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Proceedings Papers

Design of the Next Generation Antenna Mounts

Ruben Gregory Puthota Dominic Savio, Betsegaw Gebrehiwot, Dereje Agonafer, Al Skrepcinski, Tom Palmer
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48594
https://doi.org/10.1115/IPACK2015-48594
View Paper titled, Design of the Next Generation Antenna Mounts
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Topics: Design, Telecommunications, Weight (Mass), Deformation, Image processing, Load bearing capacity, Matlab, Stress, Wind pressure
Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48244
https://doi.org/10.1115/IPACK2015-48244
View Paper titled, Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet
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Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics
Proceedings Papers

Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules

Ehsan B. Haghighi, Thanh L. Phan, Vijit Wuttijumnong, Koichi Mashiko, Yuji Saito, Masataka Mochizuki
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48671
https://doi.org/10.1115/IPACK2015-48671
View Paper titled, Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules
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Topics: Cooling, Heat pipes, Heat sinks, Manufacturing, Air flow, Forced convection, Heat, Heat losses, Telecommunications, Thermal management
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89092
https://doi.org/10.1115/InterPACK2009-89092
View Paper titled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization
Proceedings Papers

Numerical Analysis of Mist-Cooled High Power Components in Cabinets

Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89269
https://doi.org/10.1115/InterPACK2009-89269
View Paper titled, Numerical Analysis of Mist-Cooled High Power Components in Cabinets
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Topics: Numerical analysis, Flow (Dynamics), Heat sinks, Drops, Evaporation, Telecommunications, Thermal management, Acoustics, Circuits, Cooling
Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89340
https://doi.org/10.1115/InterPACK2009-89340
View Paper titled, Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection
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Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning
Proceedings Papers

Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data

Paul J. Huspeni, Ly Le, Wei Liu, Elli Saravanos, Shannon Adkins
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 673-683, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89217
https://doi.org/10.1115/InterPACK2009-89217
View Paper titled, Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data
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Topics: Optical fiber, Stress, Fibers, Manufacturing, Maximum likelihood estimation, Failure, Reliability, Statistical analysis, Coating processes, Coatings
Proceedings Papers

Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment

Lang Yuan, Jignesh Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1025-1032, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89377
https://doi.org/10.1115/InterPACK2009-89377
View Paper titled, Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
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Topics: Acoustics, Air filters, Design, Fibers, Noise (Sound), Telecommunications, Thermal management
Proceedings Papers

Modelling the Reliability of Components on Flexible Substrates

J. Rizvi, C. Yin, C. Bailey, H. Lu
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 375-380, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33820
https://doi.org/10.1115/IPACK2007-33820
View Paper titled, Modelling the Reliability of Components on Flexible Substrates
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Topics: Modeling, Reliability, Aerospace industry, Computers, Copper, Design, Dielectric materials, Flexible electronics, Manufacturing, Packaging
Proceedings Papers

Pb-Free Process Development for a High End Storage Area Network Application

Sunil Gopakumar, Francois Billaut, Eric Fremd, Manthos Economou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 937-943, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33857
https://doi.org/10.1115/IPACK2007-33857
View Paper titled, Pb-Free Process Development for a High End Storage Area Network Application
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Topics: Alloys, Cycles, Electronic products, Finishes, High temperature, Laminates, Lead-free solders, Lumber, Manufacturing, Optimization
Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33335
https://doi.org/10.1115/IPACK2007-33335
View Paper titled, A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication
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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation
Proceedings Papers

Survey of Environmental Data for COTS (Commercial Off-the-Shelf) Used in Military Systems

Medy Ramot, Eran Weiss, Niv Cohen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 819-826, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73025
https://doi.org/10.1115/IPACK2005-73025
View Paper titled, Survey of Environmental Data for COTS (Commercial Off-the-Shelf) Used in Military Systems
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Topics: Military systems, Defense industry, Design, Computers, Data storage systems, Semiconductors (Materials), Telecommunications
Proceedings Papers

A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication

Tien-Yu Tom Lee, Victor A. Chiriac, Roger Stout
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 105-112, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73090
https://doi.org/10.1115/IPACK2005-73090
View Paper titled, A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication
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Topics: Telecommunications, Transients (Dynamics), Cycles, Steady state, Temperature, Waves, Junctions, Capacitors, Computation, Computer software
Proceedings Papers

Mathematical Optimization of Electronic Enclosures

D. J. De Kock, M. Nagulapally, J. A. Visser, R. Nair, J. Nigen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 253-258, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73185
https://doi.org/10.1115/IPACK2005-73185
View Paper titled, Mathematical Optimization of Electronic Enclosures
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Topics: Optimization, Design, Computational fluid dynamics, Flow (Dynamics), Lumber, Temperature, Filters, Design methodology, Electronic components, Fans
Proceedings Papers

A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components

Andrew S. Glista, Jr., John Nahvi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 621-628, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35062
https://doi.org/10.1115/IPACK2003-35062
View Paper titled, A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components
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Topics: Military aircraft, Waves, Fibers, Aircraft, Cables, Design, Flight, Testing, Signals, Aerospace industry
Proceedings Papers

Qualification and Reliability Testing of a Microchip Laser System for Space Applications

M. W. Wright, D. Franzen, H. Hemmati, M. Sandor
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 879-883, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35298
https://doi.org/10.1115/IPACK2003-35298
View Paper titled, Qualification and Reliability Testing of a Microchip Laser System for Space Applications
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Topics: Accelerated life testing, Integrated circuits, Lasers, Testing, Temperature, Construction, Crystals, Fibers, Flow (Dynamics), Instrumentation
Proceedings Papers

Design Optimization of a Router Board Using Computational Fluid Dynamics

Timothy J. Dake, Joseph Majdalani, Susheela Narasimhan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 35-39, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35338
https://doi.org/10.1115/IPACK2003-35338
View Paper titled, Design Optimization of a Router Board Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Design, Optimization, Cooling, Internet, Energy dissipation, Gears, Lumber, Telecommunications
Proceedings Papers

Optimum Airflow Management for Multi-Board Rack-Mount Equipment

Bhalchandra Puranik, Younes Shabany
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 429-434, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35210
https://doi.org/10.1115/IPACK2003-35210
View Paper titled, Optimum Airflow Management for Multi-Board Rack-Mount Equipment
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Topics: Air flow, Design, Air filters, Dimensions, Lumber, Noise (Sound), Redundancy (Engineering), Reliability, Telecommunications, Vacuum equipment
Proceedings Papers

Thermal Simulation for Outdoor Optical Network Unit

Z. Zack Yu, Ridvan Amir Sahan, X. Howard Sun
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 695-698, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35348
https://doi.org/10.1115/IPACK2003-35348
View Paper titled, Thermal Simulation for Outdoor Optical Network Unit
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Topics: Simulation, Telecommunications, Computational fluid dynamics, Cooling, Cables, Curbs (Roads), Design, Electronics, Fibers, Optics