1-20 of 30
Semiconductor devices
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
Open the PDF for Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure in another window
Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2516
https://doi.org/10.1115/IPACK2020-2516
View Paper titled, Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules
Open the PDF for Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules in another window
Topics: Energy gap, Heat sinks, Optimization, Cooling, Heat, Energy conversion, Power semiconductor devices, Reliability, Semiconductor devices, Steady state
Proceedings Papers

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8300
https://doi.org/10.1115/IPACK2018-8300
View Paper titled, Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications
Open the PDF for Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications in another window
Topics: Internet of things, Stress, Vehicles, Circuits, Computer software, Cooling, Cycles, Energy dissipation, Flip-chip packages, Modeling
Proceedings Papers

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8348
https://doi.org/10.1115/IPACK2018-8348
View Paper titled, Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications
Open the PDF for Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications in another window
Topics: Automotive industry, Cycles, Electronics, Stress, Reliability, Heating, Testing, Failure, Failure mechanisms, Junctions
Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74213
https://doi.org/10.1115/IPACK2017-74213
View Paper titled, 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
Open the PDF for 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging in another window
Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature
Proceedings Papers

The Detection of Minimum BLT Condition With Electrical Capacitance Measurement

Yasuhiro Saito, Satoru Suzuki, Takanori Komuro
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A074, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48303
https://doi.org/10.1115/IPACK2015-48303
View Paper titled, The Detection of Minimum BLT Condition With Electrical Capacitance Measurement
Open the PDF for The Detection of Minimum BLT Condition With Electrical Capacitance Measurement in another window
Topics: Capacitance, Heat, Fillers (Materials), Heat sinks, Solids, Electrical measurement, Mass production, Pressure, Semiconductor devices, Silicones
Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48757
https://doi.org/10.1115/IPACK2015-48757
View Paper titled, Reliable Integration of Microchannel Coolers for Power Electronics
Open the PDF for Reliable Integration of Microchannel Coolers for Power Electronics in another window
Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)
Proceedings Papers

Two-Dimensional Monolayer MX 2 (M=Mo, W; X=S, Se) Synthesis, Characterization and Device Applications

Bin Xiang, Lei Yang, Jian Huang, Qi Fu
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48286
https://doi.org/10.1115/IPACK2015-48286
View Paper titled, Two-Dimensional Monolayer MX 2 (M=Mo, W; X=S, Se) Synthesis, Characterization and Device Applications
Open the PDF for Two-Dimensional Monolayer MX 2 (M=Mo, W; X=S, Se) Synthesis, Characterization and Device Applications in another window
Topics: Atomic force microscopy, Chemical vapor deposition, Electronics, Emergencies, Mechanical admittance, Optoelectronic devices, Photoluminescence, Pressure, Raman spectroscopy, Resolution (Optics)
Proceedings Papers

Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads

Takahiro Kinoshita, Takashi Kawakami, Tomoya Sugiura, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48142
https://doi.org/10.1115/IPACK2015-48142
View Paper titled, Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads
Open the PDF for Thermal Stress Simulation for 3D SiP With TSV Structure Under Unsteady Thermal Loads in another window
Topics: Simulation, Stress, Thermal stresses, Finite element methods, Heat, Temperature, Cooling, Damage, Packaging, Reliability
Proceedings Papers

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

Leila Choobineh, Dereje Agonafer, Ankur Jain
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73166
https://doi.org/10.1115/IPACK2013-73166
View Paper titled, Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems
Open the PDF for Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems in another window
Topics: Modeling, Temperature distribution, Thermal management, Temperature, Finite element analysis, Heat transfer, Design, Energy conservation, Fourier series, Heat
Proceedings Papers

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Hannes Greve, F. Patrick McCluskey
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73209
https://doi.org/10.1115/IPACK2013-73209
View Paper titled, Transient Liquid Phase Sintered Joints for Power Electronic Modules
Open the PDF for Transient Liquid Phase Sintered Joints for Power Electronic Modules in another window
Topics: Transients (Dynamics), Melting point, Metals, Shear strength, Sinter (Metallurgy), Temperature, Copper, Shear (Mechanics), Tension-leg platforms, Binders (Materials)
Proceedings Papers

Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection

Chuanhong Fan, Ryosuke Furuya, Osamu Asai, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73147
https://doi.org/10.1115/IPACK2013-73147
View Paper titled, Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection
Open the PDF for Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection in another window
Topics: Copper, Thin films, Design, Diffraction, Electron backscatter diffraction, Electrons, Ruthenium, Semiconductor devices
Proceedings Papers

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73248
https://doi.org/10.1115/IPACK2013-73248
View Paper titled, Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density
Open the PDF for Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density in another window
Topics: Density, Simulation, Stress, Diffusion (Physics), Computer simulation, Electron mobility, Electrons, Heat conduction, Momentum, MOSFET transistors
Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73149
https://doi.org/10.1115/IPACK2013-73149
View Paper titled, Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films
Open the PDF for Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films in another window
Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries
Proceedings Papers

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 685-690, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52058
https://doi.org/10.1115/IPACK2011-52058
View Paper titled, Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration
Open the PDF for Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration in another window
Topics: Copper, Electrodiffusion, Stress, Thin films, Atoms, Sulfur, Current density, Electroplating, Fracture (Materials), Fracture (Process)
Proceedings Papers

Thermal Characterization of Non-Isolated DC to DC Convertor

Shiladitya Chakravorty, Bahgat Sammakia, Varaprasad Calmidi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 203-212, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52121
https://doi.org/10.1115/IPACK2011-52121
View Paper titled, Thermal Characterization of Non-Isolated DC to DC Convertor
Open the PDF for Thermal Characterization of Non-Isolated DC to DC Convertor in another window
Topics: Thermal characterization, Energy dissipation, Computational fluid dynamics, Air flow, Design, Inductors, Insulation, Semiconductor devices, Stress, Temperature
Proceedings Papers

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 231-240, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52148
https://doi.org/10.1115/IPACK2011-52148
View Paper titled, Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
Open the PDF for Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique in another window
Topics: Carbon, Nanotubes, Steady state, Carbon nanotubes, Bonding, Design, Heat, Nanomaterials, Optimization, Pressure
Proceedings Papers

Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

Da Yu, Tung Nguyen, Ho H. Lee, Namseo Goo, S. B. Park
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 603-608, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52232
https://doi.org/10.1115/IPACK2011-52232
View Paper titled, Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling
Open the PDF for Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling in another window
Topics: Reliability, Heat, Heat sinks, Power density, Solder joints, Circuits, Computer simulation, Cycles, Energy dissipation, Experimental methods
Proceedings Papers

Modelling Reliability of Power Electronics Packaging

Chris Bailey, Hua Lu, Chunyan Yin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 215-220, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89430
https://doi.org/10.1115/InterPACK2009-89430
View Paper titled, Modelling Reliability of Power Electronics Packaging
Open the PDF for Modelling Reliability of Power Electronics Packaging in another window
Topics: Electronic packaging, Modeling, Reliability, Electronics, Semiconductors (Materials), Aluminum, Design, Electric vehicles, Electricity (Physics), Energy management
Proceedings Papers

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

Jessica Sheehan, Dae Whan Kim, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 491-499, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89238
https://doi.org/10.1115/InterPACK2009-89238
View Paper titled, Thermal Imaging of Two-Phase Coooled Microgap Channel Wall
Open the PDF for Thermal Imaging of Two-Phase Coooled Microgap Channel Wall in another window
Topics: Absorption, Coolers, Cooling, Dielectric liquids, Electronic components, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Imaging