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Proceedings Papers

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72976
https://doi.org/10.1115/IPACK2021-72976
View Paper titled, CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate
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Topics: Computational fluid dynamics, Cooling, Flow (Dynamics), Impellers, Density, Electronic equipment, Packaging, Fans, Flow visualization, Pressure
Proceedings Papers

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73313
https://doi.org/10.1115/IPACK2021-73313
View Paper titled, Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
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Topics: Coatings, Coolants, Cooling, Design, Durability, Electric fields, Electronics, Flow (Dynamics), Fluids, Heat
Proceedings Papers

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74339
https://doi.org/10.1115/IPACK2017-74339
View Paper titled, Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles
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Topics: Design, Tiles, Air flow, Computational fluid dynamics, Containment, Cooling, Data centers, Density, Engineering simulation, Flow (Dynamics)
Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48051
https://doi.org/10.1115/IPACK2015-48051
View Paper titled, Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature
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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations
Proceedings Papers

Impact of Cold Aisle Containment on Thermal Performance of Data Center

Bharathkrishnan Muralidharan, Saurabh K. Shrivastava, Mahmoud Ibrahim, Sami A. Alkharabsheh, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A016, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73201
https://doi.org/10.1115/IPACK2013-73201
View Paper titled, Impact of Cold Aisle Containment on Thermal Performance of Data Center
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Topics: Containment, Data centers, Cooling, Heat, Separation (Technology), Stress, Air conditioners, Computers, Containment systems, Density
Proceedings Papers

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Y. Sing Chan, F. B. Song, S. W. Ricky Lee, C. R. Yang, Jeffery C. C. Lo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 579-583, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52219
https://doi.org/10.1115/IPACK2011-52219
View Paper titled, Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test
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Topics: Chain, Fatigue cracks, Lead-free solders, Temperature, Solder joints, Electrical resistance, Failure, Fatigue, Fatigue failure, Fracture (Materials)
Proceedings Papers

A Flow-Network Model for Predicting Rack Cooling in Containment Systems

Saurabh K. Shrivastava, James W. VanGilder
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 785-791, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89161
https://doi.org/10.1115/InterPACK2009-89161
View Paper titled, A Flow-Network Model for Predicting Rack Cooling in Containment Systems
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Topics: Containment systems, Cooling, Flow (Dynamics), Air flow, Computational fluid dynamics, Containment, Cooling systems, Data centers, Dimensions, Heat
Proceedings Papers

Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits

Srujan Gondipalli, Bahgat Sammakia, Siddarth Bhopte, Roger Schmidt, Madhusudan K. Iyengar, Bruce Murray
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 841-850, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89203
https://doi.org/10.1115/InterPACK2009-89203
View Paper titled, Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits
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Topics: Data centers, Doors, Optimization, Roofs, Temperature, Air flow, Ceilings, Heat, Computers, Coolers
Proceedings Papers

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

Pradeep Lall, Prashant Gupta, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 857-871, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89298
https://doi.org/10.1115/InterPACK2009-89298
View Paper titled, Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration
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Topics: Electronics, Shock (Mechanics), Vibration, Failure, Damage, Solders, Principal component analysis, Failure mechanisms, Fracture (Process), Alloys
Proceedings Papers

New Product Introduction of Fully Buffered DIMM: A Process Perspective

Gurudutt Chennagiri, Satyanarayan Iyer, Pei-Fang Tsai, Krishnaswami Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 917-922, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33678
https://doi.org/10.1115/IPACK2007-33678
View Paper titled, New Product Introduction of Fully Buffered DIMM: A Process Perspective
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Topics: Adhesion, Failure mechanisms, Failure mode and effects analysis, Heat sinks, Manufacturing, Product reliability, Reliability, Separation (Technology), Shock (Mechanics), Vibration tests
Proceedings Papers

Analytical Solution of Whispering-Gallery Modes

Haiyong Quan, Zhixiong Guo
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 489-497, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33124
https://doi.org/10.1115/IPACK2007-33124
View Paper titled, Analytical Solution of Whispering-Gallery Modes
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Topics: Boundary-value problems, Cavities, Electric fields, Filters, Microelectromechanical systems, Nanoelectromechanical systems, Nanosensors, Resonance, Separation (Technology), Wave equations
Proceedings Papers

Heat Transfer Characteristics for a Confined Rotating MCM Disk With Round Jet Array Impingement

C. Y. Lee, C. J. Fang, C. H. Peng, T. W. Lin, Y. H. Hung
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 909-916, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33277
https://doi.org/10.1115/IPACK2007-33277
View Paper titled, Heat Transfer Characteristics for a Confined Rotating MCM Disk With Round Jet Array Impingement
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Topics: Disks, Heat transfer, Nozzles, Reynolds number, Separation (Technology)
Proceedings Papers

Fluid Flow Behavior for a Confined Rotating MCM Disk With Round Jet Array Impingement

C. J. Fang, C. Y. Lee, C. H. Peng, T. W. Lin, Y. H. Hung
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 917-924, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33278
https://doi.org/10.1115/IPACK2007-33278
View Paper titled, Fluid Flow Behavior for a Confined Rotating MCM Disk With Round Jet Array Impingement
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Topics: Disks, Fluid dynamics, Nozzles, Reynolds number, Separation (Technology), Turbulence
Proceedings Papers

Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids

Patricia E. Gharagozloo, Ken E. Goodson, John K. Eaton
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 993-998, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33293
https://doi.org/10.1115/IPACK2007-33293
View Paper titled, Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids
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Topics: Nanofluids, Temperature, Thermal conductivity, Aluminum, Carbon nanotubes, Heat, Microscopy, Nanoparticles, Separation (Technology), Silicones
Proceedings Papers

Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 675-682, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73486
https://doi.org/10.1115/IPACK2005-73486
View Paper titled, Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die
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Topics: Optimization, Design, Heat flux, Clocks, Energy dissipation, Finite element analysis, Finite element methods, Finite element model, Junctions, Separation (Technology)
Proceedings Papers

Design and Assembly Methods for Improving High Current Board-Component Connectivity

Damion Searls, Terry Dishongh, Dudi Amir, Jung Kang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 25-31, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35204
https://doi.org/10.1115/IPACK2003-35204
View Paper titled, Design and Assembly Methods for Improving High Current Board-Component Connectivity
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Topics: Design, Manufacturing, Solders, Signals, Ball-Grid-Array packaging, Density, Optimization, Printed circuit boards, Separation (Technology), Silicon
Proceedings Papers

Compact Modeling of Unshrouded Plate Fin Heat Sinks

Sridhar Narasimhan, Avram Bar-Cohen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 543-550, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35327
https://doi.org/10.1115/IPACK2003-35327
View Paper titled, Compact Modeling of Unshrouded Plate Fin Heat Sinks
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Topics: Heat sinks, Modeling, Pressure drop, Thermal conductivity, Pressure, Temperature, Accounting, Energy dissipation, Flow (Dynamics), Forced convection