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Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

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S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

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Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

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Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6413
https://doi.org/10.1115/IPACK2019-6413
View Paper titled, Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures
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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters

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Bakhtiyar Mohammad Nafis, Ange Iradukunda, David Huitink
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8280
https://doi.org/10.1115/IPACK2018-8280
View Paper titled, Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters
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Topics: Design, Electric vehicles, Reliability, Traction, Temperature, Cooling, Roads, Temperature profiles, Batteries, Electric motors
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

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Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

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Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8456
https://doi.org/10.1115/IPACK2018-8456
View Paper titled, Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

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David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74118
https://doi.org/10.1115/IPACK2017-74118
View Paper titled, Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading
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Topics: Phase change materials, Heat, Silicon nitride ceramics, Temperature, Cooling, Cooling systems, Cycles, Inspection, Optical quality control, Temperature profiles
Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

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Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48051
https://doi.org/10.1115/IPACK2015-48051
View Paper titled, Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature
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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations
Proceedings Papers

Numerical and Experimental Investigation of Shell-and-Tube Phase Change Material Thermal Storage Unit

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Thomas H. Sherer, II, Yogendra Joshi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A051, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48061
https://doi.org/10.1115/IPACK2015-48061
View Paper titled, Numerical and Experimental Investigation of Shell-and-Tube Phase Change Material Thermal Storage Unit
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Topics: Phase change materials, Shells, Thermal energy storage, Temperature, Transients (Dynamics), Enthalpy, Flow (Dynamics), Fluids, Heat transfer, Paraffin wax
Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

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Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48489
https://doi.org/10.1115/IPACK2015-48489
View Paper titled, Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling
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Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits
Proceedings Papers

Thermal Modeling of Remote Radio Head Units

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Manasa Sahini, Betsegaw Gebrehiwot, Dereje Agonafer, Rocky Colapietro
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A087, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48606
https://doi.org/10.1115/IPACK2015-48606
View Paper titled, Thermal Modeling of Remote Radio Head Units
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Topics: Modeling, Air flow, Temperature, Computational fluid dynamics, Cooling, Natural convection, Boundary-value problems, Design, Exhaust systems, Heat
Proceedings Papers

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

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Ru Han, Milena Vujosevic, Min Pei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A038, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48578
https://doi.org/10.1115/IPACK2015-48578
View Paper titled, Physics Based Requirements for Qualification of BGA Components in Temperature Cycling
Open the PDF for Physics Based Requirements for Qualification of BGA Components in Temperature Cycling in another window
Topics: Ball-Grid-Array packaging, Physics, Temperature, Adhesives, Package on package, Deformation, Reliability, Solder joints, Computer simulation, Damage
Proceedings Papers

A Transient Model for Parallel Flow and Counter Flow Heat Exchangers

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K. Abbasi, M. Del Valle, A. P. Wemhoff, A. Ortega
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73118
https://doi.org/10.1115/IPACK2013-73118
View Paper titled, A Transient Model for Parallel Flow and Counter Flow Heat Exchangers
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Topics: Flow (Dynamics), Heat exchangers, Transients (Dynamics), Fluids, Capacitance, Exterior walls, Finite volume methods, Heat conduction, Heat transfer coefficients, Steady state
Proceedings Papers

Fast Thermal Analysis of Vertically Integrated Circuits (3-D ICs) Using Power Blurring Method

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Je-Hyoung Park, Ali Shakouri, Sung-Mo Kang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 701-707, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89072
https://doi.org/10.1115/InterPACK2009-89072
View Paper titled, Fast Thermal Analysis of Vertically Integrated Circuits (3-D ICs) Using Power Blurring Method
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Topics: Complementary metal oxide semiconductors, Computation, Computer software, Design, Energy dissipation, Errors, Finite element analysis, Heat, Integrated circuits, Optimization
Proceedings Papers

A New Methodology for Cold Plate and Heat Sink Optimization

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Jeremy Rice, Monem Alyaser
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 831-840, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89197
https://doi.org/10.1115/InterPACK2009-89197
View Paper titled, A New Methodology for Cold Plate and Heat Sink Optimization
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Topics: Heat sinks, Optimization, Computational fluid dynamics, Anisotropy, Convection, Fins, Fluids, Heat conduction, Heat transfer, Prandtl number
Proceedings Papers

Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove

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C. P. Migliaccio, H. K. Dhavaleswarapu, S. V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 363-370, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89134
https://doi.org/10.1115/InterPACK2009-89134
View Paper titled, Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove
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Topics: Evaporation, Microscale devices, Temperature measurement, Thin films, Quartz, Shapes, Geometry, Heat, Heat flux, Heat transfer
Proceedings Papers

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

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Mohamed-Nabil Sabry
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 187-191, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89415
https://doi.org/10.1115/InterPACK2009-89415
View Paper titled, Predicting Thermal Stresses Induced by Conjugate Heat Transfer
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Topics: Heat transfer, Thermal stresses, Fluids, Design, Heat, Temperature, Temperature profiles, Wall temperature, Boundary-value problems, Degrees of freedom
Proceedings Papers

Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

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Yaoyu Pang, Jie-Hua Zhao, Darvin Edwards
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 379-384, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89169
https://doi.org/10.1115/InterPACK2009-89169
View Paper titled, Effect of Viscoelasticity on Thermalmechanical Stress in Polymers
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Topics: Polymers, Stress, Viscoelasticity, Polymer films, Temperature, Temperature profiles, Thermomechanics
Proceedings Papers

Micro-Raman Thermometry of Laser Heated Surfaces

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Justin R. Serrano, Leslie M. Phinney
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 327-333, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33571
https://doi.org/10.1115/IPACK2007-33571
View Paper titled, Micro-Raman Thermometry of Laser Heated Surfaces
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Topics: Lasers, Temperature measurement, Temperature, Polysilicon, Computer simulation, Data collection, Heating, Infrared imaging, Microelectromechanical systems, Microscopy
Proceedings Papers

Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility

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Yasuo Amemiya, Madhusudan Iyengar, Hendrik Hamann, Martin O’Boyle, Michael Schappert, Jing Shen, Theodore van Kessel
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 871-876, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33899
https://doi.org/10.1115/IPACK2007-33899
View Paper titled, Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility
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Topics: Computer simulation, Data centers, Temperature, Computational fluid dynamics, Transients (Dynamics), Air conditioning, Temperature profiles, Algorithms, Boundary-value problems, Energy dissipation