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Proceedings Papers
Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111921
Proceedings Papers
A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
Available to PurchaseAli Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
Proceedings Papers
Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
Available to PurchaseAli Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
Proceedings Papers
Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Available to PurchaseGilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
Proceedings Papers
BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73253
Proceedings Papers
Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study
Available to PurchaseSadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8422
Proceedings Papers
3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74213
Proceedings Papers
Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks
Available to PurchaseTianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48071
Proceedings Papers
Design Considerations of Packaging a High Voltage Current Switch
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48714
Proceedings Papers
Multiphysics Simulation of RF-MEMS With Quantified Uncertainties
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73175
Proceedings Papers
Flat Tree Networks
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 49-55, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89336
Proceedings Papers
Reliable Power Electronics for Wind Turbines
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 771-773, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89174
Proceedings Papers
Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1021-1024, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89368
Proceedings Papers
Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89052
Proceedings Papers
Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89092
Proceedings Papers
A Stamp-Sealed Microshell Package for RF MEMS Switches
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 73-77, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33887
Proceedings Papers
Thermal Management in RF MEMS Ohmic Switches
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 185-191, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33502
Proceedings Papers
Thermal Management for Chip-Scale Atomic Clocks
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 741-745, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73444
Proceedings Papers
Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2109-2122, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73010
Proceedings Papers
Measurement and Analysis of Insertion Loss in an Optical Collimation System Designed for a 2D MEMS Optical Switch
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 767-772, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73335
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