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Proceedings Papers

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

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Mahdi Farahikia, Ping-Chuan Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
https://doi.org/10.1115/IPACK2023-111725
View Paper titled, Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
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Topics: Additive manufacturing, Pressure drop, Temperature uniformity, Thermal management, Water, Temperature, Temperature distribution, Heat transfer, Integrated circuits, Laminar flow
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

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Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

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Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders

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Zihao Yuan, Tao Zhang, Jeroen Van Duren, Ayse K. Coskun
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73017
https://doi.org/10.1115/IPACK2021-73017
View Paper titled, Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders
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Topics: Diamonds, Flat heat pipes, Simulation, Thermal efficiency
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

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Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

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Joseph R. H. Schaadt, Kamran Fouladi, Aaron P. Wemhoff, Joseph G. Pigeon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48364
https://doi.org/10.1115/IPACK2015-48364
View Paper titled, Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling
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Topics: Computer simulation, Data centers, Optimization, Stress, Thermal efficiency, Design, Containment, Computational fluid dynamics, Air conditioning, Flow (Dynamics)
Proceedings Papers

Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs

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Xinqiang Xu, Siyi Zhou, Mark Meyers, Bahgat G. Sammakia, Bruce Murray
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73062
https://doi.org/10.1115/IPACK2013-73062
View Paper titled, Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs
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Topics: Cooling, Electric power generation, Electrical efficiency, Energy budget (Physics), Fatigue life, Flow (Dynamics), Gallium arsenide, Heat, Heat recovery, Heat sinks
Proceedings Papers

Single-Phase Liquid Cooling of a Quad-Core Processor

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Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 235-245, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52139
https://doi.org/10.1115/IPACK2011-52139
View Paper titled, Single-Phase Liquid Cooling of a Quad-Core Processor
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Topics: Cooling, Flow (Dynamics), Microchannels, Energy dissipation, Heat, Temperature, Cooling systems, Design, Engineering standards, Failure
Proceedings Papers

Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

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Ali Heydari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 859-870, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33848
https://doi.org/10.1115/IPACK2007-33848
View Paper titled, Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems
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Topics: Cooling, Cooling systems, Data centers, Energy efficiency, Modeling, Thermodynamics, Heat exchangers, Computational fluid dynamics, Refrigeration, Density
Proceedings Papers

Robust Design of Air-Cooled Server Cabinets for Thermal Efficiency

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Nathan Rolander, Jeffrey Rambo, Yogendra Joshi, Farrokh Mistree
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1649-1659, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73171
https://doi.org/10.1115/IPACK2005-73171
View Paper titled, Robust Design of Air-Cooled Server Cabinets for Thermal Efficiency
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Topics: Data centers, Design, Modeling, Thermal efficiency
Proceedings Papers

Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs

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John Chia, Charles Yang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 57-61, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35008
https://doi.org/10.1115/IPACK2003-35008
View Paper titled, Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs
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Topics: Printed circuit boards, Thermal management, Thermal efficiency, Air flow, Computer simulation, Design, Electronics, Energy consumption, Energy dissipation, Pine (Wood product)