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Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021

Paper No: IPACK2021-73253

DOI: https://doi.org/10.1115/IPACK2021-73253

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Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)

Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018

Paper No: IPACK2018-8422

DOI: https://doi.org/10.1115/IPACK2018-8422

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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers

Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017

Paper No: IPACK2017-74213

DOI: https://doi.org/10.1115/IPACK2017-74213

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Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature

Proceedings Papers

Design Considerations of Packaging a High Voltage Current Switch

Ankan De, Adam Morgan, Subhashish Bhattacharya, Douglas C. Hopkins

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A014, July 6–9, 2015

Paper No: IPACK2015-48714

DOI: https://doi.org/10.1115/IPACK2015-48714

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Topics: Design, Packaging, Switches, Anodes, Computer software, Current density, Electromagnetic fields, Gates (Closures), Packing (Shipments), Packings (Cushioning)

Proceedings Papers

Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks

Tianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015

Paper No: IPACK2015-48071

DOI: https://doi.org/10.1115/IPACK2015-48071

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Topics: Cooling, Data centers, Temperature, Heat, Air flow, Computational fluid dynamics, Cooling systems, Stress, Computer simulation, Density

Proceedings Papers

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013

Paper No: IPACK2013-73175

DOI: https://doi.org/10.1115/IPACK2013-73175

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Topics: Microelectromechanical systems, Simulation, Uncertainty, Deformation, Chaos, Complex systems, Damping, Displacement, Electrostatics, Fluids

Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009

Paper No: InterPACK2009-89092

DOI: https://doi.org/10.1115/InterPACK2009-89092

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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization

Proceedings Papers

Reliable Power Electronics for Wind Turbines

Patrick McCluskey, Peter Hansen, Douglas DeVoto

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 771-773, July 19–23, 2009

Paper No: InterPACK2009-89174

DOI: https://doi.org/10.1115/InterPACK2009-89174

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Topics: Electronics, Wind turbines, Electronic systems, Failure, Fatigue, Packaging, Heat, Temperature, Bonding, Ceramics

Proceedings Papers

Flat Tree Networks

P. Khanduri, A. Wood, D. Cohen, I. Birkeli, F. Sem-Jacobsen

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 49-55, July 19–23, 2009

Paper No: InterPACK2009-89336

DOI: https://doi.org/10.1115/InterPACK2009-89336

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Topics: Packaging, Signals, Switches, Textiles, Topology

Proceedings Papers

Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control

Su-Heon Jeong, Wataru Nakayama, Sun-Kyu Lee

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1021-1024, July 19–23, 2009

Paper No: InterPACK2009-89368

DOI: https://doi.org/10.1115/InterPACK2009-89368

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Topics: Columns (Structural), Heat, Switches, Thermal resistance, Electronic packages, Temperature, Flow (Dynamics), Geometry, Plates (structures), Reservoirs

Proceedings Papers

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009

Paper No: InterPACK2009-89052

DOI: https://doi.org/10.1115/InterPACK2009-89052

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Topics: Capacitors, Electronic equipment, Modeling, Computational fluid dynamics, Flow simulation, Temperature, Design, Flow (Dynamics), Switches, Thermal analysis

Proceedings Papers

A Stamp-Sealed Microshell Package for RF MEMS Switches

John Heck, Hanan Bar, Tsung-Kuan A. Chou, Quan Tran, Qing Ma, Boaz Weinfeld, Valluri Rao

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 73-77, July 8–12, 2007

Paper No: IPACK2007-33887

DOI: https://doi.org/10.1115/IPACK2007-33887

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Topics: Microelectromechanical systems, Switches, Semiconductor wafers, Manufacturing, Sealing (Process), Tunnels, Bonding, Embossing, Metal stamping, Packaging

Proceedings Papers

Thermal Management in RF MEMS Ohmic Switches

Ryszard J. Pryputniewicz

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 185-191, July 8–12, 2007

Paper No: IPACK2007-33502

DOI: https://doi.org/10.1115/IPACK2007-33502

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Topics: Heat, Joules, Microelectromechanical systems, Switches, Thermal analysis, Thermal management

Proceedings Papers

Thermal Management for Chip-Scale Atomic Clocks

Alexander Laws, Richard Y. J. Chang, Victor M. Bright, Y. C. Lee

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 741-745, July 17–22, 2005

Paper No: IPACK2005-73444

DOI: https://doi.org/10.1115/IPACK2005-73444

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Topics: Atomic clocks, Thermal management, Temperature, Switches, Clocks, Design, Energy dissipation, Vehicles, Waste heat, Cavities

Proceedings Papers

Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings

R. McCarty, K. P. Hallinan, B. Sanders, T. Somphone

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2109-2122, July 17–22, 2005

Paper No: IPACK2005-73010

DOI: https://doi.org/10.1115/IPACK2005-73010

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Topics: Energy recovery, Heat, Temperature, Thermoelectric devices, Aerospace industry, Computer simulation, Exergy, Heat recovery, Switches, Waste heat

Proceedings Papers

Measurement and Analysis of Insertion Loss in an Optical Collimation System Designed for a 2D MEMS Optical Switch

Tsuyoshi Ikehara, Ryutaro Maeda, Xue Chuan Shan

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 767-772, July 17–22, 2005

Paper No: IPACK2005-73335

DOI: https://doi.org/10.1115/IPACK2005-73335

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Topics: Microelectromechanical systems, Switches, Lenses (Optics), Mirrors, Ray tracing

Proceedings Papers

Early-Stage Analysis for MEMS Structural Optimization II: Its Application to Microrelay Reliability

Koji Ishikawa, Takahiro Miki, Hiroki Mamiya, Q. Yu

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1631-1636, July 17–22, 2005

Paper No: IPACK2005-73049

DOI: https://doi.org/10.1115/IPACK2005-73049

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Topics: Design, Microelectromechanical systems, Optimization, Reliability, Structural optimization, Switches

Proceedings Papers

Ceramic Via Wafer-Level Packaging for MEMS

John M. Heck, Leonel R. Arana, Bill Read, Thomas S. Dory

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1069-1074, July 17–22, 2005

Paper No: IPACK2005-73369

DOI: https://doi.org/10.1115/IPACK2005-73369

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Topics: Ceramics, Microelectromechanical systems, Packaging, Semiconductor wafers, Bonding, MEMS packaging, Solders, Compression, Copper, Glass

Proceedings Papers

Development of Piezoelectric RF-MEMS Switch Driven by Low Operating Voltage

Isaku Kanno, Takaaki Suzuki, Hironobo Endo, Hidetoshi Kotera

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2033-2036, July 17–22, 2005

Paper No: IPACK2005-73099

DOI: https://doi.org/10.1115/IPACK2005-73099

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Topics: Microelectromechanical systems, Switches, Thin films, Actuators, Cantilevers, Deflection, Electrodes, Microcantilevers

Proceedings Papers

Wafer Level Micropackaging for RF MEMS Switches

David I. Forehand, Charles L. Goldsmith

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2047-2051, July 17–22, 2005

Paper No: IPACK2005-73398

DOI: https://doi.org/10.1115/IPACK2005-73398

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Topics: Microelectromechanical systems, Packaging, Semiconductor wafers, Switches

NARROW

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Design Considerations of Packaging a High Voltage Current Switch

Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Reliable Power Electronics for Wind Turbines

Flat Tree Networks

Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

A Stamp-Sealed Microshell Package for RF MEMS Switches

Thermal Management in RF MEMS Ohmic Switches

Thermal Management for Chip-Scale Atomic Clocks

Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings

Measurement and Analysis of Insertion Loss in an Optical Collimation System Designed for a 2D MEMS Optical Switch

Early-Stage Analysis for MEMS Structural Optimization II: Its Application to Microrelay Reliability

Ceramic Via Wafer-Level Packaging for MEMS

Development of Piezoelectric RF-MEMS Switch Driven by Low Operating Voltage

Wafer Level Micropackaging for RF MEMS Switches

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