InterPACK2009-89336
View Paper titled, Flat Tree Networks
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Topics: Packaging, Signals, Switches, Textiles, Topology
Proceedings Papers

Nodal Topology in Compact Thermal Models

D. H. Greisen, V. P. Manno
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 637-643, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33425
https://doi.org/10.1115/IPACK2007-33425
View Paper titled, Nodal Topology in Compact Thermal Models
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Topics: Ball-Grid-Array packages, Boundary-value problems, Design, Electronic packages, Errors, Heat flux, Heat transfer coefficients, Mechanical admittance, Topology
Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33335
https://doi.org/10.1115/IPACK2007-33335
View Paper titled, A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication
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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation
Proceedings Papers

Shape Prediction of Molten Micro-Solder Joints Using Particle Method and Application to Evaluation of Fracture Life

Hisashi Tanie
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 87-94, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33319
https://doi.org/10.1115/IPACK2007-33319
View Paper titled, Shape Prediction of Molten Micro-Solder Joints Using Particle Method and Application to Evaluation of Fracture Life
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Topics: Fracture (Materials), Particulate matter, Shapes, Solders, Crack propagation, Topology, Deformation, Lead-free solders, Solder joints, Finite element analysis
Proceedings Papers

Thermal Characterization of Dual-Core Processor in Computer Equipment

Manoj Nagulapally, Gamal Refai-Ahmed
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 487-491, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73365
https://doi.org/10.1115/IPACK2005-73365
View Paper titled, Thermal Characterization of Dual-Core Processor in Computer Equipment
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Topics: Agglomeration (Materials), Boundary-value problems, Computational fluid dynamics, Computers, Energy conservation, Engineering simulation, Network models, Physics, Simulation, Simulation results
Proceedings Papers

A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components

Andrew S. Glista, Jr., John Nahvi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 621-628, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35062
https://doi.org/10.1115/IPACK2003-35062
View Paper titled, A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components
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Topics: Military aircraft, Waves, Fibers, Aircraft, Cables, Design, Flight, Testing, Signals, Aerospace industry