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Proceedings Papers

Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management

Faramarz Kahbandeh, Daniel Harris, Mehmet Arik
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141130
https://doi.org/10.1115/IPACK2024-141130
View Paper titled, Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management
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Topics: Electronics, Heat transfer, Numerical analysis, Thermal management
Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology

Ali Heydari, Omar Al-Zu'bi, Yaman Manaserh, Ahmad R. Gharaibeh, Russ Tipton, Mehdi Mehrabikermani, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141342
https://doi.org/10.1115/IPACK2024-141342
View Paper titled, Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology
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Topics: Cooling, Data centers, Density, Heat, Refrigerants, Thermal management
Proceedings Papers

Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures

Myriam Bouzidi, Junyoung Kim, Jonathan Goldman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140132
https://doi.org/10.1115/IPACK2024-140132
View Paper titled, Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures
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Topics: Batteries, Electric vehicles, Flexible structures, Thermal management, Temperature, Heat, Cooling, Energy dissipation, Battery life, Coolants
Proceedings Papers

Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity

Bidzina Kekelia, J. Emily Cousineau, Rajneesh Chaudhary, Jeff Tomerlin, Sreekant Narumanchi, Vandana Rallabandi, Jon Wilkins, Shajjad Chowdhury, Himel Barua, Mostak Mohammad, Burak Ozpineci
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141631
https://doi.org/10.1115/IPACK2024-141631
View Paper titled, Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity
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Topics: Cavities, Cooling, Electric motors, Electronics, Engines, Motors, Rotors, Thermal management, Traction
Proceedings Papers

Capillary-Based Two-Phase Cooling for High Power Density Power Electronics

Yujui Lin, Heungdong Kwon, Yini He, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140766
https://doi.org/10.1115/IPACK2024-140766
View Paper titled, Capillary-Based Two-Phase Cooling for High Power Density Power Electronics
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Topics: Cooling, Electronics, Power density, Thermal management
Proceedings Papers

Package-level Evaluation System for 3D Thermal Modelling

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Jonathan Chang
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141509
https://doi.org/10.1115/IPACK2024-141509
View Paper titled, Package-level Evaluation System for 3D Thermal Modelling
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Topics: Heating, Modeling, Thermal management
Proceedings Papers

A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC

David Geb, Subodh Deodhar, Nitin Netake, Tejas Jeurkar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140403
https://doi.org/10.1115/IPACK2024-140403
View Paper titled, A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC
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Topics: Simulation, Thermal management, Cooling, Design, Algorithms, Control equipment, Temperature, Heat, Integrated circuits, Sensors
Proceedings Papers

Enhanced Pool Boiling Heat Transfer Using Re-Entrant Surfaces

Yimin Zhou, Solomon Adera
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141425
https://doi.org/10.1115/IPACK2024-141425
View Paper titled, Enhanced Pool Boiling Heat Transfer Using Re-Entrant Surfaces
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Topics: Heat transfer, Heat transfer coefficients, Nucleate boiling, Pool boiling, Thermal management
Proceedings Papers

Additively Manufactured Cold Plate Integrated With Evaporator Wicks and Phase Separators for Thermal Management of Multiple High-Heat-Flux Heat Sources

Mohammad Reza Shaeri, Maksym Demydovych, Chien-Hua Chen
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A022, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141775
https://doi.org/10.1115/IPACK2024-141775
View Paper titled, Additively Manufactured Cold Plate Integrated With Evaporator Wicks and Phase Separators for Thermal Management of Multiple High-Heat-Flux Heat Sources
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Topics: Additive manufacturing, Cooling, Heat, Thermal management
Proceedings Papers

Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms

Myunghoon Lee, Lindo Arimpoor Pallan Ouseph, Vamsi Krishna Yaddanapudi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141171
https://doi.org/10.1115/IPACK2024-141171
View Paper titled, Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms
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Topics: Computational fluid dynamics, Design, Evolutionary algorithms, Optimization, Workflow, Delays, Energy consumption, Intellectual property, Temperature, Thermal analysis
Proceedings Papers

Additively Manufactured Hybrid Two-Phase Cold Plate

Mohammad Reza Shaeri, Richard Bonner, Jana Catuche
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109991
https://doi.org/10.1115/IPACK2023-109991
View Paper titled, Additively Manufactured Hybrid Two-Phase Cold Plate
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Topics: Additive manufacturing, Cooling, Thermal management
Proceedings Papers

A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling

Satyam Saini, Gautam Gupta, Pratik Bansode, Pardeep Shahi, Vibin Shalom Simon, Himanshu Modi, Dereje Agonafer, Jimil Shah
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112005
https://doi.org/10.1115/IPACK2023-112005
View Paper titled, A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling
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Topics: Cooling, Data centers, Heat sinks, Heat transfer, Mixed convection, Thermal management
Proceedings Papers

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
https://doi.org/10.1115/IPACK2023-111725
View Paper titled, Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
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Topics: Additive manufacturing, Pressure drop, Temperature uniformity, Thermal management, Water, Temperature, Temperature distribution, Heat transfer, Integrated circuits, Laminar flow
Proceedings Papers

Numerical Modeling of Forced Air Convection for Thermal Management in Automotive ECU: A Component and System Level Study

Joseph Oh, Kenneth Taylor
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110688
https://doi.org/10.1115/IPACK2023-110688
View Paper titled, Numerical Modeling of Forced Air Convection for Thermal Management in Automotive ECU: A Component and System Level Study
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Topics: Computer simulation, Convection, Cooling, Heat sinks, Heat transfer, Thermal management
Proceedings Papers

Development of Ceramic Pulsating Heat Pipes for Medium-Voltage Power Electronics

Ramy Abdelmaksoud, Jeffrey Diebold, Sai Kiran Hota, Kuan-Lin Lee, Shivangi Sinha, Dragan Maksimovic
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111917
https://doi.org/10.1115/IPACK2023-111917
View Paper titled, Development of Ceramic Pulsating Heat Pipes for Medium-Voltage Power Electronics
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Topics: Ceramics, Electronics, Heat pipes, Thermal management
Proceedings Papers

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111414
https://doi.org/10.1115/IPACK2023-111414
View Paper titled, Convection Cooling of Power Electronics Operating in Deep-Space
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Topics: Convection, Cooling, Electronics, Forced convection, Thermal management, Rotors, Temperature, Electronic packaging, Fans, Flow (Dynamics)
Proceedings Papers

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Sagar Singh, Mostafa Olyaei, Katherine Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111825
https://doi.org/10.1115/IPACK2023-111825
View Paper titled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
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Topics: Batteries, Cooling, Event history analysis, Thermal management
Proceedings Papers

Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

Michael Shanks, Uduak Inyang-Udoh, Neera Jain
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111816
https://doi.org/10.1115/IPACK2023-111816
View Paper titled, Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage
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Topics: Thermal energy storage, Thermal management, Transients (Dynamics), Control equipment, Heat, Simulation, Architecture, Computer cooling, Feedback, Fluids
Proceedings Papers

Boiling Limit on Textured Oil-Impregnated Surfaces

Yimin Zhou, Solomon Adera
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111736
https://doi.org/10.1115/IPACK2023-111736
View Paper titled, Boiling Limit on Textured Oil-Impregnated Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Pool boiling, Thermal management, Vapors, Heat, Copper, Delays, Failure