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Proceedings Papers

Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Matthew Bowman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140062
https://doi.org/10.1115/IPACK2024-140062
View Paper titled, Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures
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Topics: Temperature, Testing, Circuits, Failure, Failure mechanisms, Extruding, Polysulfone, Shock (Mechanics), Silver, Accelerometers
Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96635
https://doi.org/10.1115/IPACK2022-96635
View Paper titled, Dual Converging Jets for Enhanced Liquid Impingement Cooling
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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Module-Level TIM Degradation in HALT

Joshua Tompkins, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69511
https://doi.org/10.1115/IPACK2021-69511
View Paper titled, Module-Level TIM Degradation in HALT
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Topics: Aluminum, Cooling, Cycles, Electronics, Energy dissipation, Heating, Junctions, Life testing, Maintenance, Random vibration
Proceedings Papers

Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

Yuta Nakamura, Kazuyoshi Fushinobu, Asato Tamura
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6356
https://doi.org/10.1115/IPACK2019-6356
View Paper titled, Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins
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Topics: Additive manufacturing, Computer simulation, Hardening (Curing), Lasers, Numerical analysis, Photons, Polymerization, Resins, Manufacturing, Nanoscale phenomena
Proceedings Papers

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Gary Liang, Ashkan Sadeghifard, Anirudh Krishna, Jaeho Lee, Edwin A. Peraza Hernandez
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6402
https://doi.org/10.1115/IPACK2019-6402
View Paper titled, Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management
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Topics: Alloys, Modeling, Shapes, Thermal management, Springs, Temperature, Solar energy, Deformation, Irradiation (Radiation exposure), Actuators
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8436
https://doi.org/10.1115/IPACK2018-8436
View Paper titled, Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8211
https://doi.org/10.1115/IPACK2018-8211
View Paper titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging
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Topics: Light-emitting diodes, Packaging, Silicones, Wetting, Coating processes, Coatings, Phosphors, Domes (Structural elements), Geometry, Particulate matter
Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8311
https://doi.org/10.1115/IPACK2018-8311
View Paper titled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields
Proceedings Papers

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Kunrong Shen, Zhichuan Sun, Xiaolong Yan, Wei Li, David J. Kukulka, Jianxin Zhou, Deyu Luan, Yan He, Bin Zhang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A023, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8449
https://doi.org/10.1115/IPACK2018-8449
View Paper titled, Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes
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Topics: Condensation, Evaporation, Heat transfer, Heat transfer coefficients, Refrigerants, Pressure drop, Temperature, Vapors, Climate change, Flux (Metallurgy)
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8386
https://doi.org/10.1115/IPACK2018-8386
View Paper titled, Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
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Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74339
https://doi.org/10.1115/IPACK2017-74339
View Paper titled, Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles
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Topics: Design, Tiles, Air flow, Computational fluid dynamics, Containment, Cooling, Data centers, Density, Engineering simulation, Flow (Dynamics)
Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
https://doi.org/10.1115/IPACK2017-74059
View Paper titled, Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74092
https://doi.org/10.1115/IPACK2017-74092
View Paper titled, Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line
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Topics: Current density, Damage, Electrodiffusion, Reservoirs, Shapes, Density, Anodes, Computer simulation
Proceedings Papers

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74195
https://doi.org/10.1115/IPACK2017-74195
View Paper titled, Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer
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Topics: Light-emitting diodes, Phosphors, Shapes, Geometry, Coating processes, Coatings, Computer simulation, Fluids, Temperature
Proceedings Papers

3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Md Taibur Rahman, Rahul Panat, Deuk Heo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48187
https://doi.org/10.1115/IPACK2015-48187
View Paper titled, 3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method
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Topics: Additive manufacturing, Aerosols, Metals, Inks, Manufacturing, Nanoparticles, Shapes, Sintering, Ultraviolet radiation, Wavelength
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48242
https://doi.org/10.1115/IPACK2015-48242
View Paper titled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils
Proceedings Papers

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48741
https://doi.org/10.1115/IPACK2015-48741
View Paper titled, Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
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Topics: Flip-chip packages, Thermal deformation, Warping, Finite element analysis, Manufacturing, Package on package, Shapes, Deformation, Finite element model, Flip-chip
Proceedings Papers

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Sohail R. Reddy, George S. Dulikravich
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48346
https://doi.org/10.1115/IPACK2015-48346
View Paper titled, Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature
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Topics: Coolants, Cooling, Design, Temperature, Heat, Heat flux, Fluids, Flux (Metallurgy), Airfoils, Computer cooling