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Proceedings Papers

Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

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Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A029, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142109
https://doi.org/10.1115/IPACK2024-142109
View Paper titled, Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure
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Topics: Delamination, Fracture toughness, High temperature, Reliability, Failure mechanisms, Semiconductors (Materials), Automobiles, Ball-Grid-Array packaging, Durability, Electronics
Proceedings Papers

Evaluation of Warpage Deformation in Semiconductor Device Packaging Process

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Taiju Yagi, Qiang Yu, Haruyuki Shimada, Yuichi Yanaka, Takashi Masuko
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140852
https://doi.org/10.1115/IPACK2024-140852
View Paper titled, Evaluation of Warpage Deformation in Semiconductor Device Packaging Process
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Topics: Deformation, Finite element methods, Resins, Semiconductor device packaging, Semiconductors (Materials), Warping, Packaging, Shrinkage (Materials), Simulation, Anisotropy
Proceedings Papers

Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

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Josef Frankhouse, Jackson Marsh, Han Hu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111922
https://doi.org/10.1115/IPACK2023-111922
View Paper titled, Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors
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Topics: Acoustic emissions, Condition monitoring, Semiconductors (Materials), Sensors, Electric vertical take-off and landing aircraft, Electronics, Aircraft, Density, Electric vehicles, Electromagnetic interference
Proceedings Papers

Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process

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Stewart Christie, Anna Prakash, Elaina Ashton, Veronica Tanner
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111936
https://doi.org/10.1115/IPACK2023-111936
View Paper titled, Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process
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Topics: Artificial intelligence, Flaw detection, Manufacturing, Optical quality control, Errors, Computers, Electronics, Flat heat pipes, Inspection, Laptop computers
Proceedings Papers

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics

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Margie Guerrero, Pedro Quintero, Ozan Cagatay Ozdemir
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111534
https://doi.org/10.1115/IPACK2023-111534
View Paper titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics
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Topics: Ceramics, Copper, Electronics, Plasma spraying, Spraying (Coating processes), Coatings, Sprays, Surface roughness, Electronic packaging, Additive manufacturing
Proceedings Papers

Prediction of the Localized Heating-Induced Size Effects in Semiconductors Based on the Heat Generation Characteristics and the Material Thermophysical Properties

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Amir Abdolhosseinzadeh, Emine Goktepe, Nazli Donmezer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111501
https://doi.org/10.1115/IPACK2023-111501
View Paper titled, Prediction of the Localized Heating-Induced Size Effects in Semiconductors Based on the Heat Generation Characteristics and the Material Thermophysical Properties
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Topics: Heat, Heating, Phonons, Semiconductors (Materials)
Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

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Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74116
https://doi.org/10.1115/IPACK2021-74116
View Paper titled, Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces
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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

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Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74016
https://doi.org/10.1115/IPACK2021-74016
View Paper titled, Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

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Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2528
https://doi.org/10.1115/IPACK2020-2528
View Paper titled, Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

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Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6436
https://doi.org/10.1115/IPACK2019-6436
View Paper titled, Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Metals, Transients (Dynamics), Ceramics, Copper, Finite element analysis, Materials properties, MOSFET transistors, Semiconductors (Materials)
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

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Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6347
https://doi.org/10.1115/IPACK2019-6347
View Paper titled, Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

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Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8256
https://doi.org/10.1115/IPACK2018-8256
View Paper titled, Analysis of Thermal Properties of Power Multifinger HEMT Devices
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

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Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8337
https://doi.org/10.1115/IPACK2018-8337
View Paper titled, On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

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Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74222
https://doi.org/10.1115/IPACK2017-74222
View Paper titled, Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices
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Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride
Proceedings Papers

Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension

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Yusuke Nakajo, Hiroaki Nishi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74341
https://doi.org/10.1115/IPACK2017-74341
View Paper titled, Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension
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Topics: Cycles, Temperature, Data centers, Stress, Air conditioning, Failure, Heat, Maintenance, Semiconductors (Materials), Energy consumption
Proceedings Papers

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

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Shenghui Lei, Alexandre Shen, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74181
https://doi.org/10.1115/IPACK2017-74181
View Paper titled, Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates
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Topics: Photonics, Silicon, Thermal resistance, Etching, Silicon-on-insulator, Cladding systems (Building), Thermal conductivity, Aluminum, Crystals, Diffusion (Physics)
Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

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Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74213
https://doi.org/10.1115/IPACK2017-74213
View Paper titled, 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
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Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature
Proceedings Papers

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

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Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48239
https://doi.org/10.1115/IPACK2015-48239
View Paper titled, Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons
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Topics: Graphene, Strain sensors, Chemical vapor deposition, Copper foil, Deformation, Energy gap, Reactive-ion etching, Tensile deformation, Density functional theory, Electron configuration
Proceedings Papers

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

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Richard C. Ordonez, Noah Acosta, Jordan Melcher, Nackieb Kamin, David Garmire
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48567
https://doi.org/10.1115/IPACK2015-48567
View Paper titled, Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices
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Topics: Graphene, Liquid metals, Ohmic contacts, Photonic equipment, Contact resistance, Carbon, Engineering standards, Overlays (Materials engineering), Oxidation, Pressure
Proceedings Papers

System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles

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Kraig J. Olejniczak, Tom Flint, David Simco, Sergei Storkov, Brad McGee, Kenny George, Peter Killeen, Austin Curbow, Robert S. Shaw, Brandon Passmore, Ty R. McNutt
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48602
https://doi.org/10.1115/IPACK2015-48602
View Paper titled, System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles
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Topics: Energy gap, Packaging, Traction, Vehicles, Silicon, Reliability, Capacitors, Cooling, High temperature, Junctions