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Proceedings Papers

A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC

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David Geb, Subodh Deodhar, Nitin Netake, Tejas Jeurkar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140403
https://doi.org/10.1115/IPACK2024-140403
View Paper titled, A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC
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Topics: Simulation, Thermal management, Cooling, Design, Algorithms, Control equipment, Temperature, Heat, Integrated circuits, Sensors
Proceedings Papers

Predictive Machine Learning Models for LiDAR Sensor Reliability in Autonomous Vehicles

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Saba A. Farahani, Jae Yun Lee, Hunjae Kim, Yoonjin Won
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141038
https://doi.org/10.1115/IPACK2024-141038
View Paper titled, Predictive Machine Learning Models for LiDAR Sensor Reliability in Autonomous Vehicles
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Topics: Autonomous vehicles, Contamination, Lidar, Machine learning, Reliability, Sensors
Proceedings Papers

Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform

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Pradeep Lall, Hyesoo Jang, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111973
https://doi.org/10.1115/IPACK2023-111973
View Paper titled, Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform
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Topics: Electronics, Manufacturing, Printing, Reliability, Sensors
Proceedings Papers

Development and Reliability Evaluation of Additively Printed Biosensing Device for Wearable Applications in Harsh Environment

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Pradeep Lall, Hyesoo Jang, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111968
https://doi.org/10.1115/IPACK2023-111968
View Paper titled, Development and Reliability Evaluation of Additively Printed Biosensing Device for Wearable Applications in Harsh Environment
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Topics: Manufacturing, Reliability, Sensors, Wearable devices
Proceedings Papers

Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

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Josef Frankhouse, Jackson Marsh, Han Hu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111922
https://doi.org/10.1115/IPACK2023-111922
View Paper titled, Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors
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Topics: Acoustic emissions, Condition monitoring, Semiconductors (Materials), Sensors, Electric vertical take-off and landing aircraft, Electronics, Aircraft, Density, Electric vehicles, Electromagnetic interference
Proceedings Papers

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

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Pradeep Lall, Hyesoo Jang, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97432
https://doi.org/10.1115/IPACK2022-97432
View Paper titled, Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments
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Topics: Astronauts, Event history analysis, Manufacturing, Reliability, Sensors
Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

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Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94052
https://doi.org/10.1115/IPACK2022-94052
View Paper titled, Additive Manufacturing of Electronic Patterns for Harsh Environments
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

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Pradeep Lall, Tony Thomas, Jinesh Narangaparambil
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74074
https://doi.org/10.1115/IPACK2021-74074
View Paper titled, Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration
Proceedings Papers

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

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Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2644
https://doi.org/10.1115/IPACK2020-2644
View Paper titled, Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition
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Topics: Biometry, Fatigue life, Flexible electronics, Reliability, Sensors
Proceedings Papers

Enabling Packaging Architectures and Interconnect Technologies for Image Sensors

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Mei-Chien Lu
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2526
https://doi.org/10.1115/IPACK2020-2526
View Paper titled, Enabling Packaging Architectures and Interconnect Technologies for Image Sensors
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Topics: Architecture, Bonding, Density, Packaging, Sensors
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

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Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

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Alexis Krone, Hannah Alpert, Satish Shetty, Debbie G. Senesky, Gregory Salamo, David Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2589
https://doi.org/10.1115/IPACK2020-2589
View Paper titled, Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments
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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Magnetic fields, Reliability, Sensors
Proceedings Papers

Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

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Shuv Dey, Yogendra Joshi, J. Michael Brown
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6515
https://doi.org/10.1115/IPACK2019-6515
View Paper titled, Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies
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Topics: Cities, Heat, Internet of things, Packaging, Pollution, Sensor networks, Sensors
Proceedings Papers

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

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Gary Liang, Ashkan Sadeghifard, Anirudh Krishna, Jaeho Lee, Edwin A. Peraza Hernandez
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6402
https://doi.org/10.1115/IPACK2019-6402
View Paper titled, Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management
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Topics: Alloys, Modeling, Shapes, Thermal management, Springs, Temperature, Solar energy, Deformation, Irradiation (Radiation exposure), Actuators
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

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Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

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Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6569
https://doi.org/10.1115/IPACK2019-6569
View Paper titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours
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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

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Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6461
https://doi.org/10.1115/IPACK2019-6461
View Paper titled, Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers
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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

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Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6514
https://doi.org/10.1115/IPACK2019-6514
View Paper titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)
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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

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Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6580
https://doi.org/10.1115/IPACK2019-6580
View Paper titled, Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements
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Topics: Flexible electronics, Reliability, Electronics, Failure, Lumber, Modeling, Sensors, Statistical analysis, Testing
Proceedings Papers

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

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Mohammad Tradat, Bahgat Sammakia, Husam Alissa, Kourosh Nemati
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8334
https://doi.org/10.1115/IPACK2018-8334
View Paper titled, Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation
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Topics: Cooling, Data centers, Experimental analysis, Failure, Instrumentation, Cooling systems, Temperature, Containment, Equipment performance, Pressure