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Proceedings Papers
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141879
Proceedings Papers
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140062
Proceedings Papers
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141871
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111312
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112066
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112058
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113208
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
Proceedings Papers
Hua Xu, Jeffery C. C. Lo, Xing Qiu, Yuanjie Cheng, Mian Tao, S. W. Ricky Lee, Lawrence C. L. Ko, Ho Ki Yeung, Chun Ho Yau
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111648
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113792
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111958
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111957
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112064
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112063
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111980
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97363
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97437
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