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Proceedings Papers

Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation

Taher Meydando, Nazli Donmezer
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73648
https://doi.org/10.1115/IPACK2021-73648
View Paper titled, Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation
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Topics: Phonons, Spectroscopy, Thermal conductivity, Thin films
Proceedings Papers

Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature

Pradeep Lall, Yihua Luo, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74325
https://doi.org/10.1115/IPACK2017-74325
View Paper titled, Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
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Topics: Aluminum, Copper, Electronics, High temperature, Ionic mobility, Wire, Corrosion, Diffusion (Physics), Gates (Closures), Bonding
Proceedings Papers

MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore

Takumu Kitani, Tatiana Zolotoukhina
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48298
https://doi.org/10.1115/IPACK2015-48298
View Paper titled, MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore
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Topics: DNA, Graphene, Infrared spectra, Nanopores, Atoms, Spectra (Spectroscopy), Resolution (Optics), Spectroscopy, Density, Fingerprints
Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48639
https://doi.org/10.1115/IPACK2015-48639
View Paper titled, Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
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Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation
Proceedings Papers

Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging

Maaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73317
https://doi.org/10.1115/IPACK2013-73317
View Paper titled, Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
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Topics: Packaging, Semiconductor wafers, Silicon, Stress, Tin, Vehicles, Bonding, Modeling, Transistors, Bolometers
Proceedings Papers

Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects

Pradeep Lall, Yihua Luo
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73308
https://doi.org/10.1115/IPACK2013-73308
View Paper titled, Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects
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Topics: Spectroscopy, Wire
Proceedings Papers

PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 549-562, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52197
https://doi.org/10.1115/IPACK2011-52197
View Paper titled, PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments
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Topics: Filters, Particulate matter, Shock (Mechanics), Spectroscopy, Vibration, Damage, Failure, Service life (Equipment), Algorithms, Electronics
Proceedings Papers

Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads

Pradeep Lall, Ryan Lowe, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 903-914, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89308
https://doi.org/10.1115/InterPACK2009-89308
View Paper titled, Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads
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Topics: Electrochemical impedance spectroscopy, Electronics, Shock (Mechanics), Stress, Vibration, Damage, Spectroscopy, Failure, Solders, Condition monitoring
Proceedings Papers

Transient-Response Spectral Analysis Based Feature Extraction for Built-In Reliability Test of Electronics Under Shock Loads

Pradeep Lall, Prakriti Choudhary, Sameep Gupte, Prashant Gupta, Jeff Suhling, James Hofmeister
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 179-197, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33872
https://doi.org/10.1115/IPACK2007-33872
View Paper titled, Transient-Response Spectral Analysis Based Feature Extraction for Built-In Reliability Test of Electronics Under Shock Loads
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Topics: Electronics, Emission spectroscopy, Feature extraction, Reliability, Shock (Mechanics), Spectroscopy, Stress, Time-frequency analysis, Transients (Dynamics)
Proceedings Papers

Intermetallic Effects of Electroplated Lead-Free Solder Bumps Using a Novel Single Chamber Electroplating Process for Large Diameter Wafers

J. Teye Brown, Ajay M. Popat, Chad B. O’Neal, Yixiang Xie
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 743-748, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33906
https://doi.org/10.1115/IPACK2007-33906
View Paper titled, Intermetallic Effects of Electroplated Lead-Free Solder Bumps Using a Novel Single Chamber Electroplating Process for Large Diameter Wafers
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Topics: Electroplating, Intermetallic compounds, Lead-free solders, Semiconductor wafers, Solders, Alloys, Polishing, Cross section (Physics), Electrons, Flux (Metallurgy)
Proceedings Papers

Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging

Chin Hock Toh, Arun Raman, Thomas Fitzgerald, Madhuri Narkhede, Alfred A. La Mar, Dennis Prem Kumar Chandran
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 979-984, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33505
https://doi.org/10.1115/IPACK2007-33505
View Paper titled, Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging
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Topics: Flip-chip, Flip-chip devices, Gold plating, Packaging, Reliability, Plating, Solders, Soldering, Corners (Structural elements), Cycles
Proceedings Papers

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Greg Heaslip, Jeff Punch, Bryan Rogers, Claire Ryan, Michael Reid
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1283-1291, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73366
https://doi.org/10.1115/IPACK2005-73366
View Paper titled, A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli
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Topics: Ball-Grid-Array packaging, Failure, Failure analysis, Lead-free solders, Solders, Stress, Testing, Data acquisition systems, Design, Electronic components
Proceedings Papers

Characterization of Novolac Based Photoresists to Fabricate 3D Polymer Dome Features

Sriram Muthukumar, Tom W. Miller, Balu Pathangey, Neha M. Patel, Charles D. Hill
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1863-1868, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73300
https://doi.org/10.1115/IPACK2005-73300
View Paper titled, Characterization of Novolac Based Photoresists to Fabricate 3D Polymer Dome Features
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Topics: Domes (Structural elements), Photoresists, Polymers, Shapes, Cylinders, Deformation, Evaporation, Fourier transform infrared spectroscopy, Fourier transforms, Gas chromatography