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Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

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Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6514
https://doi.org/10.1115/IPACK2019-6514
View Paper titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)
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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

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Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

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Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74339
https://doi.org/10.1115/IPACK2017-74339
View Paper titled, Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles
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Topics: Design, Tiles, Air flow, Computational fluid dynamics, Containment, Cooling, Data centers, Density, Engineering simulation, Flow (Dynamics)
Proceedings Papers

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

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Jayati D. Athavale, Yogendra Joshi, Minami Yoda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74108
https://doi.org/10.1115/IPACK2017-74108
View Paper titled, Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Cooling, Temperature, Fans, Pressure, Actuators, Air conditioning
Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

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Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48244
https://doi.org/10.1115/IPACK2015-48244
View Paper titled, Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet
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Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics
Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

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James W. VanGilder, Xuanhang (Simon) Zhang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48432
https://doi.org/10.1115/IPACK2015-48432
View Paper titled, Development of a Raised-Floor Plenum Design Tool
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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage
Proceedings Papers

Creating a Calibrated CFD Model of a Midsize Data Center

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Zachary M. Pardey, James W. VanGilder, Christopher M. Healey, David W. Plamondon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A029, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48448
https://doi.org/10.1115/IPACK2015-48448
View Paper titled, Creating a Calibrated CFD Model of a Midsize Data Center
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Topics: Computational fluid dynamics, Data centers, Modeling, Tiles, Air flow, Boundary-value problems, Calibration, Change management, Design, Flow (Dynamics)
Proceedings Papers

The Effectiveness of Data Center Overhead Cooling in Steady and Transient Scenarios: Comparison of Downward Flow to a Cold Aisle Versus Upward Flow From a Hot Aisle

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Luis Silva-Llanca, Marcelo del Valle, Alfonso Ortega
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48423
https://doi.org/10.1115/IPACK2015-48423
View Paper titled, The Effectiveness of Data Center Overhead Cooling in Steady and Transient Scenarios: Comparison of Downward Flow to a Cold Aisle Versus Upward Flow From a Hot Aisle
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Topics: Cooling, Data centers, Flow (Dynamics), Transients (Dynamics), Heat exchangers, Cooling systems, Air flow, Energy efficiency, Pressure drop, Temperature
Proceedings Papers

Perforated Tile Airflow Prediction: A Comparison of RANS CFD, Fast Fluid Dynamics, and Potential Flow Modeling

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Christopher M. Healey, James W. VanGilder, Zachary M. Pardey
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48424
https://doi.org/10.1115/IPACK2015-48424
View Paper titled, Perforated Tile Airflow Prediction: A Comparison of RANS CFD, Fast Fluid Dynamics, and Potential Flow Modeling
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Topics: Air flow, Computational fluid dynamics, Flow (Dynamics), Fluid dynamics, Modeling, Reynolds-averaged Navier–Stokes equations, Tiles, Data centers, Buoyancy, Friction
Proceedings Papers

Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model

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Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Mark Seymour, Ken Schneebeli, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48234
https://doi.org/10.1115/IPACK2015-48234
View Paper titled, Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model
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Topics: Data centers, Flow (Dynamics), Modeling, Computational fluid dynamics, Pressure, Tiles, Boundary-value problems, Cooling, Dimensions, Ducts
Proceedings Papers

Arcing and Spacing Requirements for High Voltage Printed Circuit Boards

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Prabjit Singh
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48180
https://doi.org/10.1115/IPACK2015-48180
View Paper titled, Arcing and Spacing Requirements for High Voltage Printed Circuit Boards
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Topics: Cellulosic fibers, Circuits, Coating processes, Coatings, Dust, Electric potential, Gates (Closures), Hardware, MOSFET transistors, Physics
Proceedings Papers

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

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Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48237
https://doi.org/10.1115/IPACK2015-48237
View Paper titled, Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves
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Topics: Cooling, Steady state, Transients (Dynamics), Data centers, Containment, Air flow, Coolers, Failure, Flow (Dynamics), Computational fluid dynamics
Proceedings Papers

Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center

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Sami A. Alkharabsheh, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73216
https://doi.org/10.1115/IPACK2013-73216
View Paper titled, Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center
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Topics: Containment, Data centers, Flow (Dynamics), Leakage, Temperature, Containment systems, Air flow, Approximation, Buoyancy, Computational fluid dynamics
Proceedings Papers

A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers

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Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael Ellsworth, Milnes David, Roger Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73217
https://doi.org/10.1115/IPACK2013-73217
View Paper titled, A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers
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Topics: Data centers, Steady state, Flow (Dynamics), Temperature, Buoyancy, Dynamic models, Energy dissipation, Failure, Air flow, Approximation
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

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Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73214
https://doi.org/10.1115/IPACK2013-73214
View Paper titled, Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement
Proceedings Papers

Evaluation of a Data Center Recirculation Non-Uniformity Metric Using Computational Fluid Dynamics

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Dustin W. Demetriou, H. Ezzat Khalifa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 405-414, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52005
https://doi.org/10.1115/IPACK2011-52005
View Paper titled, Evaluation of a Data Center Recirculation Non-Uniformity Metric Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Data centers, Temperature, Buoyancy, Flow (Dynamics), Tiles, Engineering simulation, Simulation, Cooling, Energy consumption
Proceedings Papers

Cold Aisle Air Distribution in a Raised Floor Data Center With Heterogeneous Opposing Orientation Racks

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Pramod Kumar, Yogendra Joshi, Michael K. Patterson, Robin Steinbrecher, Marissa Mena
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 497-504, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52117
https://doi.org/10.1115/IPACK2011-52117
View Paper titled, Cold Aisle Air Distribution in a Raised Floor Data Center With Heterogeneous Opposing Orientation Racks
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Topics: Data centers, Air flow, Heat, Stress, Tiles, Air conditioning, Computers, Density, Flow (Dynamics), Particulate matter
Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

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Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52166
https://doi.org/10.1115/IPACK2011-52166
View Paper titled, Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure
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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow
Proceedings Papers

The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow

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James W. VanGilder, Zachary R. Sheffer, Xuanhang Simon Zhang, Collyn T. O’Kane
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 505-510, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52127
https://doi.org/10.1115/IPACK2011-52127
View Paper titled, The Effect of Under-Floor Obstructions on Data Center Perforated Tile Airflow
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Topics: Air flow, Data centers, Tiles, Cooling, Architecture, Computational fluid dynamics, Design, Flow (Dynamics), Leakage, Modeling
Proceedings Papers

A Data Center Environmental Advisory System

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Christopher Hoover, Niru Kumari, Carlos Felix, Cullen Bash
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 511-517, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52128
https://doi.org/10.1115/IPACK2011-52128
View Paper titled, A Data Center Environmental Advisory System
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Topics: Data centers, Cooling, Air conditioners, Computers, Geometry, Stress, Temperature, Tiles, Vents