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Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
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Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74010
https://doi.org/10.1115/IPACK2017-74010
View Paper titled, Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
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Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)
Proceedings Papers

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73151
https://doi.org/10.1115/IPACK2013-73151
View Paper titled, Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP
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Topics: Silicon chips, Simulation, Thermal stresses, Stress, Bending strength, Copper, Finite element methods, Yield stress, Brittleness, Elevations (Drawings)
Proceedings Papers

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73192
https://doi.org/10.1115/IPACK2013-73192
View Paper titled, Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint
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Topics: Damage, Low cycle fatigue, Solder joints, Tin, Grain boundaries, Fracture (Materials), Stress concentration, Crack propagation, Cycles, Electron backscatter diffraction
Proceedings Papers

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure

Hideo Koguchi, Kazuhisa Hoshi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 149-156, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52065
https://doi.org/10.1115/IPACK2011-52065
View Paper titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure
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Topics: Joining, Resins, Silicon, Bonding, Boundary element methods, Eigenvalues, Stress concentration, Stress singularity, Delamination, Density
Proceedings Papers

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52063
https://doi.org/10.1115/IPACK2011-52063
View Paper titled, Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
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Topics: Flip-chip, Flip-chip devices, Mechanical properties, Stress, Copper, Silicon chips, Gages, Packaging, Sensors, Strain gages
Proceedings Papers

Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films

Vu Le Huy, Joao Gaspar, Oliver Paul, Shoji Kamiya
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 409-415, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52250
https://doi.org/10.1115/IPACK2011-52250
View Paper titled, Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films
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Topics: Fatigue, Polysilicon, Thin films, Fracture (Materials), Fracture (Process), Shapes, Fatigue testing, Stress, Stress concentration, Weibull distribution
Proceedings Papers

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 479-486, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52150
https://doi.org/10.1115/IPACK2011-52150
View Paper titled, Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors
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Topics: Metal oxide semiconductors, Stress, Transistors, Simulation, Electron mobility, Computer simulation, Diffusion (Physics), Electrons, Flow (Dynamics), Gates (Closures)
Proceedings Papers

Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs

Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 119-124, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89112
https://doi.org/10.1115/InterPACK2009-89112
View Paper titled, Device Simulation of Mechanical Stress Effects on Electrical Characteristics of nMOSFETs: Impact of Local Stress in nMOSFETs
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Topics: Simulation, Stress, Stress concentration, Physics, Diffusion (Physics), Semiconductor devices, Simulation models, Computer simulation, Electron mobility, Gates (Closures)
Proceedings Papers

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

Hideo Koguchi, Masato Nakajima
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 717-727, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89091
https://doi.org/10.1115/InterPACK2009-89091
View Paper titled, Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints
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Topics: Bonding, Resins, Silicon, Stress, Thermal stresses, Boundary element methods, Delamination, Materials properties, Stress concentration, Cooling
Proceedings Papers

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 239-245, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89145
https://doi.org/10.1115/InterPACK2009-89145
View Paper titled, In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures
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Topics: Evaluation methods, Stress, Thin films, Transistors, Gates (Closures), Electrodes, Finite element methods, Manufacturing, Stress concentration, Focused ion beams
Proceedings Papers

Taguchi Robust Analysis of Fatigue of Lead-Free Sn3.5Ag Solders

Heng Cheng Lin, Chieh Kung, Rong Shen Chen
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 581-590, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33597
https://doi.org/10.1115/IPACK2007-33597
View Paper titled, Taguchi Robust Analysis of Fatigue of Lead-Free Sn3.5Ag Solders
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Topics: Fatigue analysis, Fatigue life, Lead-free solders, Solders, Taguchi methods, Cycles, Deformation, Geometry, Temperature, Adhesives
Proceedings Papers

High Resolution Die Stress Mapping Using Arrays of CMOS Sensors

Yonggang Chen, Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 285-295, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33569
https://doi.org/10.1115/IPACK2007-33569
View Paper titled, High Resolution Die Stress Mapping Using Arrays of CMOS Sensors
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Topics: Complementary metal oxide semiconductors, Resolution (Optics), Sensors, Stress, Integrated circuits, Calibration, Cavities, Finite element analysis, Mirrors, Shear stress
Proceedings Papers

Dominant Structural Factors of Local Residual Stress in Three-Dimensionally Stacked LSI Chips Mounted Using Flip Chip Technology

Nobuki Ueta, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 473-479, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33402
https://doi.org/10.1115/IPACK2007-33402
View Paper titled, Dominant Structural Factors of Local Residual Stress in Three-Dimensionally Stacked LSI Chips Mounted Using Flip Chip Technology
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Topics: Flip-chip, Flip-chip devices, Stress, Stress concentration, Reliability, Strain gages
Proceedings Papers

Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses

Hideo Koguchi, Takashi Taniguchi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 863-872, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33592
https://doi.org/10.1115/IPACK2007-33592
View Paper titled, Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses
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Topics: Corners (Structural elements), Resins, Thermal stresses, Stress singularity, Bonding, Boundary element methods, Materials properties, Residual stresses, Cooling, Delamination
Proceedings Papers

Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors

Amelia G. Grobnic, Robert James, Ping Lu, Stephen J. Mihailov
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 899-906, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73209
https://doi.org/10.1115/IPACK2005-73209
View Paper titled, Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors
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Topics: Circuits, Fiber Bragg gratings, Sensors, Thermal stresses, Photonic equipment, Design, Finite element analysis, Geometry, Optical instruments, Optimization
Proceedings Papers

Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

Nobuki Ueta, Hideo Miura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1135-1140, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73112
https://doi.org/10.1115/IPACK2005-73112
View Paper titled, Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip
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Topics: Flip-chip, Flip-chip devices, Stress, Sensors, Silicon chips, Strain gages, Finite element analysis, Gages, Polysilicon, Semiconductor wafers
Proceedings Papers

Stress Concentration and Surface Roughness Effect on Strength of Polycrystalline Silicon Structure

Shigeru Hamada, Shuichi Tani, Daisuke Katagiri, Masahiro Tsugai, Makio Horikawa, Hiroshi Otani
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1929-1934, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73169
https://doi.org/10.1115/IPACK2005-73169
View Paper titled, Stress Concentration and Surface Roughness Effect on Strength of Polycrystalline Silicon Structure
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Topics: Polysilicon, Stress concentration, Surface roughness, Stress, Design, Finite element methods, Finite element model, Quality control
Proceedings Papers

A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die

Richard C. Jaeger, Jeffrey C. Suhling, Yonggang Chen, Shahan Rahaman, M. Nokibul Islam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 845-851, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35276
https://doi.org/10.1115/IPACK2003-35276
View Paper titled, A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die
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Topics: Calibration, Sensors, Stress, Semiconductor wafers, Strips, Design, Dimensions, Finite element analysis, Geometry, Integrated circuit fabrication