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Proceedings Papers
Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
Proceedings Papers
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111534
Proceedings Papers
Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2640
Proceedings Papers
Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
Proceedings Papers
Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6389
Proceedings Papers
Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8345
Proceedings Papers
Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8315
Proceedings Papers
Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
Proceedings Papers
The Effect of Surface Texture on Thermal Sensation and Comfort
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A026, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74179
Proceedings Papers
Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer
Available to PurchaseHyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74090
Proceedings Papers
Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48153
Proceedings Papers
A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A088, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48678
Proceedings Papers
On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48302
Proceedings Papers
Enhancing Heat Transfer in a Cold Plate, Inserts vs. Nanofluids: Application to IT Servers
Available to Purchase
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73132
Proceedings Papers
Multiphysics Simulation of RF-MEMS With Quantified Uncertainties
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73175
Proceedings Papers
New Method for Evaluating Heat Transfer Material
Available to Purchase
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73051
Proceedings Papers
High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 763-771, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52220
Proceedings Papers
The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue Life of Solder Joint in Power-Devices
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 195-199, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52109
Proceedings Papers
Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 685-692, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52046
Proceedings Papers
An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 139-145, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89270
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