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Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

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Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48302
https://doi.org/10.1115/IPACK2015-48302
View Paper titled, On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)
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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites
Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

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J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73127
https://doi.org/10.1115/IPACK2005-73127
View Paper titled, 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies
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Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature
Proceedings Papers

Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications

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Liang Chai, Aziz Shaikh, Vern Stygar
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 827-831, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35134
https://doi.org/10.1115/IPACK2003-35134
View Paper titled, Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications
Open the PDF for Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications in another window
Topics: Microwaves, Millimeter waves, Strip transmission lines, Ceramics, Metals, Silver, Arches, Capacitors, Cavities, Imaging