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Proceedings Papers

High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape

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Kaiying Jiang, Heungdong Kwon, Hansen Qiao, Yini He, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140287
https://doi.org/10.1115/IPACK2024-140287
View Paper titled, High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape
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Topics: Composite materials, Copper, Gallium, Liquid metals, Nanowires, Polydimethylsiloxane, Thermal characterization, Thermal resistance, ASTM International, Contact resistance
Proceedings Papers

Thermophysical Property Measurement of GaN-on-AlN Wafers for Next-Generation RF Device Technologies

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Husam Walwil, Daniel C. Shoemaker, Yiwen Song, Kyuhwe Kang, Nathaniel S. McIlwaine, Michael L. Schuette, James S. Tweedie, Scott T. Sheppard, Jon-Paul Maria, Sukwon Choi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140195
https://doi.org/10.1115/IPACK2024-140195
View Paper titled, Thermophysical Property Measurement of GaN-on-AlN Wafers for Next-Generation RF Device Technologies
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Topics: Electrical conductance, Gallium nitride, High-electron-mobility transistors, Semiconductor wafers, Thermal conductivity, Thermoreflectance
Proceedings Papers

Study of Reliable Chip Last Process for Fan Out Wafer Level Package

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Shuai-Lin Liu, Nicholas Kao, Vito Lin, Ken Zhang, Yu-Po Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111450
https://doi.org/10.1115/IPACK2023-111450
View Paper titled, Study of Reliable Chip Last Process for Fan Out Wafer Level Package
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Topics: Package on package, Packaging, Semiconductor wafers
Proceedings Papers

Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics

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Janhavi Giri, Attila Lengyel
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111525
https://doi.org/10.1115/IPACK2023-111525
View Paper titled, Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics
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Topics: Machine learning, Manufacturing, Semiconductor wafers, Topology
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

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Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2528
https://doi.org/10.1115/IPACK2020-2528
View Paper titled, Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods

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Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2555
https://doi.org/10.1115/IPACK2020-2555
View Paper titled, The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
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Topics: Bifurcation, Experimental methods, Gravity (Force), Packaging, Semiconductor wafers, Warping
Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

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Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6461
https://doi.org/10.1115/IPACK2019-6461
View Paper titled, Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers
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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

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Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8257
https://doi.org/10.1115/IPACK2018-8257
View Paper titled, Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

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M. Niessner, G. Haubner, W. Hartner, S. Pahlke
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8379
https://doi.org/10.1115/IPACK2018-8379
View Paper titled, Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach
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Topics: Design, Radar, Reliability, Solder joints, Simulation, Laminates, Accelerated life testing, Ball-Grid-Array packaging, Materials properties, Mechanical properties
Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

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Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74010
https://doi.org/10.1115/IPACK2017-74010
View Paper titled, Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
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Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

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Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48814
https://doi.org/10.1115/IPACK2015-48814
View Paper titled, Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

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Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48427
https://doi.org/10.1115/IPACK2015-48427
View Paper titled, Lid-Integral Cold Plate Topology Integration, Performance, and Reliability
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Topics: Reliability, Topology, Silicon, Packaging, Composite materials, Cooling, Finite element model, Fracture (Materials), Fracture (Process), Gaskets
Proceedings Papers

CMUTs in Permanent Contact Operation for High Output Pressure

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Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48733
https://doi.org/10.1115/IPACK2015-48733
View Paper titled, CMUTs in Permanent Contact Operation for High Output Pressure
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Topics: Pressure, Transducers, Acoustics, Cavities, Ultrasonic transducers, Bonding, Cycles, Deflection, Displacement, High temperature
Proceedings Papers

Novel Thermal Management of GaN Electronics: Diamond Substrates

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Martin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T08A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48145
https://doi.org/10.1115/IPACK2015-48145
View Paper titled, Novel Thermal Management of GaN Electronics: Diamond Substrates
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Topics: Diamonds, Electronics, Gallium nitride, Thermal management, Thermal conductivity, Heat transfer, Junctions, Microwaves, Semiconductor wafers, Temperature
Proceedings Papers

Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging

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Azadeh Moini, Amin Nikoozadeh, Jung Woo Choe, Butrus T. Khuri-Yakub, Chienliu Chang, Doug Stephens, L. Scott Smith, David Sahn
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48611
https://doi.org/10.1115/IPACK2015-48611
View Paper titled, Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging
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Topics: Catheters, Endoscopic devices, Imaging, Manufacturing, Packaging, Ultrasound, Biomedical imaging, Ultrasonic transducers, Bonding, Design
Proceedings Papers

Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands

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Frank Wei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48387
https://doi.org/10.1115/IPACK2015-48387
View Paper titled, Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands
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Topics: Metals, Package on package, Packaging, Polishing, Semiconductor wafers
Proceedings Papers

Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing

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Richard Barnett, Dave Thomas, Oliver Ansell
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48749
https://doi.org/10.1115/IPACK2015-48749
View Paper titled, Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing
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Topics: Blades, Damage, Flow (Dynamics), Lasers, Plasma etching, Plasmas (Ionized gases), Reliability, Semiconductor wafers, Traction
Proceedings Papers

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices

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Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48105
https://doi.org/10.1115/IPACK2015-48105
View Paper titled, Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
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Topics: Bonding, Boundary element methods, Cooling, Corners (Structural elements), Delamination, Joining, Numerical analysis, Packaging, Photonic equipment, Polymers
Proceedings Papers

Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging

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Maaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73317
https://doi.org/10.1115/IPACK2013-73317
View Paper titled, Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
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Topics: Packaging, Semiconductor wafers, Silicon, Stress, Tin, Vehicles, Bonding, Modeling, Transistors, Bolometers
Proceedings Papers

Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface

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Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73324
https://doi.org/10.1115/IPACK2013-73324
View Paper titled, Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface
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Topics: Hydrogen, Mechanical properties, Silicon crystals, Silicon, Atoms, Boiling, Boron, Deformation, Plasticity, Stress