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Proceedings Papers
Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
Proceedings Papers
A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
Available to PurchaseAli Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
Proceedings Papers
Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Available to PurchaseHimanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
Proceedings Papers
Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73017
Proceedings Papers
Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
Proceedings Papers
Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48364
Proceedings Papers
Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73062
Proceedings Papers
Single-Phase Liquid Cooling of a Quad-Core Processor
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 235-245, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52139
Proceedings Papers
Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 859-870, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33848
Proceedings Papers
Robust Design of Air-Cooled Server Cabinets for Thermal Efficiency
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1649-1659, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73171
Proceedings Papers
Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 57-61, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35008