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Proceedings Papers
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140287
Proceedings Papers
Thermophysical Property Measurement of GaN-on-AlN Wafers for Next-Generation RF Device Technologies
Available to PurchaseHusam Walwil, Daniel C. Shoemaker, Yiwen Song, Kyuhwe Kang, Nathaniel S. McIlwaine, Michael L. Schuette, James S. Tweedie, Scott T. Sheppard, Jon-Paul Maria, Sukwon Choi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140195
Proceedings Papers
Study of Reliable Chip Last Process for Fan Out Wafer Level Package
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111450
Proceedings Papers
Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111525
Proceedings Papers
Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2528
Proceedings Papers
The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2555
Proceedings Papers
Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6461
Proceedings Papers
Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8257
Proceedings Papers
Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8379
Proceedings Papers
Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74010
Proceedings Papers
Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48814
Proceedings Papers
Lid-Integral Cold Plate Topology Integration, Performance, and Reliability
Available to PurchaseGerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48427
Proceedings Papers
CMUTs in Permanent Contact Operation for High Output Pressure
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48733
Proceedings Papers
Novel Thermal Management of GaN Electronics: Diamond Substrates
Available to PurchaseMartin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T08A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48145
Proceedings Papers
Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging
Available to PurchaseAzadeh Moini, Amin Nikoozadeh, Jung Woo Choe, Butrus T. Khuri-Yakub, Chienliu Chang, Doug Stephens, L. Scott Smith, David Sahn
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48611
Proceedings Papers
Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands
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Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48387
Proceedings Papers
Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48749
Proceedings Papers
Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48105
Proceedings Papers
Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
Available to PurchaseMaaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73317
Proceedings Papers
Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73324
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