1-3 of 3
Surface deformation
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

Available to Purchase

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A075, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48535
https://doi.org/10.1115/IPACK2015-48535
View Paper titled, Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications
Open the PDF for Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications in another window
Topics: Contact resistance, Metal foams, Porosity, Fillers (Materials), Foams (Chemistry), Aluminum, Elastic moduli, Elasticity, Phase change materials, Simulation
Proceedings Papers

Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

Available to Purchase

Yuki Sato, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 473-479, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33257
https://doi.org/10.1115/IPACK2007-33257
View Paper titled, Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips
Open the PDF for Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips in another window
Topics: Failure, Nondestructive evaluation, Deformation, Delamination, Finite element analysis, Surface deformation, Diluents, Epoxy resins, Lasers, Microscopes
Proceedings Papers

An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

Available to Purchase

Takehiko Takahashi, Susumu Hioki, Ikuo Shohji, Osamu Kamiya
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1811-1817, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73152
https://doi.org/10.1115/IPACK2005-73152
View Paper titled, An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature
Open the PDF for An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature in another window
Topics: Cycles, Fatigue damage, Image processing, Lead-free solders, Solders, Tin, Low cycle fatigue, Fatigue life, Surface deformation, Fatigue