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Proceedings Papers

Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface

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Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A032, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143310
https://doi.org/10.1115/IPACK2024-143310
View Paper titled, Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface
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Topics: Damage, Delamination, Displacement, Failure, Fracture (Materials), High temperature, Reliability, Stress
Proceedings Papers

Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces

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Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan, Madhu Kasturi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A031, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143308
https://doi.org/10.1115/IPACK2024-143308
View Paper titled, Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces
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Topics: Copper, Delamination, Diseases, Displacement, Electronics, Fracture (Materials), High temperature, Liver, Reliability, Stress
Proceedings Papers

Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses

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Mujahid Abbas Syed, Qiang Yu
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139572
https://doi.org/10.1115/IPACK2024-139572
View Paper titled, Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses
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Topics: Geometry, Printed circuit boards, Reliability, Stress, Thermomechanics
Proceedings Papers

Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity

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Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A028, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142108
https://doi.org/10.1115/IPACK2024-142108
View Paper titled, Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity
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Topics: Delamination, Fracture (Materials), Fracture toughness, High temperature, Stress
Proceedings Papers

Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

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Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A029, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142109
https://doi.org/10.1115/IPACK2024-142109
View Paper titled, Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure
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Topics: Delamination, Fracture toughness, High temperature, Reliability, Failure mechanisms, Semiconductors (Materials), Automobiles, Ball-Grid-Array packaging, Durability, Electronics
Proceedings Papers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

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Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
https://doi.org/10.1115/IPACK2024-141367
View Paper titled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
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Topics: Cooling, Heat flux, Heat, Data centers, Design, Flux (Metallurgy), Climate change, Construction, Design methodology, Energy consumption
Proceedings Papers

A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC

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David Geb, Subodh Deodhar, Nitin Netake, Tejas Jeurkar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140403
https://doi.org/10.1115/IPACK2024-140403
View Paper titled, A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC
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Topics: Simulation, Thermal management, Cooling, Design, Algorithms, Control equipment, Temperature, Heat, Integrated circuits, Sensors
Proceedings Papers

Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter

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Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141874
https://doi.org/10.1115/IPACK2024-141874
View Paper titled, Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter
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Topics: Filters, Low-pass filters, Reliability, Automobiles, Durability, Electronics, Adhesives, Computer software, Cutting, Engineering simulation
Proceedings Papers

Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder

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Golam Rakib Mazumder, Souvik Chakraborty, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A021, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141363
https://doi.org/10.1115/IPACK2024-141363
View Paper titled, Mechanical Characterization and Aging Behavior of iSAC Lead Free Solder
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Topics: Alloys, Creep, Elastic moduli, Lead-free solders, Nanoindentation, Stress
Proceedings Papers

Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads

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Debabrata Mondal, Jeffrey C. Suhling, Elham Mirkoohi, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112034
https://doi.org/10.1115/IPACK2023-112034
View Paper titled, Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads
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Topics: Crystals, Deformation, Dislocations, Plasticity, Shear (Mechanics), Stress
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

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Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
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Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing

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Whit Vinson, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111909
https://doi.org/10.1115/IPACK2023-111909
View Paper titled, Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing
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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress
Proceedings Papers

Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage

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Pradeep Lall, Mrinmoy Saha, Jeff Suhling, David Locker
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112036
https://doi.org/10.1115/IPACK2023-112036
View Paper titled, Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage
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Topics: Operating temperature, Solders, Storage, Alloys, Constitutive equations, Shock (Mechanics), Temperature, Aerospace industry, Automobiles, Climate
Proceedings Papers

Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework

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Pradeep Lall, Padmanava Choudhury, Aathi Raja Ram Pandurangan
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112014
https://doi.org/10.1115/IPACK2023-112014
View Paper titled, Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework
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Topics: Elastic moduli, Glass, Manufacturing, Resins, Stress, Tensile strength
Proceedings Papers

Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink

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Pradeep Lall, Sabina Bimali, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112066
https://doi.org/10.1115/IPACK2023-112066
View Paper titled, Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink
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Topics: Adhesives, Aerosols, Failure, Inks, Printing, Shear (Mechanics), Silver, Sintering, Stress, Sustainability
Proceedings Papers

Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions

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Collin Ruby, David R. Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113756
https://doi.org/10.1115/IPACK2023-113756
View Paper titled, Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions
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Topics: Reliability, Shear stress, Solder joints, Stress, Temperature
Proceedings Papers

Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage

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Pradeep Lall, Padmanava Choudhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112052
https://doi.org/10.1115/IPACK2023-112052
View Paper titled, Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage
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Topics: Fatigue failure, Storage, Failure, Reliability, Electronics, Temperature, Cycles, Fatigue, Flip-chip, Stress
Proceedings Papers

Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

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Michael Shanks, Uduak Inyang-Udoh, Neera Jain
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111816
https://doi.org/10.1115/IPACK2023-111816
View Paper titled, Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage
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Topics: Thermal energy storage, Thermal management, Transients (Dynamics), Control equipment, Heat, Simulation, Architecture, Computer cooling, Feedback, Fluids
Proceedings Papers

Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

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Josef Frankhouse, Jackson Marsh, Han Hu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111922
https://doi.org/10.1115/IPACK2023-111922
View Paper titled, Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors
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Topics: Acoustic emissions, Condition monitoring, Semiconductors (Materials), Sensors, Electric vertical take-off and landing aircraft, Electronics, Aircraft, Density, Electric vehicles, Electromagnetic interference
Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

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Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems