Search Results | InterPACK | ASME Digital Collection

1-20 of 55

2 3

Sort by

Sort Order Select

Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021

Paper No: IPACK2021-74066

DOI: https://doi.org/10.1115/IPACK2021-74066

View Paper

Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance

Proceedings Papers

Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application

Ming-Han Zhuang, Teny Shih, David Lai, Yu-Po Wang

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 26–28, 2021

Paper No: IPACK2021-66660

DOI: https://doi.org/10.1115/IPACK2021-66660

View Paper

Topics: Ball-Grid-Array packaging, Cloud computing, Internet, Signals

Proceedings Papers

Material Impact With Package Solution for 5G RF Application

Po Yuan (James) Su, Yu Po Wang, Yu Cheng Pai, Ying Wei Lu, Teny Shih, Andrew Kang, David Lai, Don Son Jiang

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 27–29, 2020

Paper No: IPACK2020-2507

DOI: https://doi.org/10.1115/IPACK2020-2507

View Paper

Topics: Design, Millimeter waves, Signals, System architecture

Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019

Paper No: IPACK2019-6417

DOI: https://doi.org/10.1115/IPACK2019-6417

View Paper

Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing

Proceedings Papers

Health Monitoring of PCB’s Under Mechanical Shock Loads

Pradeep Lall, Tony Thomas, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A028, October 7–9, 2019

Paper No: IPACK2019-6578

DOI: https://doi.org/10.1115/IPACK2019-6578

View Paper

Topics: Shock (Mechanics), Stress, Signals, Failure, Damping, Statistical analysis, Strain gages, Strain measurement

Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019

Paper No: IPACK2019-6372

DOI: https://doi.org/10.1115/IPACK2019-6372

View Paper

Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics

Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019

Paper No: IPACK2019-6514

DOI: https://doi.org/10.1115/IPACK2019-6514

View Paper

Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption

Proceedings Papers

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Junye Li, Zhao-zan Feng, Wei Li, Hua Zhu, Kuang Sheng

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A021, August 27–30, 2018

Paper No: IPACK2018-8447

DOI: https://doi.org/10.1115/IPACK2018-8447

View Paper

Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Visualization, Nucleate boiling, Bubbles, Fluids, Flux (Metallurgy), Heat

Proceedings Papers

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Pradeep Lall, Tony Thomas

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 27–30, 2018

Paper No: IPACK2018-8356

DOI: https://doi.org/10.1115/IPACK2018-8356

View Paper

Topics: Damage assessment, Electronics, Temperature, Vibration, Damage, Failure, Signals, Safety, High temperature, Principal component analysis

Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017

Paper No: IPACK2017-74058

DOI: https://doi.org/10.1115/IPACK2017-74058

View Paper

Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics

Proceedings Papers

Peel-and-Stick Sensors Powered by Directed RF Energy

Christopher Lalau-Keraly, George Daniel, Joseph Lee, David Schwartz

Paper No: IPACK2017-74150

DOI: https://doi.org/10.1115/IPACK2017-74150

View Paper

Topics: Sensors, Building management systems, Design, Dimensions, Energy harvesting, Flexible electronics, Signals, Temperature

Proceedings Papers

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas

Paper No: IPACK2017-74239

DOI: https://doi.org/10.1115/IPACK2017-74239

View Paper

Topics: Stress, Temperature, Vibration, Failure, Signals, Time-frequency analysis, Algorithms, Independent component analysis, Dimensions, Filtration

Proceedings Papers

Edge Computing and Contextual Information for the Internet of Things Sensors

Lavanya Turlapati, Nigel Hinds, Dhruv Nair, Levente J. Klein

Paper No: IPACK2017-74304

DOI: https://doi.org/10.1115/IPACK2017-74304

View Paper

Topics: Internet of things, Sensors, Wind, Computation, Internet, Methane, Modeling, Plumes (Fluid dynamics), Sensor placement, Signals

Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017

Paper No: IPACK2017-74208

DOI: https://doi.org/10.1115/IPACK2017-74208

View Paper

Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles

Proceedings Papers

MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore

Takumu Kitani, Tatiana Zolotoukhina

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A005, July 6–9, 2015

Paper No: IPACK2015-48298

DOI: https://doi.org/10.1115/IPACK2015-48298

View Paper

Topics: DNA, Graphene, Infrared spectra, Nanopores, Atoms, Spectra (Spectroscopy), Resolution (Optics), Spectroscopy, Density, Fingerprints

Proceedings Papers

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Pavan Rajmane, Fahad Mirza, Hassaan Khan, Dereje Agonafer

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A009, July 6–9, 2015

Paper No: IPACK2015-48811

DOI: https://doi.org/10.1115/IPACK2015-48811

View Paper

Topics: Circuits, Damage, Electronics, Energy dissipation, Gates (Closures), Graphics processing units, Heating, Joules, Manufacturing, Modeling

Proceedings Papers

Challenges and Opportunities in Thermal Management of Multi-Chip Packages

Hemanth K. Dhavaleswarapu, Chandra Mohan Jha, Susan F. Smith, Shrenik Kothari, Baris Bicen, Sanjoy K. Saha, Ashish Gupta

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A084, July 6–9, 2015

Paper No: IPACK2015-48362

DOI: https://doi.org/10.1115/IPACK2015-48362

View Paper

Topics: Density, Manufacturing, Reliability, Signals, Thermal management

Proceedings Papers

MEMS Die Warpage During Curing of Die Attach Material

Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue

Paper No: IPACK2015-48010

DOI: https://doi.org/10.1115/IPACK2015-48010

View Paper

Topics: Hardening (Curing), Microelectromechanical systems, Warping, Materials properties, Finite element analysis, Manufacturing, Shrinkage (Materials), Stress, Adhesives, Glass transition

Proceedings Papers

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

A. Baniya, S. Thapa, E. Borquist, D. Bailey, D. Wood, G. Dutta, P. Arumugam, J. Glawe, C. Kevil, L. Weiss

Paper No: IPACK2015-48491

DOI: https://doi.org/10.1115/IPACK2015-48491

View Paper

Topics: Biomedicine, Hydrogen, Electrodes, Oxidation, Blood, Calibration, Chemistry, Diseases, Plasma desorption mass spectrometry, Plasmas (Ionized gases)

Proceedings Papers

CMUTs in Permanent Contact Operation for High Output Pressure

Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub

Paper No: IPACK2015-48733

DOI: https://doi.org/10.1115/IPACK2015-48733

View Paper

Topics: Pressure, Transducers, Acoustics, Cavities, Ultrasonic transducers, Bonding, Cycles, Deflection, Displacement, High temperature

2 3

NARROW

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application

Material Impact With Package Solution for 5G RF Application

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Health Monitoring of PCB’s Under Mechanical Shock Loads

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Peel-and-Stick Sensors Powered by Directed RF Energy

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Edge Computing and Contextual Information for the Internet of Things Sensors

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Challenges and Opportunities in Thermal Management of Multi-Chip Packages

MEMS Die Warpage During Curing of Die Attach Material

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

CMUTs in Permanent Contact Operation for High Output Pressure

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only