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Proceedings Papers

Variable Area Jet Impingement for High Voltage Power Electronics

Reece Whitt, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
https://doi.org/10.1115/IPACK2023-111996
View Paper titled, Variable Area Jet Impingement for High Voltage Power Electronics
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Topics: Electronics, Nozzles, Convection, Coolants, Cooling, Flow (Dynamics), Impingement cooling, Reliability, Temperature, Transients (Dynamics)
Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

Small-Scale Vorticity Induced by a Self-Oscillating Fluttering Reed for Heat Transfer Augmentation in Air Cooled Heat Sinks

Pablo Hidalgo, Ari Glezer
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48511
https://doi.org/10.1115/IPACK2015-48511
View Paper titled, Small-Scale Vorticity Induced by a Self-Oscillating Fluttering Reed for Heat Transfer Augmentation in Air Cooled Heat Sinks
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Topics: Heat sinks, Heat transfer, Vorticity, Flow (Dynamics), Fluids, Heat transfer coefficients, Cooling, Energy dissipation, Fins, Heat flux
Proceedings Papers

CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels

Omer Bugra Kanargi, Christopher Yap, Poh Seng Lee
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A083, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48277
https://doi.org/10.1115/IPACK2015-48277
View Paper titled, CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels
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Topics: Computational fluid dynamics, Heat sinks, Flow (Dynamics), Cross connections, Heat transfer, Pressure, Thermal boundary layers, Air flow, Convection, Design
Proceedings Papers

Laminar Convective Heat Transfer of Alumina-Polyalphaolefin Nanofluids Containing Spherical and Non-Spherical Nanoparticles

Leyuan Yu, Dong Liu, Frank Botz
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 343-355, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52256
https://doi.org/10.1115/IPACK2011-52256
View Paper titled, Laminar Convective Heat Transfer of Alumina-Polyalphaolefin Nanofluids Containing Spherical and Non-Spherical Nanoparticles
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Topics: Convection, Nanofluids, Nanoparticles, Fluids, Heat transfer, Particulate matter, Water, Friction, Laminar flow, Nanorods
Proceedings Papers

Enhanced Microchannel Heat Sinks Using Oblique Fins

Yong-Jiun Lee, Poh-Seng Lee, Siaw-Kiang Chou
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 253-260, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89059
https://doi.org/10.1115/InterPACK2009-89059
View Paper titled, Enhanced Microchannel Heat Sinks Using Oblique Fins
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Topics: Fins, Heat sinks, Microchannels, Heat transfer, Flow (Dynamics), Boundary layers, Fluids, Heat transfer coefficients, Laminar flow, Numerical analysis
Proceedings Papers

Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks

Waqar A. Khan, Michael M. Yovanovich
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 199-209, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33636
https://doi.org/10.1115/IPACK2007-33636
View Paper titled, Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks
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Topics: Fluid dynamics, Heat sinks, Heat transfer, Modeling, Momentum, Viscosity, Boundary-value problems, Flow (Dynamics), Fluids, Forced convection
Proceedings Papers

Thermal Fluid Flow Transport Phenomena in a Channel Containing Slot-Perforated Flat Plates

Shuichi Torii, Wen Jei Yang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 547-554, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33054
https://doi.org/10.1115/IPACK2007-33054
View Paper titled, Thermal Fluid Flow Transport Phenomena in a Channel Containing Slot-Perforated Flat Plates
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Topics: Channel flow, Flat plates, Flow (Dynamics), Fluid dynamics, Fluids, Heat transfer, Laminar flow, Reynolds number, Thermal boundary layers, Thermofluids
Proceedings Papers

Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board

Wataru Nakayama, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 645-652, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33605
https://doi.org/10.1115/IPACK2007-33605
View Paper titled, Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board
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Topics: Heat conduction, Printed circuit boards, Modeling, Temperature, Ball-Grid-Array packages, Composite materials, Computation, Convection, Electronic equipment, Heat transfer
Proceedings Papers

Heat Conduction in Printed Circuit Boards: Part II — Small PCBs Connected to Large Thermal Mass at Their Edge

Wataru Nakayama, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 653-661, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33606
https://doi.org/10.1115/IPACK2007-33606
View Paper titled, Heat Conduction in Printed Circuit Boards: Part II — Small PCBs Connected to Large Thermal Mass at Their Edge
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Topics: Heat conduction, Printed circuit boards, Heat sinks, Convection, Copper, Density, Flow (Dynamics), Heat, Modeling, Numerical analysis