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Proceedings Papers

Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

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Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A029, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142109
https://doi.org/10.1115/IPACK2024-142109
View Paper titled, Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure
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Topics: Delamination, Fracture toughness, High temperature, Reliability, Failure mechanisms, Semiconductors (Materials), Automobiles, Ball-Grid-Array packaging, Durability, Electronics
Proceedings Papers

Application of the Reflowable Magnetic Jig on Thin MCM Package for Warpage Control

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Jong-Chan Park, Young-Min Kim, Gil-Ho Lee, Hyeong-Kwan Kim, Tae-Keun Lee
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109453
https://doi.org/10.1115/IPACK2023-109453
View Paper titled, Application of the Reflowable Magnetic Jig on Thin MCM Package for Warpage Control
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Topics: Jigs and fixtures, Shades and shadows, Soldering, Warping
Proceedings Papers

Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation

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Tz-Cheng Chiu, Je-Li Kung, Yi-Shao Lai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89040
https://doi.org/10.1115/InterPACK2009-89040
View Paper titled, Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation
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Topics: Molding, Simulation, Viscoelasticity, Warping, Ball-Grid-Array packaging, Finite element analysis, Temperature, Constitutive equations, Cooling, Epoxy adhesives
Proceedings Papers

Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films

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Koji Miyazaki, Jun-Ichiro Kurosaki, Masayuki Takashiri, Bertrand Lenoir, Hiroshi Tsukamoto
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 335-342, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33756
https://doi.org/10.1115/IPACK2007-33756
View Paper titled, Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films
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Topics: Microcoolers, Thin films, Shades and shadows, Temperature, Thermal conductivity, Annealing, Atmospheric pressure, Bulk solids, Chemical etching, Dry etching
Proceedings Papers

Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions

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Phil Geng, Robert R. Martinson, Richard L. Williams, Michael Mello, Steve Cho
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1583-1586, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73046
https://doi.org/10.1115/IPACK2005-73046
View Paper titled, Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions
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Topics: Shades and shadows, Warping, Temperature, Creep, Failure mechanisms, Heating, Interferometry, Shapes
Proceedings Papers

Thermo-Mechanical Deformation and Stress Analysis of a Flip-Chip BGA

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J. D. Wu, Y. S. Lai, Y. L. Kuo, S. C. Hung, M.-H. R. Jen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 309-316, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35082
https://doi.org/10.1115/IPACK2003-35082
View Paper titled, Thermo-Mechanical Deformation and Stress Analysis of a Flip-Chip BGA
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Topics: Ball-Grid-Array packaging, Deformation, Flip-chip, Stress analysis (Engineering), Temperature, Thermomechanics, Warping, Stress, Diluents, Flip-chip packages