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Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94052
https://doi.org/10.1115/IPACK2022-94052
View Paper titled, Additive Manufacturing of Electronic Patterns for Harsh Environments
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74074
https://doi.org/10.1115/IPACK2021-74074
View Paper titled, Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration
Proceedings Papers

Health Monitoring of PCB’s Under Mechanical Shock Loads

Pradeep Lall, Tony Thomas, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A028, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6578
https://doi.org/10.1115/IPACK2019-6578
View Paper titled, Health Monitoring of PCB’s Under Mechanical Shock Loads
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Topics: Shock (Mechanics), Stress, Signals, Failure, Damping, Statistical analysis, Strain gages, Strain measurement
Proceedings Papers

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74239
https://doi.org/10.1115/IPACK2017-74239
View Paper titled, PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
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Topics: Stress, Temperature, Vibration, Failure, Signals, Time-frequency analysis, Algorithms, Independent component analysis, Dimensions, Filtration
Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74264
https://doi.org/10.1115/IPACK2017-74264
View Paper titled, Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT
Open the PDF for Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT in another window
Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating
Proceedings Papers

Highly Sensitive 2D Strain Sensor Using Carbon Nanotube

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73156
https://doi.org/10.1115/IPACK2013-73156
View Paper titled, Highly Sensitive 2D Strain Sensor Using Carbon Nanotube
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Topics: Carbon nanotubes, Strain sensors, Multi-walled carbon nanotubes, Electrical conductivity, Shapes, Chemical vapor deposition, Electrical resistance, Single-walled carbon nanotubes, Catalysts, Design
Proceedings Papers

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73126
https://doi.org/10.1115/IPACK2013-73126
View Paper titled, Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM
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Topics: Finite element methods, Reliability, Temperature, Finite element analysis, Resins, Electronic packages, Hardening (Curing), Heat, Integrated circuits, Materials properties
Proceedings Papers

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

Pradeep Lall, Geeta Limaye, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73246
https://doi.org/10.1115/IPACK2013-73246
View Paper titled, Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot
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Topics: Materials properties, Alloys, Temperature, Tin, Copper, Creep, Design, Elastic moduli, Electronics, Finite element model
Proceedings Papers

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 381-386, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52062
https://doi.org/10.1115/IPACK2011-52062
View Paper titled, Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin
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Topics: Carbon, Nanotubes, Resins, Sensors, Multi-walled carbon nanotubes, Carbon nanotubes, Electrical conductivity, Electrical resistance, Rubber, Single-walled carbon nanotubes
Proceedings Papers

Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 703-708, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52064
https://doi.org/10.1115/IPACK2011-52064
View Paper titled, Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain
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Topics: Carbon, Electrical conductivity, Nanotubes, Resins, Carbon nanotubes, Microwaves, Reflectance, Impedance (Electricity), Stress, Electrical properties
Proceedings Papers

Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin

Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 569-574, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89146
https://doi.org/10.1115/InterPACK2009-89146
View Paper titled, Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin
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Topics: Carbon, Nanotubes, Resins, Strain measurement, Carbon nanotubes, Electrical resistance, Waves, Electrical conductivity, Thermal conductivity, Thin films
Proceedings Papers

Nonlinear Response of a Printed Circuit Board in Shock

M. Vujosevic, P. Raghavan, G. Ramanathan, W. Hezeltine, K. Blue
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 45-54, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89094
https://doi.org/10.1115/InterPACK2009-89094
View Paper titled, Nonlinear Response of a Printed Circuit Board in Shock
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Topics: Printed circuit boards, Shock (Mechanics), Deformation, Stress, Lumber, Membranes, Metrology, Strain measurement, Finite element methods, Inertia (Mechanics)