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Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74177
https://doi.org/10.1115/IPACK2017-74177
View Paper titled, In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading
Open the PDF for In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading in another window
Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments

Pradeep Lall, Amrit Abrol, Lee Simpson, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48790
https://doi.org/10.1115/IPACK2015-48790
View Paper titled, Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments
Open the PDF for Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments in another window
Topics: Accelerometers, Microelectromechanical systems, Shock (Mechanics), Reliability, Automotive industry, Complementary metal oxide semiconductors, Design, Failure mechanisms, Low temperature, Lumber
Proceedings Papers

Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Takuya Hanamura, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48553
https://doi.org/10.1115/IPACK2015-48553
View Paper titled, Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography
Open the PDF for Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography in another window
Topics: Fatigue cracks, Solder joints, Synchrotron radiation, X-rays, Solders, Crack propagation, Fracture (Materials), Microcracks, Ball-Grid-Array packaging, Ceramics
Proceedings Papers

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73091
https://doi.org/10.1115/IPACK2013-73091
View Paper titled, Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints
Open the PDF for Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints in another window
Topics: Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Fracture (Materials), Microcracks, Solders
Proceedings Papers

Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools

Ryan T. Marinis, Ryszard J. Pryputniewicz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 471-476, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89222
https://doi.org/10.1115/InterPACK2009-89222
View Paper titled, Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools
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Topics: Errors, Rotation, Interferometry, Coriolis force, Excitation, Resonance, Sensors, Shapes
Proceedings Papers

Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets

Nobuyuki Isoshima, Masatoshi Watanabe, Mika Ri, Yutaka Yamada, Koichi Sugimoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 681-692, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89041
https://doi.org/10.1115/InterPACK2009-89041
View Paper titled, Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
Open the PDF for Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets in another window
Topics: Cooling, Noise (Sound), Plasmas (Ionized gases), Fans, Flow (Dynamics), Low temperature, Computational fluid dynamics, Heat transfer, Lumber, Natural convection
Proceedings Papers

Cooling Design for the Next Generation Optical Disc Drive

Takayuki Fujimoto, Nobuyuki Isoshima, Hiroyuki Toyoda, Yoshiaki Yamauchi, Hitoshi Matsushima, Ikuo Nishida
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 625-630, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33263
https://doi.org/10.1115/IPACK2007-33263
View Paper titled, Cooling Design for the Next Generation Optical Disc Drive
Open the PDF for Cooling Design for the Next Generation Optical Disc Drive in another window
Topics: Cooling, Design, Disks, Rotation
Proceedings Papers

Development of 1D Optical Micro Scanner Driven by Piezoelectric Actuators

Takeshi Kobayashi, Jiunnjye Tsaur, Ryutaro Maeda
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 789-792, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73431
https://doi.org/10.1115/IPACK2005-73431
View Paper titled, Development of 1D Optical Micro Scanner Driven by Piezoelectric Actuators
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Topics: Piezoelectric actuators, Cantilevers, Hinges, Microelectromechanical systems, Microfabrication, Mirrors, Resonance, Rotation, Silicon-on-insulator
Proceedings Papers

Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films

Kenichi Shimizu, Tasiyuki Torii
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1703-1708, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73134
https://doi.org/10.1115/IPACK2005-73134
View Paper titled, Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films
Open the PDF for Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films in another window
Topics: Copper, Crystals, Fatigue cracks, Rotation, Crystal structure, Fatigue testing, Fracture (Materials), Electron backscatter diffraction, Annealing, Evaluation methods
Proceedings Papers

High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array

C. C. Wang, T. D. Kudrle, M. Bancu, J. Hsiao, C. H. Mastrangelo
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 245-249, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35203
https://doi.org/10.1115/IPACK2003-35203
View Paper titled, High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array
Open the PDF for High-Density Through-Wafer Electrical Interconnects in Pyrex Substrate Integrated With Micromirror Array in another window
Topics: Borosilicate glasses, Density, Semiconductor wafers, Bonding, Construction, Flip-chip, Machining, Metals, Particle spin, Rotation
Proceedings Papers

Effects of A Rotated Chip Package on Mechanical and Thermal Performances

Henry H. Jung, Ron Zhang, Eddie Lee, Sai Ankireddi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 529-535, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35311
https://doi.org/10.1115/IPACK2003-35311
View Paper titled, Effects of A Rotated Chip Package on Mechanical and Thermal Performances
Open the PDF for Effects of A Rotated Chip Package on Mechanical and Thermal Performances in another window
Topics: Air flow, Clamps (Tools), Computers, Design engineering, Junctions, Manufacturing, Rotation, Silicon, Stress, Temperature