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Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72612
https://doi.org/10.1115/IPACK2021-72612
View Paper titled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples

Takashi Fukue, Koichi Hirasawa
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69101
https://doi.org/10.1115/IPACK2021-69101
View Paper titled, Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples
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Topics: Measurement uncertainty, Temperature, Thermocouples, Temperature measurement, Electrical components, Evaluation methods, Heat, Heat transfer, Uncertainty
Proceedings Papers

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6440
https://doi.org/10.1115/IPACK2019-6440
View Paper titled, Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics
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Topics: Dynamics (Mechanics), Electron mobility, Electronics, Energy gap, Gallium nitride, Heating, Imaging, Temperature measurement, Thermoreflectance, Transistors
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6426
https://doi.org/10.1115/IPACK2019-6426
View Paper titled, Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature
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Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8256
https://doi.org/10.1115/IPACK2018-8256
View Paper titled, Analysis of Thermal Properties of Power Multifinger HEMT Devices
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74119
https://doi.org/10.1115/IPACK2017-74119
View Paper titled, Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe
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Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74149
https://doi.org/10.1115/IPACK2017-74149
View Paper titled, Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

Lynn Parnell, Garrison Vaughan, John Thompson, Daniel Duffy, Louis Capps, Mark E. Steinke, Vinod Kamath
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A031, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48470
https://doi.org/10.1115/IPACK2015-48470
View Paper titled, Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads
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Topics: Server racks, Stress, Water, Cooling, Flow (Dynamics), Temperature, Computers, Coolants, Density, Design
Proceedings Papers

Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples

Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48641
https://doi.org/10.1115/IPACK2015-48641
View Paper titled, Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples
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Topics: Heat, Temperature, Thermocouples, Heat sinks, Temperature distribution, Approximation, Errors, Heat conduction, Heat transfer coefficients, Springs
Proceedings Papers

Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module

Keisuke Horiuchi, Yuichiro Konishi, Atsuo Nishihara
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48625
https://doi.org/10.1115/IPACK2015-48625
View Paper titled, Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module
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Topics: Temperature measurement, Water, Flow (Dynamics), Thermal resistance, Capacitance, Computer simulation, Design, Heat, Heat transfer, Junctions
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73214
https://doi.org/10.1115/IPACK2013-73214
View Paper titled, Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement
Proceedings Papers

Measured-Temperature Interpolation and Visualization for Data Centers

Xuanhang (Simon) Zhang, Christopher M. Healey, Zachary R. Sheffer, James W. VanGilder
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73081
https://doi.org/10.1115/IPACK2013-73081
View Paper titled, Measured-Temperature Interpolation and Visualization for Data Centers
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Topics: Data centers, Interpolation, Temperature, Visualization, Cooling, Temperature sensors, Computation, Computational fluid dynamics, Fluid dynamics, Maintenance
Proceedings Papers

Transient Thermal Response of Servers Through Air Temperature Measurements

Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73281
https://doi.org/10.1115/IPACK2013-73281
View Paper titled, Transient Thermal Response of Servers Through Air Temperature Measurements
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Topics: Temperature measurement, Transients (Dynamics), Capacitance, Temperature, Computational fluid dynamics, Data centers, Thermal conductivity
Proceedings Papers

Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat Sink

Ravi S. Patel, Tannaz Harirchian, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 143-151, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52089
https://doi.org/10.1115/IPACK2011-52089
View Paper titled, Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat Sink
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Topics: Boiling, Flow (Dynamics), Heat sinks, Heat transfer coefficients, Microchannels, Vapors, Dimensions, Dielectric liquids, Energy dissipation, Entrance region
Proceedings Papers

Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove

C. P. Migliaccio, H. K. Dhavaleswarapu, S. V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 363-370, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89134
https://doi.org/10.1115/InterPACK2009-89134
View Paper titled, Microscale Temperature Measurements Near the Contact Line of an Evaporating Thin Film in a V-Groove
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Topics: Evaporation, Microscale devices, Temperature measurement, Thin films, Quartz, Shapes, Geometry, Heat, Heat flux, Heat transfer
Proceedings Papers

Micro-Raman Thermometry of Laser Heated Surfaces

Justin R. Serrano, Leslie M. Phinney
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 327-333, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33571
https://doi.org/10.1115/IPACK2007-33571
View Paper titled, Micro-Raman Thermometry of Laser Heated Surfaces
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Topics: Lasers, Temperature measurement, Temperature, Polysilicon, Computer simulation, Data collection, Heating, Infrared imaging, Microelectromechanical systems, Microscopy
Proceedings Papers

Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module

Y. Ezzahri, R. Singh, K. Fukutani, Z. Bian, A. Shakouri, G. Zeng, J. E. Bowers, J. M. Zide, A. C. Gossard
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 277-281, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33880
https://doi.org/10.1115/IPACK2007-33880
View Paper titled, Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module
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Topics: Thermal characterization, Transients (Dynamics), Electrons, Nanoparticles, Semiconductors (Materials), Crystals, Electromagnetic scattering, Heat, Heat transfer, Metals
Proceedings Papers

Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility

Yasuo Amemiya, Madhusudan Iyengar, Hendrik Hamann, Martin O’Boyle, Michael Schappert, Jing Shen, Theodore van Kessel
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 871-876, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33899
https://doi.org/10.1115/IPACK2007-33899
View Paper titled, Comparison of Experimental Temperature Results With Numerical Modeling Predictions of a Real-World Compact Data Center Facility
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Topics: Computer simulation, Data centers, Temperature, Computational fluid dynamics, Transients (Dynamics), Air conditioning, Temperature profiles, Algorithms, Boundary-value problems, Energy dissipation
Proceedings Papers

Characterization of Heated Atomic Force Microscope Cantilevers in Air and Vacuum

Jungchul Lee, Tanya L. Wright, Mark Abel, Erik Sunden, Alexei Marchenkov, Samuel Graham, William P. King
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1767-1772, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73456
https://doi.org/10.1115/IPACK2005-73456
View Paper titled, Characterization of Heated Atomic Force Microscope Cantilevers in Air and Vacuum
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Topics: Atomic force microscopy, Cantilevers, Temperature measurement, Vacuum
Proceedings Papers

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

Felipe E. Ortega Gutierrez, Alfonso Ortega, Guoping Xu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 315-327, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73228
https://doi.org/10.1115/IPACK2005-73228
View Paper titled, Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Heat, Temperature measurement, Boundary-value problems, Clearances (Engineering), Copper, Cross-flow, Finishes