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Proceedings Papers
Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141036
Proceedings Papers
Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140062
Proceedings Papers
Effect of Bismuth Concentration on the High Strain Rate Characteristics of Sn-Ag-Cu Solders and Analysis of High-g Level Shock Damage During Extended Sustained Operation at 100°C
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A024, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141850
Proceedings Papers
Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A023, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141845
Proceedings Papers
Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141356
Proceedings Papers
Enabling Reduced Footprint SMT Components in IC Packages: A Simulation-Based Approach for Solder Paste Volume Optimization
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A034, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-149381
Proceedings Papers
Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141249
Proceedings Papers
Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
Proceedings Papers
Quick Turn Methodology for High Temperature Solder Fatigue Reliability
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113999
Proceedings Papers
Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111909
Proceedings Papers
Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112036
Proceedings Papers
Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
Proceedings Papers
Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111984
Proceedings Papers
High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100°C Sustained Operation Up to 1-Year
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111981
Proceedings Papers
Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-93878
Proceedings Papers
Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
Proceedings Papers
High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
Proceedings Papers
Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods
Available to PurchaseYangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
Proceedings Papers
Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97433
Proceedings Papers
Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
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