1-5 of 5
Structural design
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
Open the PDF for Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design in another window
Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations

Carin Lundquist Ruiz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48769
https://doi.org/10.1115/IPACK2015-48769
View Paper titled, Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations
Open the PDF for Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations in another window
Topics: Design, Modeling, Cutting, Engineers, Light-emitting diodes, Simulation, Structural design
Proceedings Papers

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48516
https://doi.org/10.1115/IPACK2015-48516
View Paper titled, Centrifugally Pumped Thermosiphons for Motor Rotor Cooling
Open the PDF for Centrifugally Pumped Thermosiphons for Motor Rotor Cooling in another window
Topics: Cooling, Engines, Motors, Rotors, Machinery, Design, Heat, Manufacturing, Centrifugal force, Chemical processes
Proceedings Papers

TSV Interposers With Embedded Microchannels for 3D IC and LED Integration

John Lau, Heng-Chieh Chien, Ray Tain
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 297-304, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52204
https://doi.org/10.1115/IPACK2011-52204
View Paper titled, TSV Interposers With Embedded Microchannels for 3D IC and LED Integration
Open the PDF for TSV Interposers With Embedded Microchannels for 3D IC and LED Integration in another window
Topics: Microchannels, Silicon, Cooling, Optical instruments, Pressure drop, Structural design, System-in-package
Proceedings Papers

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89384
https://doi.org/10.1115/InterPACK2009-89384
View Paper titled, Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages
Open the PDF for Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages in another window
Topics: Fatigue, Reliability, Solders, Stress analysis (Engineering), Finite element analysis, Deformation, Metals, Molding materials, Absorption, Constitutive equations