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Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022

Paper No: IPACK2022-97382

DOI: https://doi.org/10.1115/IPACK2022-97382

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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage

Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021

Paper No: IPACK2021-74074

DOI: https://doi.org/10.1115/IPACK2021-74074

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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration

Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021

Paper No: IPACK2021-74570

DOI: https://doi.org/10.1115/IPACK2021-74570

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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress

Proceedings Papers

Health Monitoring of PCB’s Under Mechanical Shock Loads

Pradeep Lall, Tony Thomas, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A028, October 7–9, 2019

Paper No: IPACK2019-6578

DOI: https://doi.org/10.1115/IPACK2019-6578

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Topics: Shock (Mechanics), Stress, Signals, Failure, Damping, Statistical analysis, Strain gages, Strain measurement

Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018

Paper No: IPACK2018-8410

DOI: https://doi.org/10.1115/IPACK2018-8410

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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability

Proceedings Papers

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 29–September 1, 2017

Paper No: IPACK2017-74239

DOI: https://doi.org/10.1115/IPACK2017-74239

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Topics: Stress, Temperature, Vibration, Failure, Signals, Time-frequency analysis, Algorithms, Independent component analysis, Dimensions, Filtration

Proceedings Papers

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Jochen Hempel, Elena Zukowski, Michael Berndt, Sohaib Anees, Jürgen Wilde, Leonhard M. Reindl

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A004, July 16–18, 2013

Paper No: IPACK2013-73258

DOI: https://doi.org/10.1115/IPACK2013-73258

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Topics: Sensors, Surface acoustic waves, Strain sensors, Stress, Cycles, Temperature, Fatigue, Finite element methods, Finite element model, Signals

Proceedings Papers

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011

Paper No: IPACK2011-52063

DOI: https://doi.org/10.1115/IPACK2011-52063

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Topics: Flip-chip, Flip-chip devices, Mechanical properties, Stress, Copper, Silicon chips, Gages, Packaging, Sensors, Strain gages

Proceedings Papers

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

Masanori Yamagiwa, Masato Fujita, Qiang Yu, Hiromi Sugihara

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 849-855, July 19–23, 2009

Paper No: InterPACK2009-89284

DOI: https://doi.org/10.1115/InterPACK2009-89284

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Topics: Reliability, Shear (Mechanics), Temperature, Finite element analysis, Cycles, Displacement, Fatigue, Gallium nitride, Stress, Circuits

Proceedings Papers

Dominant Structural Factors of Local Residual Stress in Three-Dimensionally Stacked LSI Chips Mounted Using Flip Chip Technology

Nobuki Ueta, Hideo Miura

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 473-479, July 8–12, 2007

Paper No: IPACK2007-33402

DOI: https://doi.org/10.1115/IPACK2007-33402

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Topics: Flip-chip, Flip-chip devices, Stress, Stress concentration, Reliability, Strain gages

Proceedings Papers

A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application

Shaw Fong Wong, Wei Keat Loh, Yung Hsiang Lee, Eng Hooi Yap, Siang Woen Wong, Tze Yang Hin

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1441-1447, July 17–22, 2005

Paper No: IPACK2005-73215

DOI: https://doi.org/10.1115/IPACK2005-73215

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Topics: Ball-Grid-Array packaging, Dynamic response, Flip-chip, Flip-chip devices, Fracture (Materials), Risk, Solder joints, Accelerometers, Computer software, Design

Proceedings Papers

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Greg Heaslip, Jeff Punch, Bryan Rogers, Claire Ryan, Michael Reid

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1283-1291, July 17–22, 2005

Paper No: IPACK2005-73366

DOI: https://doi.org/10.1115/IPACK2005-73366

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Topics: Ball-Grid-Array packaging, Failure, Failure analysis, Lead-free solders, Solders, Stress, Testing, Data acquisition systems, Design, Electronic components

Proceedings Papers

Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

Nobuki Ueta, Hideo Miura

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1135-1140, July 17–22, 2005

Paper No: IPACK2005-73112

DOI: https://doi.org/10.1115/IPACK2005-73112

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Topics: Flip-chip, Flip-chip devices, Stress, Sensors, Silicon chips, Strain gages, Finite element analysis, Gages, Polysilicon, Semiconductor wafers

NARROW

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Health Monitoring of PCB’s Under Mechanical Shock Loads

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

Dominant Structural Factors of Local Residual Stress in Three-Dimensionally Stacked LSI Chips Mounted Using Flip Chip Technology

A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

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