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Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Paper No: IPACK2022-97434
DOI: https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
DOI: https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders

Zihao Yuan, Tao Zhang, Jeroen Van Duren, Ayse K. Coskun
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 26–28, 2021
Paper No: IPACK2021-73017
DOI: https://doi.org/10.1115/IPACK2021-73017
View Paper titled, Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders
Click here to open pdf in another window PDF for Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders
Topics: Diamonds, Flat heat pipes, Simulation, Thermal efficiency
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Paper No: IPACK2019-6585
DOI: https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Joseph R. H. Schaadt, Kamran Fouladi, Aaron P. Wemhoff, Joseph G. Pigeon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015
Paper No: IPACK2015-48364
DOI: https://doi.org/10.1115/IPACK2015-48364
View Paper titled, Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling
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Topics: Computer simulation, Data centers, Optimization, Stress, Thermal efficiency, Design, Containment, Computational fluid dynamics, Air conditioning, Flow (Dynamics)
Proceedings Papers

Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs

Xinqiang Xu, Siyi Zhou, Mark Meyers, Bahgat G. Sammakia, Bruce Murray
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Paper No: IPACK2013-73062
DOI: https://doi.org/10.1115/IPACK2013-73062
View Paper titled, Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs
Click here to open pdf in another window PDF for Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs
Topics: Cooling, Electric power generation, Electrical efficiency, Energy budget (Physics), Fatigue life, Flow (Dynamics), Gallium arsenide, Heat, Heat recovery, Heat sinks
Proceedings Papers

Single-Phase Liquid Cooling of a Quad-Core Processor

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 235-245, July 6–8, 2011
Paper No: IPACK2011-52139
DOI: https://doi.org/10.1115/IPACK2011-52139
View Paper titled, Single-Phase Liquid Cooling of a Quad-Core Processor
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Topics: Cooling, Flow (Dynamics), Microchannels, Energy dissipation, Heat, Temperature, Cooling systems, Design, Engineering standards, Failure
Proceedings Papers

Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

Ali Heydari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 859-870, July 8–12, 2007
Paper No: IPACK2007-33848
DOI: https://doi.org/10.1115/IPACK2007-33848
View Paper titled, Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems
Click here to open pdf in another window PDF for Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems
Topics: Cooling, Cooling systems, Data centers, Energy efficiency, Modeling, Thermodynamics, Heat exchangers, Computational fluid dynamics, Refrigeration, Density
Proceedings Papers

Robust Design of Air-Cooled Server Cabinets for Thermal Efficiency

Nathan Rolander, Jeffrey Rambo, Yogendra Joshi, Farrokh Mistree
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1649-1659, July 17–22, 2005
Paper No: IPACK2005-73171
DOI: https://doi.org/10.1115/IPACK2005-73171
View Paper titled, Robust Design of Air-Cooled Server Cabinets for Thermal Efficiency
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Topics: Data centers, Design, Modeling, Thermal efficiency
Proceedings Papers

Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs

John Chia, Charles Yang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 57-61, July 6–11, 2003
Paper No: IPACK2003-35008
DOI: https://doi.org/10.1115/IPACK2003-35008
View Paper titled, Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs
Click here to open pdf in another window PDF for Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs
Topics: Printed circuit boards, Thermal management, Thermal efficiency, Air flow, Computer simulation, Design, Electronics, Energy consumption, Energy dissipation, Pine (Wood product)