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Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020

Paper No: IPACK2020-2547

DOI: https://doi.org/10.1115/IPACK2020-2547

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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)

Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017

Paper No: IPACK2017-74010

DOI: https://doi.org/10.1115/IPACK2017-74010

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Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)

Proceedings Papers

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013

Paper No: IPACK2013-73151

DOI: https://doi.org/10.1115/IPACK2013-73151

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Topics: Silicon chips, Simulation, Thermal stresses, Stress, Bending strength, Copper, Finite element methods, Yield stress, Brittleness, Elevations (Drawings)

Proceedings Papers

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura

Paper No: IPACK2013-73192

DOI: https://doi.org/10.1115/IPACK2013-73192

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Topics: Damage, Low cycle fatigue, Solder joints, Tin, Grain boundaries, Fracture (Materials), Stress concentration, Crack propagation, Cycles, Electron backscatter diffraction

Proceedings Papers

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure

Hideo Koguchi, Kazuhisa Hoshi

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 149-156, July 6–8, 2011

Paper No: IPACK2011-52065

DOI: https://doi.org/10.1115/IPACK2011-52065

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Topics: Joining, Resins, Silicon, Bonding, Boundary element methods, Eigenvalues, Stress concentration, Stress singularity, Delamination, Density

Proceedings Papers

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura

Paper No: IPACK2011-52063

DOI: https://doi.org/10.1115/IPACK2011-52063

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Topics: Flip-chip, Flip-chip devices, Mechanical properties, Stress, Copper, Silicon chips, Gages, Packaging, Sensors, Strain gages

Proceedings Papers

Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films

Vu Le Huy, Joao Gaspar, Oliver Paul, Shoji Kamiya

Paper No: IPACK2011-52250

DOI: https://doi.org/10.1115/IPACK2011-52250

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Topics: Fatigue, Polysilicon, Thin films, Fracture (Materials), Fracture (Process), Shapes, Fatigue testing, Stress, Stress concentration, Weibull distribution

Proceedings Papers

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

Paper No: IPACK2011-52150

DOI: https://doi.org/10.1115/IPACK2011-52150

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Topics: Metal oxide semiconductors, Stress, Transistors, Simulation, Electron mobility, Computer simulation, Diffusion (Physics), Electrons, Flow (Dynamics), Gates (Closures)

Proceedings Papers

Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 119-124, July 19–23, 2009

Paper No: InterPACK2009-89112

DOI: https://doi.org/10.1115/InterPACK2009-89112

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Topics: Simulation, Stress, Stress concentration, Physics, Diffusion (Physics), Semiconductor devices, Simulation models, Computer simulation, Electron mobility, Gates (Closures)

Proceedings Papers

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

Hideo Koguchi, Masato Nakajima

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 717-727, July 19–23, 2009

Paper No: InterPACK2009-89091

DOI: https://doi.org/10.1115/InterPACK2009-89091

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Topics: Bonding, Resins, Silicon, Stress, Thermal stresses, Boundary element methods, Delamination, Materials properties, Stress concentration, Cooling

Proceedings Papers

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 239-245, July 19–23, 2009

Paper No: InterPACK2009-89145

DOI: https://doi.org/10.1115/InterPACK2009-89145

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Topics: Evaluation methods, Stress, Thin films, Transistors, Gates (Closures), Electrodes, Finite element methods, Manufacturing, Stress concentration, Focused ion beams

Proceedings Papers

Dominant Structural Factors of Local Residual Stress in Three-Dimensionally Stacked LSI Chips Mounted Using Flip Chip Technology

Nobuki Ueta, Hideo Miura

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 473-479, July 8–12, 2007

Paper No: IPACK2007-33402

DOI: https://doi.org/10.1115/IPACK2007-33402

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Topics: Flip-chip, Flip-chip devices, Stress, Stress concentration, Reliability, Strain gages

Proceedings Papers

Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses

Hideo Koguchi, Takashi Taniguchi

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 863-872, July 8–12, 2007

Paper No: IPACK2007-33592

DOI: https://doi.org/10.1115/IPACK2007-33592

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Topics: Corners (Structural elements), Resins, Thermal stresses, Stress singularity, Bonding, Boundary element methods, Materials properties, Residual stresses, Cooling, Delamination

Proceedings Papers

High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

Yonggang Chen, Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 285-295, July 8–12, 2007

Paper No: IPACK2007-33569

DOI: https://doi.org/10.1115/IPACK2007-33569

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Topics: Complementary metal oxide semiconductors, Resolution (Optics), Sensors, Stress, Integrated circuits, Calibration, Cavities, Finite element analysis, Mirrors, Shear stress

Proceedings Papers

Taguchi Robust Analysis of Fatigue of Lead-Free Sn3.5Ag Solders

Heng Cheng Lin, Chieh Kung, Rong Shen Chen

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 581-590, July 8–12, 2007

Paper No: IPACK2007-33597

DOI: https://doi.org/10.1115/IPACK2007-33597

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Topics: Fatigue analysis, Fatigue life, Lead-free solders, Solders, Taguchi methods, Cycles, Deformation, Geometry, Temperature, Adhesives

Proceedings Papers

Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors

Amelia G. Grobnic, Robert James, Ping Lu, Stephen J. Mihailov

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 899-906, July 17–22, 2005

Paper No: IPACK2005-73209

DOI: https://doi.org/10.1115/IPACK2005-73209

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Topics: Circuits, Fiber Bragg gratings, Sensors, Thermal stresses, Photonic equipment, Design, Finite element analysis, Geometry, Optical instruments, Optimization

Proceedings Papers

Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

Nobuki Ueta, Hideo Miura

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1135-1140, July 17–22, 2005

Paper No: IPACK2005-73112

DOI: https://doi.org/10.1115/IPACK2005-73112

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Topics: Flip-chip, Flip-chip devices, Stress, Sensors, Silicon chips, Strain gages, Finite element analysis, Gages, Polysilicon, Semiconductor wafers

Proceedings Papers

Stress Concentration and Surface Roughness Effect on Strength of Polycrystalline Silicon Structure

Shigeru Hamada, Shuichi Tani, Daisuke Katagiri, Masahiro Tsugai, Makio Horikawa, Hiroshi Otani

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1929-1934, July 17–22, 2005

Paper No: IPACK2005-73169

DOI: https://doi.org/10.1115/IPACK2005-73169

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Topics: Polysilicon, Stress concentration, Surface roughness, Stress, Design, Finite element methods, Finite element model, Quality control

Proceedings Papers

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 147-153, July 6–11, 2003

Paper No: IPACK2003-35130

DOI: https://doi.org/10.1115/IPACK2003-35130

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Topics: Flip-chip, Flip-chip devices, Solders, Manufacturing, Brittleness, Reliability, Shear (Mechanics), Shear strength, Testing, Tin

Proceedings Papers

A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die

Richard C. Jaeger, Jeffrey C. Suhling, Yonggang Chen, Shahan Rahaman, M. Nokibul Islam

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 845-851, July 6–11, 2003

Paper No: IPACK2003-35276

DOI: https://doi.org/10.1115/IPACK2003-35276

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Topics: Calibration, Sensors, Stress, Semiconductor wafers, Strips, Design, Dimensions, Finite element analysis, Geometry, Integrated circuit fabrication

NARROW

High Performance Computing Package With Chip Module on Substrate Solutions

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

Dominant Structural Factors of Local Residual Stress in Three-Dimensionally Stacked LSI Chips Mounted Using Flip Chip Technology

Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses

High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

Taguchi Robust Analysis of Fatigue of Lead-Free Sn3.5Ag Solders

Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors

Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

Stress Concentration and Surface Roughness Effect on Strength of Polycrystalline Silicon Structure

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die

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