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Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73253
https://doi.org/10.1115/IPACK2021-73253
View Paper titled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
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Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6584
https://doi.org/10.1115/IPACK2019-6584
View Paper titled, Folding-Reliability of Flexible Electronics in Wearable Applications
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Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48247
https://doi.org/10.1115/IPACK2015-48247
View Paper titled, Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
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Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

Keiji Ogawa, Heisaburo Nakagawa, Masatoshi Matsudaira
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89034
https://doi.org/10.1115/InterPACK2009-89034
View Paper titled, Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics
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Topics: Fiber reinforced plastics, Glass, Printed circuit boards, Drilling, Drills (Tools), Surface roughness, Temperature, Circuits, Delamination, Glass fibers
Proceedings Papers

Flat Tree Networks

P. Khanduri, A. Wood, D. Cohen, I. Birkeli, F. Sem-Jacobsen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 49-55, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89336
https://doi.org/10.1115/InterPACK2009-89336
View Paper titled, Flat Tree Networks
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Topics: Packaging, Signals, Switches, Textiles, Topology
Proceedings Papers

Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes

Eiichi Aoyama, Hisaya Kondou, Ryu Minagi, Tsutao Katayama, Toshiki Hirogaki, Hisahiro Inoue
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 317-323, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35086
https://doi.org/10.1115/IPACK2003-35086
View Paper titled, Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes
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Topics: Drilling, Lasers, Temperature, Circuits, Printed circuit boards, Copper foil, Heat, Absorption, Damage, Finite element methods
Proceedings Papers

Through-Hole Drilling Condition of FR-4 Printed Wiring Boards Based on Preventing Ion Migration

Eiichi Aoyama, Hiromichi Nobe, Tadayuki Ikuta, Tsutao Katayama, Toshiki Hirogaki, Hisahiro Inoue, Katsutoshi Yamauchi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 53-59, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35083
https://doi.org/10.1115/IPACK2003-35083
View Paper titled, Through-Hole Drilling Condition of FR-4 Printed Wiring Boards Based on Preventing Ion Migration
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Topics: Drilling, Ion migration, Printed circuit boards, Delamination, Glass, Textiles, Circuits, Insulation, Packaging density (Electronics), Damage
Proceedings Papers

Arbitrarily Configurable Optical Interconnect Fabric for Intrachip Global Communication

Michael W. Haney, Muzammil Iqbal, Michael J. McFadden
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 639-649, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35166
https://doi.org/10.1115/IPACK2003-35166
View Paper titled, Arbitrarily Configurable Optical Interconnect Fabric for Intrachip Global Communication
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Topics: Optical interconnections, Textiles, Metals, Complementary metal oxide semiconductors, Density, Design, Integrated circuits, Silicon, Wire