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Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6584
https://doi.org/10.1115/IPACK2019-6584
View Paper titled, Folding-Reliability of Flexible Electronics in Wearable Applications
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Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin
Proceedings Papers

Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices

Tannaz Harirchian, Zuyang Frank Liang, Kyle Yazzie, Michael A. Schroeder, Ashish Gupta, Alan C. Mcallister
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48367
https://doi.org/10.1115/IPACK2015-48367
View Paper titled, Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices
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Topics: Boundary-value problems, Data collection, Design, Junctions, Reliability, Simulation, Skin, Solder joints, Stress, Temperature
Proceedings Papers

Users’ Thermal Response to a Simulated Tablet Computer Surface

Han Zhang, Alan Hedge, Beiyuan Guo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48787
https://doi.org/10.1115/IPACK2015-48787
View Paper titled, Users’ Thermal Response to a Simulated Tablet Computer Surface
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Topics: Computers, Temperature, Engineering prototypes, Heat, Heating, Aluminum, Design, Sensors, Skin
Proceedings Papers

A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment

Yichao Yang, Jiayue Shen, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48134
https://doi.org/10.1115/IPACK2015-48134
View Paper titled, A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment
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Topics: Biological tissues, Microfluidics, Tactile sensors, Sensors, Deflection, Transducers, Elasticity, Electrolytes, Phantoms, Power presses
Proceedings Papers

Experimental and Analytical Study of Micro-Serrations on Surgical Blades

Marco Giovannini, Newell Moser, Kornel Ehmann
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48046
https://doi.org/10.1115/IPACK2015-48046
View Paper titled, Experimental and Analytical Study of Micro-Serrations on Surgical Blades
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Topics: Blades, Surgery, Cutting, Biological tissues, Finite element methods, Friction, Biomedicine, Laser ablation, Machining, Skin
Proceedings Papers

Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics

Matt Yaquinto, Richard Wirtz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 887-896, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89237
https://doi.org/10.1115/InterPACK2009-89237
View Paper titled, Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics
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Topics: Cooling, Electronics, Phase transition temperature, Power density, Thermal energy storage, Storage, Flat heat pipes, Phase change materials, Skin, Temperature
Proceedings Papers

Ergonomic Temperature Limits for Handheld Electronic Devices

Mulugeta K. Berhe
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1041-1047, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33873
https://doi.org/10.1115/IPACK2007-33873
View Paper titled, Ergonomic Temperature Limits for Handheld Electronic Devices
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Topics: Flow (Dynamics), Heat, Skin, Temperature
Proceedings Papers

Surface Finish Effects on High-Speed Interconnects

Xin Wu, Omar M. Ramahi, Gary A. Brist, Donald P. Cullen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 43-46, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35332
https://doi.org/10.1115/IPACK2003-35332
View Paper titled, Surface Finish Effects on High-Speed Interconnects
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Topics: Finishes, Signals, Finite element methods, Strip transmission lines, Geometry, Printed circuit boards, Simulation, Skin, Solders, Waves