1-20 of 21
Tensile strength
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework

Available to Purchase

Pradeep Lall, Padmanava Choudhury, Aathi Raja Ram Pandurangan
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112014
https://doi.org/10.1115/IPACK2023-112014
View Paper titled, Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework
Open the PDF for Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework in another window
Topics: Elastic moduli, Glass, Manufacturing, Resins, Stress, Tensile strength
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Available to Purchase

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Open the PDF for Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration in another window
Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

Available to Purchase

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
Open the PDF for Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures in another window
Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Available to Purchase

Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2677
https://doi.org/10.1115/IPACK2020-2677
View Paper titled, Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C
Open the PDF for Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C in another window
Topics: Damage, Design, Elastic moduli, Electronic components, Electronic packaging, Elongation, High temperature, Mechanical properties, Mechanical testing, Operating temperature
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Available to Purchase

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
Open the PDF for Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging in another window
Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

Available to Purchase

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6563
https://doi.org/10.1115/IPACK2019-6563
View Paper titled, Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder
Open the PDF for Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder in another window
Topics: Cycles, Lead-free solders, Stress-strain curves, Tensile strength, Thermal shock
Proceedings Papers

The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

Available to Purchase

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8405
https://doi.org/10.1115/IPACK2018-8405
View Paper titled, The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials
Open the PDF for The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials in another window
Topics: Hardening (Curing), Mechanical behavior, Solder masks, Temperature, Ultraviolet radiation, Creep, Mechanical properties, Elastic moduli, Stress, Tensile testing
Proceedings Papers

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

Available to Purchase

Mohammad S. Alam, K. M. Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A020, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8396
https://doi.org/10.1115/IPACK2018-8396
View Paper titled, Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders
Open the PDF for Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders in another window
Topics: Lead-free solders, Mechanical behavior, Temperature effects, High temperature, Solders, Temperature, Mechanical properties, Alloys, Stress, Tensile strength
Proceedings Papers

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Available to Purchase

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74300
https://doi.org/10.1115/IPACK2017-74300
View Paper titled, Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year
Open the PDF for Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year in another window
Topics: Alloys, Storage, High temperature, Solders, Temperature, Deformation, Electronics, Operating temperature, Constitutive equations, Elastic moduli
Proceedings Papers

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Available to Purchase

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, John L. Evans, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48620
https://doi.org/10.1115/IPACK2015-48620
View Paper titled, FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling
Open the PDF for FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling in another window
Topics: Finite element analysis, Reliability, Failure, Lead-free solders, Temperature, Accelerated life testing, Ball-Grid-Array packaging, Fracture (Materials), Lumber, Modeling
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Available to Purchase

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48389
https://doi.org/10.1115/IPACK2015-48389
View Paper titled, A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures
Open the PDF for A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures in another window
Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

Available to Purchase

Pradeep Lall, Geeta Limaye, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73246
https://doi.org/10.1115/IPACK2013-73246
View Paper titled, Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot
Open the PDF for Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot in another window
Topics: Materials properties, Alloys, Temperature, Tin, Copper, Creep, Design, Elastic moduli, Electronics, Finite element model
Proceedings Papers

Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil

Available to Purchase

Takuya Nagayama, Hiroaki Yoshida, Ikuo Shohji
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73172
https://doi.org/10.1115/IPACK2013-73172
View Paper titled, Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil
Open the PDF for Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil in another window
Topics: Copper foil, Electrolytes, Mechanical properties, Copper, Elastic moduli, Fatigue properties, Grain size, Proteins, Tensile strength
Proceedings Papers

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

Available to Purchase

Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73251
https://doi.org/10.1115/IPACK2013-73251
View Paper titled, Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics
Open the PDF for Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics in another window
Topics: Damage, Electronics, Cycles, Failure, Alloys, Elastic moduli, Electronic systems, Errors, High temperature, Reliability
Proceedings Papers

Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

Available to Purchase

Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara, Fusao Iwase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 667-672, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52025
https://doi.org/10.1115/IPACK2011-52025
View Paper titled, Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application
Open the PDF for Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application in another window
Topics: Aerospace industry, Solders, Tensile strength, Tin, Elongation, Brittleness, Electrodes, Mechanical properties
Proceedings Papers

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

Available to Purchase

Khalid Alzoubi, Susan Lu, Bahgat Sammakia, Mark Poliks
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 27-32, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89247
https://doi.org/10.1115/InterPACK2009-89247
View Paper titled, Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications
Open the PDF for Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications in another window
Topics: Flexible electronics, High cycle fatigue, Metals, Thin films, Unsaturated polyesters, Fracture (Materials), Bulk solids, Electrical resistance, Electronic systems, Failure
Proceedings Papers

Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension

Available to Purchase

Cemal Basaran, Tarek Ragab
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 513-516, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89005
https://doi.org/10.1115/InterPACK2009-89005
View Paper titled, Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension
Open the PDF for Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension in another window
Topics: Carbon, Damage mechanics, Nanotubes, Tension, Stress, Single-walled carbon nanotubes, Boundary-value problems, Computation, Displacement, Molecular dynamics simulation
Proceedings Papers

Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys

Available to Purchase

Yifei Zhang, Zijie Cai, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 959-976, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89373
https://doi.org/10.1115/InterPACK2009-89373
View Paper titled, Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys
Open the PDF for Aging Effects on the Mechanical Behavior and Reliability of SAC Alloys in another window
Topics: Alloys, Mechanical behavior, Reliability, Temperature, Creep, Solders, Lead-free solders, Failure, Silver, Accelerated life testing
Proceedings Papers

Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging

Available to Purchase

Hongtao Ma, Jeffrey C. Suhling, Yifei Zhang, Pradeep Lall, Michael J. Bozack
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 563-579, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33545
https://doi.org/10.1115/IPACK2007-33545
View Paper titled, Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging
Open the PDF for Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging in another window
Topics: Lead-free solders, Temperature, Solders, Creep, Reliability, Solder joints, Alloys, Failure, Mechanical behavior, Mechanical properties
Proceedings Papers

Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films

Available to Purchase

Muneyuki Otani, Kazuhiko Sakutani, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 735-741, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33261
https://doi.org/10.1115/IPACK2007-33261
View Paper titled, Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films
Open the PDF for Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films in another window
Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Young's modulus, Bulk solids, Grain boundaries, Cold rolling, Deformation, Elasticity