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Proceedings Papers

Application of the Reflowable Magnetic Jig on Thin MCM Package for Warpage Control

Jong-Chan Park, Young-Min Kim, Gil-Ho Lee, Hyeong-Kwan Kim, Tae-Keun Lee
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109453
https://doi.org/10.1115/IPACK2023-109453
View Paper titled, Application of the Reflowable Magnetic Jig on Thin MCM Package for Warpage Control
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Topics: Jigs and fixtures, Shades and shadows, Soldering, Warping
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8386
https://doi.org/10.1115/IPACK2018-8386
View Paper titled, Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
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Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74017
https://doi.org/10.1115/IPACK2017-74017
View Paper titled, An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow
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Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

Modeling the Reflow Soldering Process in PCB’s

João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48720
https://doi.org/10.1115/IPACK2015-48720
View Paper titled, Modeling the Reflow Soldering Process in PCB’s
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Topics: Alloys, Computational fluid dynamics, Computer software, Copper, Enthalpy, Fluids, Geometry, Heat of fusion, Materials properties, Melting
Proceedings Papers

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

Ah-Young Park, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73280
https://doi.org/10.1115/IPACK2013-73280
View Paper titled, A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method
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Topics: Compression, Copper, Finite element methods, Fracture mechanics, Bonding, Fracture (Materials), Solders, Density, Joining, Temperature
Proceedings Papers

CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)

Kazunori Inagaki, Shinji Nakagawa, Tomoyuki Hatakeyama, Koichi Ishikura, Katsuhiro Koizumi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A022, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73275
https://doi.org/10.1115/IPACK2013-73275
View Paper titled, CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)
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Topics: Computational fluid dynamics, Simulation, Wave soldering, Solders, Computer software, Electronics, Flow (Dynamics), Fluids, Melting, Melting point
Proceedings Papers

High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion

Rogie I. Rodriguez, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 9-17, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52049
https://doi.org/10.1115/IPACK2011-52049
View Paper titled, High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion
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Topics: High temperature, Low temperature, Temperature, Tin, Diffusion (Physics), Melting point, Bonding, Electromechanical devices, Electronic packaging, Electronics
Proceedings Papers

Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component

Kanji Takagi, Qiang Yu, Tadahiro Shibutani, Hiroki Miyauchi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1-8, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89019
https://doi.org/10.1115/InterPACK2009-89019
View Paper titled, Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component
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Topics: Process simulation, Shapes, Solder joints, Reliability, Electronic components, Manufacturing, Simulation, Surface tension, Crack propagation, Design
Proceedings Papers

Characterizing and Minimizing Voids in Quad Flat No-Lead Pack (QFN) Device Assembly Using Pb-Free Solder Alloys

Rangaraj Dhanasekaran, Harish Gadepalli, S. Manian Ramkumar, Tim Jensen, Ed Briggs
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 39-47, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89304
https://doi.org/10.1115/InterPACK2009-89304
View Paper titled, Characterizing and Minimizing Voids in Quad Flat No-Lead Pack (QFN) Device Assembly Using Pb-Free Solder Alloys
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Topics: Alloys, Lead-free solders, Manufacturing, Solders, Electronic packaging, Energy dissipation, Heat, Soldering, Surface mount assemblies
Proceedings Papers

Material Behavior of Mixed Formulation Solder Joints

Yifei Zhang, Kanth Kurumaddali, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 335-346, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89003
https://doi.org/10.1115/InterPACK2009-89003
View Paper titled, Material Behavior of Mixed Formulation Solder Joints
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Topics: Solder joints, Solders, Alloys, Tin, Ball-Grid-Array packaging, Creep, Mechanical properties, Temperature, Electronics, Manufacturing industry
Proceedings Papers

Modelling the Reliability of Components on Flexible Substrates

J. Rizvi, C. Yin, C. Bailey, H. Lu
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 375-380, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33820
https://doi.org/10.1115/IPACK2007-33820
View Paper titled, Modelling the Reliability of Components on Flexible Substrates
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Topics: Modeling, Reliability, Aerospace industry, Computers, Copper, Design, Dielectric materials, Flexible electronics, Manufacturing, Packaging
Proceedings Papers

Optimizing the Cycle Time of a Multi-Spindle Pick-and-Place Machine

Ashok Thiagarajan, Purushothaman Damodaran, Krishnaswami Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 931-936, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33808
https://doi.org/10.1115/IPACK2007-33808
View Paper titled, Optimizing the Cycle Time of a Multi-Spindle Pick-and-Place Machine
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Topics: Cycles, Machinery, Assembly lines, Computer software, Lumber, Nozzles, Solders, Electronics, Manufacturing, Ovens
Proceedings Papers

Pb-Free Process Development for a High End Storage Area Network Application

Sunil Gopakumar, Francois Billaut, Eric Fremd, Manthos Economou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 937-943, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33857
https://doi.org/10.1115/IPACK2007-33857
View Paper titled, Pb-Free Process Development for a High End Storage Area Network Application
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Topics: Alloys, Cycles, Electronic products, Finishes, High temperature, Laminates, Lead-free solders, Lumber, Manufacturing, Optimization
Proceedings Papers

Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging

Chin Hock Toh, Arun Raman, Thomas Fitzgerald, Madhuri Narkhede, Alfred A. La Mar, Dennis Prem Kumar Chandran
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 979-984, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33505
https://doi.org/10.1115/IPACK2007-33505
View Paper titled, Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging
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Topics: Flip-chip, Flip-chip devices, Gold plating, Packaging, Reliability, Plating, Solders, Soldering, Corners (Structural elements), Cycles
Proceedings Papers

Thermal Characteristics of LED Light Source in Flat Panel Display Backlight System

Sung Ki Kim, Joon Kang, Seo Young Kim
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 273-276, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33913
https://doi.org/10.1115/IPACK2007-33913
View Paper titled, Thermal Characteristics of LED Light Source in Flat Panel Display Backlight System
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Topics: Light sources, Reliability, Temperature, Convection, Electrodes, Failure, Heat, Light-emitting diodes, Operating temperature, Soldering
Proceedings Papers

Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys

Changqing Liu, David A. Hutt, Dezhi Li, Paul P. Conway
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1819-1825, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73160
https://doi.org/10.1115/IPACK2005-73160
View Paper titled, Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys
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Topics: Alloys, Lead-free solders, Nickel, Coatings, Tin, Storage, Temperature, Testing, Copper, Mechanical properties
Proceedings Papers

Newly Developed Real Time Monitoring System for Ionic Migration by Means of Quartz Crystal Microbalance (QCM) and Electrochemical Impedance Spectroscopy (EIS)

Sachio Yoshihara
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 735-739, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35081
https://doi.org/10.1115/IPACK2003-35081
View Paper titled, Newly Developed Real Time Monitoring System for Ionic Migration by Means of Quartz Crystal Microbalance (QCM) and Electrochemical Impedance Spectroscopy (EIS)
Open the PDF for Newly Developed Real Time Monitoring System for Ionic Migration by Means of Quartz Crystal Microbalance (QCM) and Electrochemical Impedance Spectroscopy (EIS) in another window
Topics: Electrochemical impedance spectroscopy, Monitoring systems, Quartz crystals, Tin, Copper, Lead-free solders, Plating, Reliability, Solders, Iron