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Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

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Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6429
https://doi.org/10.1115/IPACK2019-6429
View Paper titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles
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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

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Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74278
https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

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Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74028
https://doi.org/10.1115/IPACK2017-74028
View Paper titled, Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling
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Topics: Cooling, Failure, Water, Energy consumption, Fans, Pumps, Data centers, Density, Heat, Redundancy (Engineering)
Proceedings Papers

Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

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Michael J. Ellsworth, Jr., Levi A. Campbell
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48324
https://doi.org/10.1115/IPACK2015-48324
View Paper titled, Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness
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Topics: Cooling, Thermal resistance, Heat sinks, Density, Flow (Dynamics), Fluids, Heat exchangers, Pressure, Specific heat, Water
Proceedings Papers

Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants

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Sheng-Fu Mei, Zhong-Shan Deng, Jing Liu
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48318
https://doi.org/10.1115/IPACK2015-48318
View Paper titled, Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants
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Topics: Coolants, Heat sinks, Liquid metals, Microchannels, Water, Cooling, Electronics, Flow (Dynamics), Specific heat, Computer cooling
Proceedings Papers

Experimental Measurement of Server Thermal Effectiveness for Compact Transient Data Center Models

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James W. VanGilder, Zachary M. Pardey, Xuanhang (Simon) Zhang, Christopher Healey
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73155
https://doi.org/10.1115/IPACK2013-73155
View Paper titled, Experimental Measurement of Server Thermal Effectiveness for Compact Transient Data Center Models
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Topics: Data centers, Transients (Dynamics), Heat, Computational fluid dynamics, Cooling, Fluctuations (Physics), Heat sinks, Specific heat, Temperature
Proceedings Papers

Multi-Physics of Nanoscale Thin Films and Interfaces

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M. A. Haque
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 375-379, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52038
https://doi.org/10.1115/IPACK2011-52038
View Paper titled, Multi-Physics of Nanoscale Thin Films and Interfaces
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Topics: Nanoscale phenomena, Physics, Thin films, Electrical conductivity, Thermal conductivity, Deformation, Design, Dimensions, Electron microscopes, Electrons
Proceedings Papers

Numerical Calculation for Phonon Properties of a Nano-Porous Si

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Koji Miyazaki, Daisuke Nagai, Yohei Kido, Hiroshi Tsukamoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 557-561, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89118
https://doi.org/10.1115/InterPACK2009-89118
View Paper titled, Numerical Calculation for Phonon Properties of a Nano-Porous Si
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Topics: Phonons, Fourier transforms, Thermal conductivity, Boundary-value problems, Crystals, Density, Heat conduction, Mean free path, Molecular dynamics simulation, Nanostructures
Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

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Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89218
https://doi.org/10.1115/InterPACK2009-89218
View Paper titled, Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials
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Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation
Proceedings Papers

Thermal Policies and Active Workload Migration Within Data Centers

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Cullen Bash, Chris Hyser, Christopher Hoover
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 673-679, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89038
https://doi.org/10.1115/InterPACK2009-89038
View Paper titled, Thermal Policies and Active Workload Migration Within Data Centers
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Topics: Data centers, Energy consumption, Heat capacity, Specific heat, Cooling, Emissions, Energy generation, Machinery
Proceedings Papers

Subcooled Flow Boiling in Mini and Micro Channel: Contribution Toward High Heat Flux Cooling Technology for Electronics

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Tomoyuki Nomura, Michael V. Shustov, Koichi Suzuki, Chungpyo Hong, Yury A. Kuzma-Kichta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 335-340, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89100
https://doi.org/10.1115/InterPACK2009-89100
View Paper titled, Subcooled Flow Boiling in Mini and Micro Channel: Contribution Toward High Heat Flux Cooling Technology for Electronics
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Topics: Boiling, Cooling, Electronics, Flow (Dynamics), Heat flux, Microchannels, Subcooling, Heating, Critical heat flux, Emissions
Proceedings Papers

Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites

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Ravi Bollina, Janet Landgraf, Hannes Wagner, Robert Wilhelm, Sven Knippscheer, Gerhard Mitic, Svetlana Levchuck
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 389-397, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33028
https://doi.org/10.1115/IPACK2007-33028
View Paper titled, Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites
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Topics: Composite materials, Diamonds, Metals, Reliability, Testing, Pressure, Thermal diffusivity, Thermal properties, Aluminum, Aluminum alloys
Proceedings Papers

Transient Performance of a Finned PCM Heat Sink

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V. Shatikian, G. Ziskind, R. Letan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 137-142, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73113
https://doi.org/10.1115/IPACK2005-73113
View Paper titled, Transient Performance of a Finned PCM Heat Sink
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Topics: Heat sinks, Transients (Dynamics), Temperature, Melting, Fins, Phase change materials, Aluminum, Computer simulation, Density, Heat
Proceedings Papers

The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows

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Masaru Ishizuka, Shinji Nakagawa, Toru Honma
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 11-18, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73011
https://doi.org/10.1115/IPACK2005-73011
View Paper titled, The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows
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Topics: Air flow, Heat sinks, Mixed convection, Temperature, Convection, Design, Specific heat, Wind tunnels, Cooling, Forced convection
Proceedings Papers

Testing the Thermal Resistance and Power Capacity of Production Heat Pipes

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Sukhvinder Kang, Randy Cook, Dave Gailus
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 635-640, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73445
https://doi.org/10.1115/IPACK2005-73445
View Paper titled, Testing the Thermal Resistance and Power Capacity of Production Heat Pipes
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Topics: Heat pipes, Testing, Thermal resistance, Heat, Heat sinks, Manufacturing, Design, Pipes, Specific heat, Air flow
Proceedings Papers

Design of a Low-Cost Infrared Sensor Array Through Thermal System Modeling

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Brian R. Smith, Cristina Amon
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 513-519, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35277
https://doi.org/10.1115/IPACK2003-35277
View Paper titled, Design of a Low-Cost Infrared Sensor Array Through Thermal System Modeling
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Topics: Design, Modeling, Sensors, Thermal systems, Thermal properties, Manufacturing, Signals, Silicon, Computer simulation, Electronics
Proceedings Papers

Numerical Calculation of Heat Transfer Coefficient of Liquid Flow With NPCM in Microchannels

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Y. L. Hao, Y.-X. Tao
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 449-459, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35224
https://doi.org/10.1115/IPACK2003-35224
View Paper titled, Numerical Calculation of Heat Transfer Coefficient of Liquid Flow With NPCM in Microchannels
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Topics: Flow (Dynamics), Heat transfer coefficients, Microchannels, Heat transfer, Laminar flow, Particulate matter, Computational fluid dynamics, Computer simulation, Computers, Ducts