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Proceedings Papers

Evaluation of Warpage Deformation in Semiconductor Device Packaging Process

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Taiju Yagi, Qiang Yu, Haruyuki Shimada, Yuichi Yanaka, Takashi Masuko
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140852
https://doi.org/10.1115/IPACK2024-140852
View Paper titled, Evaluation of Warpage Deformation in Semiconductor Device Packaging Process
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Topics: Deformation, Finite element methods, Resins, Semiconductor device packaging, Semiconductors (Materials), Warping, Packaging, Shrinkage (Materials), Simulation, Anisotropy
Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

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Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
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Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

MEMS Die Warpage During Curing of Die Attach Material

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Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48010
https://doi.org/10.1115/IPACK2015-48010
View Paper titled, MEMS Die Warpage During Curing of Die Attach Material
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Topics: Hardening (Curing), Microelectromechanical systems, Warping, Materials properties, Finite element analysis, Manufacturing, Shrinkage (Materials), Stress, Adhesives, Glass transition
Proceedings Papers

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

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Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48086
https://doi.org/10.1115/IPACK2015-48086
View Paper titled, Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage
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Topics: Adhesives, Shrinkage (Materials), Storage, Finite element analysis, Sensors, Viscoelasticity, Epoxy adhesives, Epoxy resins, MEMS packaging, Microelectromechanical systems
Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

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Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73149
https://doi.org/10.1115/IPACK2013-73149
View Paper titled, Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films
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Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries
Proceedings Papers

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

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Ridvan A. Sahan, Rahima K. Mohammed, Amy Xia, Ying-Feng Pang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 311-318, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52225
https://doi.org/10.1115/IPACK2011-52225
View Paper titled, Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs
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Topics: Cooling, Graphics processing units, Diamonds, Fins, Water, Design, Flow (Dynamics), Coolers, Electrolytic corrosion, Metals
Proceedings Papers

Silicon Hot Spot Remediation With a Germanium Self Cooling Layer

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Horacio Nochetto, Peng Wang, Avram Bar-Cohen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 319-326, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52229
https://doi.org/10.1115/IPACK2011-52229
View Paper titled, Silicon Hot Spot Remediation With a Germanium Self Cooling Layer
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Topics: Cooling, Germanium, Silicon, Silicon chips, Temperature, Engineering simulation, Shrinkage (Materials), Simulation, Thermal conductivity, Thermal management
Proceedings Papers

A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin

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Hiroyuki Sato, Qiang Yu, Ryusuke Sone
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 185-190, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52101
https://doi.org/10.1115/IPACK2011-52101
View Paper titled, A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin
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Topics: Hardening (Curing), Mechanical properties, Resins, Thermal deformation, Aluminum, Warping, Deformation, Elastic moduli, Reliability, Semiconductors (Materials)
Proceedings Papers

System Level Thermal Design Challenges in Validation Platforms

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Rahima K. Mohammed, Ridvan A. Sahan, Ying-Feng Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1077-1086, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89412
https://doi.org/10.1115/InterPACK2009-89412
View Paper titled, System Level Thermal Design Challenges in Validation Platforms
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Topics: Design, Cooling, Engineering simulation, Simulation, Computational fluid dynamics, Semiconductor industry, Silicon, Acoustics, Cables, Heating
Proceedings Papers

Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation

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Tz-Cheng Chiu, Je-Li Kung, Yi-Shao Lai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89040
https://doi.org/10.1115/InterPACK2009-89040
View Paper titled, Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation
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Topics: Molding, Simulation, Viscoelasticity, Warping, Ball-Grid-Array packaging, Finite element analysis, Temperature, Constitutive equations, Cooling, Epoxy adhesives
Proceedings Papers

Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV

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Jun Taniguchi, Shin-ichi Satake, Noriyuki Unno, Takahiro Kanai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 593-597, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89220
https://doi.org/10.1115/InterPACK2009-89220
View Paper titled, Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV
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Topics: Lithography, Ultraviolet radiation, Resins, Hardening (Curing), Errors, Fluids, Nanofabrication, Particulate matter, Resolution (Optics), Shrinkage (Materials)
Proceedings Papers

Assessment of 20 Micrometer Diameter Wires for Wire Bond Interconnect Technology

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S. Saiyed, S. A. Kudtarkar, R. Murcko, K. Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 923-930, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33691
https://doi.org/10.1115/IPACK2007-33691
View Paper titled, Assessment of 20 Micrometer Diameter Wires for Wire Bond Interconnect Technology
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Topics: Wire, Bonding, Reliability, High temperature, Stress, Aluminum, Bond strength, Catalysts, Mechanical testing, Shear (Mechanics)
Proceedings Papers

An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging

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M. Y. Tsai, C. Y. Huang, C. Y. Chiang, C. Y. Wu, S. S. Yang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 711-717, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33967
https://doi.org/10.1115/IPACK2007-33967
View Paper titled, An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging
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Topics: Adhesives, Diffusion (Physics), Electronic packaging, Temperature, Shrinkage (Materials), Stress, Finite element methods, Relaxation (Physics), Design, Hardening (Curing)
Proceedings Papers

Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet

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Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 465-472, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33212
https://doi.org/10.1115/IPACK2007-33212
View Paper titled, Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet
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Topics: Stress analysis (Engineering), Thermomechanics, Finite element methods, Polarizers (Light), Liquid crystals, Warping, Diffusion (Physics), Leakage, Stress, Thermal stresses
Proceedings Papers

Dimensional and Locational Integrity in the Replication of Polymeric Microdevices

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Byoung Hee You, Daniel S. Park, Ping-Chuan Chen, Wilfredo M. Caceres, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 955-959, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33482
https://doi.org/10.1115/IPACK2007-33482
View Paper titled, Dimensional and Locational Integrity in the Replication of Polymeric Microdevices
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Topics: Dimensions, Embossing, Injection molding, Manufacturing, Microfluidics, Molding, Polymers, Shrinkage (Materials), Thermal expansion
Proceedings Papers

Characterization of Non-Conductive Adhesives

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Daniel Farley, Abhijit Dasgupta, J. F. J. M. Caers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73021
https://doi.org/10.1115/IPACK2005-73021
View Paper titled, Characterization of Non-Conductive Adhesives
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Topics: Adhesives, Manufacturing, Stress, Metals, Modeling, Contact resistance, Simulation, Temperature, Bonding, Compression
Proceedings Papers

Thermal Interface Material Technology Advancements and Challenges: An Overview

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Ashay Dani, James C. Matayabas, Jr., Paul Koning
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 511-516, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73384
https://doi.org/10.1115/IPACK2005-73384
View Paper titled, Thermal Interface Material Technology Advancements and Challenges: An Overview
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Topics: Clocks, Design, Energy dissipation, Flip-chip, Flip-chip devices, Heat, Materials science, Packaging, Phase change materials, Polymers
Proceedings Papers

Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects

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A. Bulusu, D. G. Walker
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1427-1432, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73212
https://doi.org/10.1115/IPACK2005-73212
View Paper titled, Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects
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Topics: Electromagnetic scattering, Electron transport, Modeling, Radiation scattering, Scattering (Physics), Thin films, Equilibrium (Physics), Phonons, Dimensions, Electrons
Proceedings Papers

Simulation of Warpage Considering Both Thermal and Cure Induced Shrinkage During Molding in IC Packaging

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Shiang-Yu Teng, Sheng-Jye Hwang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 867-872, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73062
https://doi.org/10.1115/IPACK2005-73062
View Paper titled, Simulation of Warpage Considering Both Thermal and Cure Induced Shrinkage During Molding in IC Packaging
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Topics: Integrated circuit packaging, Molding, Shrinkage (Materials), Simulation, Warping, Pressure, Simulation models, Temperature, Thermal expansion
Proceedings Papers

Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability

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Woon-Seong Kwon, Kyung-Wook Paik
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 131-136, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35087
https://doi.org/10.1115/IPACK2003-35087
View Paper titled, Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability
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Topics: Compressive stress, Experimental analysis, Flip-chip, Flip-chip devices, Reliability, Shrinkage (Materials), Stress, Temperature, Heat conduction, Bonding