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Proceedings Papers

Thermodynamic Modeling of Data Center Cooling Systems

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A. P. Wemhoff, M. del Valle, K. Abbasi, A. Ortega
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73116
https://doi.org/10.1115/IPACK2013-73116
View Paper titled, Thermodynamic Modeling of Data Center Cooling Systems
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Topics: Cooling systems, Data centers, Modeling, Flow (Dynamics), Air conditioning, Air flow, Design, Exergy, Fluid mechanics, Heat transfer
Proceedings Papers

Energy Conversion Efficiency of Synthetic Jets

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Ri Li, Rajdeep Sharma, Mehmet Arik
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 115-122, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52034
https://doi.org/10.1115/IPACK2011-52034
View Paper titled, Energy Conversion Efficiency of Synthetic Jets
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Topics: Energy conversion, Jets, Electricity (Physics), Energy efficiency, Signals, Actuators, Air flow, Design, Piezoelectric actuators, Cooling
Proceedings Papers

Predicting Crack Growth and Fatigue Lives of QFN Solder Joints Using a Multiscale Fracture Model

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Dennis Chan, Dhruv Bhate, Ganesh Subbarayan, Jeff Zhao, Darvin Edwards
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 207-213, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89403
https://doi.org/10.1115/InterPACK2009-89403
View Paper titled, Predicting Crack Growth and Fatigue Lives of QFN Solder Joints Using a Multiscale Fracture Model
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Topics: Fatigue, Fracture (Materials), Solder joints, Solders, Geometry, Creep, Failure, Finite element model, Plasticity, Probability
Proceedings Papers

A Multiscale Damage Accumulation Theory for Solder Joint Failure

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Dhruv Bhate, Kaushik Mysore, Ganesh Subbarayan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 191-197, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89399
https://doi.org/10.1115/InterPACK2009-89399
View Paper titled, A Multiscale Damage Accumulation Theory for Solder Joint Failure
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Topics: Damage, Failure, Solder joints, Fracture (Materials), Alloys, Energy dissipation, Thermodynamics, Brittleness, Microscopes, Plasticity
Proceedings Papers

Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory

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Dennis Chan, Dhruv Bhate, Ganesh Subbarayan, Luu Nguyen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 199-205, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89402
https://doi.org/10.1115/InterPACK2009-89402
View Paper titled, Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory
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Topics: Fracture (Materials), Cycles, Failure analysis, Finite element model, Geometry, Solder joints, Solders, Computer software, Corners (Structural elements), Creep
Proceedings Papers

Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

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Ali Heydari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 859-870, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33848
https://doi.org/10.1115/IPACK2007-33848
View Paper titled, Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems
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Topics: Cooling, Cooling systems, Data centers, Energy efficiency, Modeling, Thermodynamics, Heat exchangers, Computational fluid dynamics, Refrigeration, Density