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Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Paper No: IPACK2018-8311
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 27–30, 2018
Paper No: IPACK2018-8350
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 27–30, 2018
Paper No: IPACK2018-8294
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 29–September 1, 2017
Paper No: IPACK2017-74181
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 29–September 1, 2017
Paper No: IPACK2017-74184
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017
Paper No: IPACK2017-74118
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 29–September 1, 2017
Paper No: IPACK2017-74095
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 29–September 1, 2017
Paper No: IPACK2017-74015
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 29–September 1, 2017
Paper No: IPACK2017-74132
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A025, August 29–September 1, 2017
Paper No: IPACK2017-74137
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001, July 6–9, 2015
Paper No: IPACK2015-48088
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A006, July 6–9, 2015
Paper No: IPACK2015-48737
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A007, July 6–9, 2015
Paper No: IPACK2015-48671
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A064, July 6–9, 2015
Paper No: IPACK2015-48499
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A052, July 6–9, 2015
Paper No: IPACK2015-48119
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A067, July 6–9, 2015
Paper No: IPACK2015-48104
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015
Paper No: IPACK2015-48685
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A074, July 6–9, 2015
Paper No: IPACK2015-48303
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A079, July 6–9, 2015
Paper No: IPACK2015-48421
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A068, July 6–9, 2015
Paper No: IPACK2015-48316