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Proceedings Papers

Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

Michael Shanks, Uduak Inyang-Udoh, Neera Jain
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111816
https://doi.org/10.1115/IPACK2023-111816
View Paper titled, Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage
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Topics: Thermal energy storage, Thermal management, Transients (Dynamics), Control equipment, Heat, Simulation, Architecture, Computer cooling, Feedback, Fluids
Proceedings Papers

Module-Level TIM Degradation in HALT

Joshua Tompkins, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69511
https://doi.org/10.1115/IPACK2021-69511
View Paper titled, Module-Level TIM Degradation in HALT
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Topics: Aluminum, Cooling, Cycles, Electronics, Energy dissipation, Heating, Junctions, Life testing, Maintenance, Random vibration
Proceedings Papers

Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples

Takashi Fukue, Koichi Hirasawa
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69101
https://doi.org/10.1115/IPACK2021-69101
View Paper titled, Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples
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Topics: Measurement uncertainty, Temperature, Thermocouples, Temperature measurement, Electrical components, Evaluation methods, Heat, Heat transfer, Uncertainty
Proceedings Papers

Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples

Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48641
https://doi.org/10.1115/IPACK2015-48641
View Paper titled, Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples
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Topics: Heat, Temperature, Thermocouples, Heat sinks, Temperature distribution, Approximation, Errors, Heat conduction, Heat transfer coefficients, Springs
Proceedings Papers

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

Yasushi Koito, Hiroyuki Maehara, Daisuke Shimada, Toshio Tomimura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A028, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48308
https://doi.org/10.1115/IPACK2015-48308
View Paper titled, A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)
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Topics: Heat, Heat pipes, Heat transfer, Thermal conductivity, Water, Circuits, Condensers (steam plant), Copper powders, Dimensions, Fluids
Proceedings Papers

Fabrication of a Vapor Chamber on a Plastic Board

Fumihiko Hideyama, Shuto Nonoshita, Yasushi Koito, Toshio Tomimura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A029, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48554
https://doi.org/10.1115/IPACK2015-48554
View Paper titled, Fabrication of a Vapor Chamber on a Plastic Board
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Topics: Manufacturing, Vapors, Heat transfer, Cooling, Heat, Fluids, Water, Condensers (steam plant), Copper powders, Flat heat pipes
Proceedings Papers

Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow

David M. Sykes, Andrew L. Carpenter, Gregory S. Cole
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A044, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73204
https://doi.org/10.1115/IPACK2013-73204
View Paper titled, Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow
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Topics: Boiling, Flow (Dynamics), Jets, Subcooling, Heat transfer coefficients, Heat transfer, Microchannels, Momentum, Wall temperature, Boundary layers
Proceedings Papers

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A024, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73106
https://doi.org/10.1115/IPACK2013-73106
View Paper titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
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Topics: Copper, Foams (Chemistry), Evaporation, Computer cooling, Containers, Ethanol, Flux (Metallurgy), Heat, Heat conduction, Heat pipes
Proceedings Papers

Fabrication of Heat Pipes on an Acrylic Resin Board

Yasushi Koito, Hiroyuki Maehara, Toshio Tomimura
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A050, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73277
https://doi.org/10.1115/IPACK2013-73277
View Paper titled, Fabrication of Heat Pipes on an Acrylic Resin Board
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Topics: Heat pipes, Manufacturing, Resins, Heat transfer, Electrical wires, Fluids, Thermal conductivity, Water, Condensers (steam plant), Gravity (Force)
Proceedings Papers

Thermal Characterization of Non-Isolated DC to DC Convertor

Shiladitya Chakravorty, Bahgat Sammakia, Varaprasad Calmidi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 203-212, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52121
https://doi.org/10.1115/IPACK2011-52121
View Paper titled, Thermal Characterization of Non-Isolated DC to DC Convertor
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Topics: Thermal characterization, Energy dissipation, Computational fluid dynamics, Air flow, Design, Inductors, Insulation, Semiconductor devices, Stress, Temperature
Proceedings Papers

Enhancement of Condensation Heat Transfer in Micro Systems

Atsushi Tokunaga, Gyoko Nagayama, Takaharu Tsuruta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 599-605, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89234
https://doi.org/10.1115/InterPACK2009-89234
View Paper titled, Enhancement of Condensation Heat Transfer in Micro Systems
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Topics: Condensation, Heat transfer, Microelectromechanical systems, Thermal management, Computers, Condensers (steam plant), Cooling, Cooling systems, Electronic components, Electronics
Proceedings Papers

Improving Flow Circulation in Heat Sinks Using Quadrupole Vortices

Timothy J. Dake, Joseph Majdalani
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 463-470, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89211
https://doi.org/10.1115/InterPACK2009-89211
View Paper titled, Improving Flow Circulation in Heat Sinks Using Quadrupole Vortices
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Topics: Flow (Dynamics), Heat sinks, Vortices, Generators, Heat transfer, Shapes, Boundary layers, Design, Dynamic light scattering, Fins
Proceedings Papers

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

Pin-Chuan Chen, Michael W. Mitchell, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 129-135, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33330
https://doi.org/10.1115/IPACK2007-33330
View Paper titled, Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)
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Topics: Chain, Flow (Dynamics), Temperature, Temperature distribution, Biomedical microelectromechanical systems, Liquid crystals, Copper, Thermal management, Thermocouples, Thin films
Proceedings Papers

Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes

Anand Kannabiran, Sreekanth Varma Penmatsa, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 945-952, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33963
https://doi.org/10.1115/IPACK2007-33963
View Paper titled, Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes
Open the PDF for Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes in another window
Topics: Finishes, Printed circuit boards, Solders, Tin, Manufacturing, Solder joints, Testing, Design, Intermetallic compounds, Surface mount packaging
Proceedings Papers

Server-Rack Air Flow and Heat Transfer Interactions in Data Centers

S. P. Tan, K. C. Toh, Y. W. Wong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 845-849, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33672
https://doi.org/10.1115/IPACK2007-33672
View Paper titled, Server-Rack Air Flow and Heat Transfer Interactions in Data Centers
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Topics: Air flow, Data centers, Heat transfer, Server racks, Flow (Dynamics), Pressure, Modeling, Temperature, Approximation, Design
Proceedings Papers

Theta_JC Metrology Development: Fixture Design Modeling

Michael Butch M. Dizon, Suzana Prstic, Sung-Won Moon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 569-576, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73405
https://doi.org/10.1115/IPACK2005-73405
View Paper titled, Theta_JC Metrology Development: Fixture Design Modeling
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Topics: Design, Metrology, Modeling, Errors, Computational fluid dynamics, Heat losses, Insulation, Junctions, Temperature, Cavities
Proceedings Papers

The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows

Masaru Ishizuka, Shinji Nakagawa, Toru Honma
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 11-18, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73011
https://doi.org/10.1115/IPACK2005-73011
View Paper titled, The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows
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Topics: Air flow, Heat sinks, Mixed convection, Temperature, Convection, Design, Specific heat, Wind tunnels, Cooling, Forced convection
Proceedings Papers

Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes

Eiichi Aoyama, Hisaya Kondou, Ryu Minagi, Tsutao Katayama, Toshiki Hirogaki, Hisahiro Inoue
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 317-323, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35086
https://doi.org/10.1115/IPACK2003-35086
View Paper titled, Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes
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Topics: Drilling, Lasers, Temperature, Circuits, Printed circuit boards, Copper foil, Heat, Absorption, Damage, Finite element methods
Proceedings Papers

Design of Micro-Arrayed Thin Film Thermocouples (TFTC)

Jong-Jin Park, Minoru Taya
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 213-217, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35040
https://doi.org/10.1115/IPACK2003-35040
View Paper titled, Design of Micro-Arrayed Thin Film Thermocouples (TFTC)
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Topics: Design, Thermocouples, Thin films, Copper, Aluminum, Bulk solids, Semiconductor wafers, Simulation, Heat conduction, Junctions
Proceedings Papers

Temperature Measurement by Using Metal Thin Film Thermocouples

Koji Miyazaki, Hiroshi Tsukamoto, Takahiro Miike, Toshiaki Takamiya
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 219-223, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35042
https://doi.org/10.1115/IPACK2003-35042
View Paper titled, Temperature Measurement by Using Metal Thin Film Thermocouples
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Topics: Metals, Temperature measurement, Thermocouples, Thin films, Electrons, Glass, Junctions, Diffusion (Physics), Dimensions, Film thickness