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Proceedings Papers

High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape

Kaiying Jiang, Heungdong Kwon, Hansen Qiao, Yini He, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140287
https://doi.org/10.1115/IPACK2024-140287
View Paper titled, High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape
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Topics: Composite materials, Copper, Gallium, Liquid metals, Nanowires, Polydimethylsiloxane, Thermal characterization, Thermal resistance, ASTM International, Contact resistance
Proceedings Papers

Thermal Characterization of Si BEOL Microelectronic Structures

Assaad El Helou, Peter E. Raad, Archana Venugopal, Dhishan Kande
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8350
https://doi.org/10.1115/IPACK2018-8350
View Paper titled, Thermal Characterization of Si BEOL Microelectronic Structures
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Topics: Computer simulation, Design, Dimensions, Heat sinks, Operating temperature, Reliability, Resistors, Temperature, Thermal characterization, Thermal properties
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74149
https://doi.org/10.1115/IPACK2017-74149
View Paper titled, Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Novel Thermal Management of GaN Electronics: Diamond Substrates

Martin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T08A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48145
https://doi.org/10.1115/IPACK2015-48145
View Paper titled, Novel Thermal Management of GaN Electronics: Diamond Substrates
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Topics: Diamonds, Electronics, Gallium nitride, Thermal management, Thermal conductivity, Heat transfer, Junctions, Microwaves, Semiconductor wafers, Temperature
Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73104
https://doi.org/10.1115/IPACK2013-73104
View Paper titled, A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance
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Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature
Proceedings Papers

Thermal Characterization of Non-Isolated DC to DC Convertor

Shiladitya Chakravorty, Bahgat Sammakia, Varaprasad Calmidi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 203-212, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52121
https://doi.org/10.1115/IPACK2011-52121
View Paper titled, Thermal Characterization of Non-Isolated DC to DC Convertor
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Topics: Thermal characterization, Energy dissipation, Computational fluid dynamics, Air flow, Design, Inductors, Insulation, Semiconductor devices, Stress, Temperature
Proceedings Papers

Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity

Wataru Nakayama, Katsuhiro Koizumi, Takashi Fukue, Masaru Ishizuka, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 297-310, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89086
https://doi.org/10.1115/InterPACK2009-89086
View Paper titled, Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity
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Topics: Density, Thermal characterization, Thermal conductivity, Metals, Flow (Dynamics), Heat, Heat conduction, Copper, Electrical wires, Japan Society of Mechanical Engineers
Proceedings Papers

Joint Development of a Package-Level Thermal Interface Material Test System

Yanshu Susan Chen, Stanley Pecavar, Vadim Gektin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 615-618, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89398
https://doi.org/10.1115/InterPACK2009-89398
View Paper titled, Joint Development of a Package-Level Thermal Interface Material Test System
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Topics: ASTM International, Design, Gages, Heat, Junctions, Materials properties, Microelectromechanical systems, Microelectronic devices, Pressure, Stress
Proceedings Papers

Application of Frequency-Domain Thermal Measurements in Electronics Packaging

Yizhang Yang, Zhen Zhang, Maxat Touzelbaev
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 445-451, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89198
https://doi.org/10.1115/InterPACK2009-89198
View Paper titled, Application of Frequency-Domain Thermal Measurements in Electronics Packaging
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Topics: Electronic packaging, Optimization, Packaging, Semiconductor industry, Silicon, Steady state, Thermal characterization
Proceedings Papers

Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures

Xi Wang, Ali Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 293-296, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89084
https://doi.org/10.1115/InterPACK2009-89084
View Paper titled, Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures
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Topics: MOSFET transistors, Temperature, Thermal characterization, Temperature distribution, Gates (Closures), Design, Electrons, Flow (Dynamics), Heat, Phonons
Proceedings Papers

Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module

Y. Ezzahri, R. Singh, K. Fukutani, Z. Bian, A. Shakouri, G. Zeng, J. E. Bowers, J. M. Zide, A. C. Gossard
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 277-281, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33880
https://doi.org/10.1115/IPACK2007-33880
View Paper titled, Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module
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Topics: Thermal characterization, Transients (Dynamics), Electrons, Nanoparticles, Semiconductors (Materials), Crystals, Electromagnetic scattering, Heat, Heat transfer, Metals
Proceedings Papers

Thermal Characterization of Micro-Channels Heat Exchanger for High-End Processors

Khalid Sheltami, Gamal Refai-Ahmed
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 193-197, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33573
https://doi.org/10.1115/IPACK2007-33573
View Paper titled, Thermal Characterization of Micro-Channels Heat Exchanger for High-End Processors
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Topics: Heat exchangers, Microchannels, Thermal characterization, Cooling, Computational fluid dynamics, Engineering simulation, Heat flux, Heat transfer coefficients, Junctions, Semiconductor devices
Proceedings Papers

Experimental Thermal Characterization of Pin Fin Heat Sinks With Top and Side Bypass

Ning Lei, Alfonso Ortega
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 291-298, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73222
https://doi.org/10.1115/IPACK2005-73222
View Paper titled, Experimental Thermal Characterization of Pin Fin Heat Sinks With Top and Side Bypass
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Topics: Heat sinks, Thermal characterization, Clearances (Engineering), Flow (Dynamics), Thermal resistance, Heat transfer coefficients, Aluminum, Heat flux, Pins (Engineering), Temperature
Proceedings Papers

Thermal Characterization and Modeling of Stacked Die Packages

P. Szabo, M. Rencz, V. Sze´kely, A. Poppe, G. Farkas, B. Courtois
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1575-1581, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73437
https://doi.org/10.1115/IPACK2005-73437
View Paper titled, Thermal Characterization and Modeling of Stacked Die Packages
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Topics: Modeling, Steady state, Thermal characterization, Transients (Dynamics)
Proceedings Papers

Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling

Madhusudan Iyengar, Roger Schmidt, Arun Sharma, Gerard McVicker, Saurabh Shrivastava, Sri Sri-Jayantha, Yasuo Amemiya, Hien Dang, Timothy Chainer, Bahgat Sammakia
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 535-543, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73387
https://doi.org/10.1115/IPACK2005-73387
View Paper titled, Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling
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Topics: Computer simulation, Data centers, Thermal characterization
Proceedings Papers

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73196
https://doi.org/10.1115/IPACK2005-73196
View Paper titled, Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning
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Topics: Microelectronic devices, Temperature, Thermal characterization, Thermoreflectance, Reflectance, Silicon, Transients (Dynamics), MOSFET transistors, Resolution (Optics), Calibration
Proceedings Papers

Thermal Characterization of Dual-Core Processor in Computer Equipment

Manoj Nagulapally, Gamal Refai-Ahmed
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 487-491, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73365
https://doi.org/10.1115/IPACK2005-73365
View Paper titled, Thermal Characterization of Dual-Core Processor in Computer Equipment
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Topics: Agglomeration (Materials), Boundary-value problems, Computational fluid dynamics, Computers, Energy conservation, Engineering simulation, Network models, Physics, Simulation, Simulation results
Proceedings Papers

On the Treatment of Circuit Boards as Thermal Two-Ports

Roger P. Stout
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 461-471, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35225
https://doi.org/10.1115/IPACK2003-35225
View Paper titled, On the Treatment of Circuit Boards as Thermal Two-Ports
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Topics: Gates (Closures), Printed circuit boards, Heat, Boundary-value problems, Temperature, Convection, Flow (Dynamics), Geometry, Heat conduction, Heat flux
Proceedings Papers

Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations

Teck Joo Goh, Chia-Pin Chiu, K. N. Seetharamu, G. A. Quadir, Z. A. Zainal
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 323-330, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35142
https://doi.org/10.1115/IPACK2003-35142
View Paper titled, Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations
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Topics: Automotive design, Finite element analysis, Flip-chip, Flip-chip devices, Thermal characterization, Vehicles