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Proceedings Papers

Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node

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Shrinath Shrinivas Ramdas, Tushar Chauhan, Mark Patterson, Dwayne R. Shirley, Lijuan Zhang, Roberto Coccioli
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141335
https://doi.org/10.1115/IPACK2024-141335
View Paper titled, Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node
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Topics: Columns (Structural), Copper, Delamination, Design, Finite element analysis, Fracture (Process), Optimization, Risk, Silicon
Proceedings Papers

Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures

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Myriam Bouzidi, Junyoung Kim, Jonathan Goldman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140132
https://doi.org/10.1115/IPACK2024-140132
View Paper titled, Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures
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Topics: Batteries, Electric vehicles, Flexible structures, Thermal management, Temperature, Heat, Cooling, Energy dissipation, Battery life, Coolants
Proceedings Papers

Standardized Approach for Assessing Fiber Device Resiliency

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Conor Galligan, Daniel Alves
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141204
https://doi.org/10.1115/IPACK2024-141204
View Paper titled, Standardized Approach for Assessing Fiber Device Resiliency
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Topics: Fibers, Resilience, Testing, Governments, Photonic equipment, Engineering prototypes, Failure, Lasers, Manufacturing, Photonics
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

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Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
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Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Quick Turn Methodology for High Temperature Solder Fatigue Reliability

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Matthew Norris, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113999
https://doi.org/10.1115/IPACK2023-113999
View Paper titled, Quick Turn Methodology for High Temperature Solder Fatigue Reliability
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Topics: Fatigue, High temperature, Lead-free solders, Reliability, Solders, Cycles, Failure, Geometry, Temperature, Thermal shock
Proceedings Papers

Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

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Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Jian Yu, Andres Bujanda, Harvey Tsang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
https://doi.org/10.1115/IPACK2023-111895
View Paper titled, Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels
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Topics: Accelerated life testing, Accelerometers, Additive manufacturing, Aluminum, Circuits, Computer numerical control machine tools, Cracking (Materials), Delamination, Domes (Structural elements), Durability
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

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Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

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Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97204
https://doi.org/10.1115/IPACK2022-97204
View Paper titled, Power Envelope Analysis for the Thermal Optimization of a Chiplet Module
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Topics: Design, Heat sinks, Junctions, Optimization, Reliability, Resistors, Risk, Simulation, Temperature
Proceedings Papers

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

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Fenny Liu, Sean Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97175
https://doi.org/10.1115/IPACK2022-97175
View Paper titled, RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study
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Topics: Hazardous substances, Manufacturing, Phthalate plasticizers, Electronic equipment, Plasticizers, Risk, Semiconductor industry, Temperature, Weight (Mass)
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

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Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Double Side System in Package Development Challenge for Heterogeneous Integration

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Feng Kao, Yu-Po Wang, Davidlion Wang, Jensen Tsai, Mike Tsai, Ryan Chiu, Eric He
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6354
https://doi.org/10.1115/IPACK2019-6354
View Paper titled, Double Side System in Package Development Challenge for Heterogeneous Integration
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Topics: System-in-package, Molding, Simulation, Accelerated life testing, Copper, Design, Energy dissipation, Internet of things, Manufacturing, Packaging
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

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Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6347
https://doi.org/10.1115/IPACK2019-6347
View Paper titled, Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

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Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6429
https://doi.org/10.1115/IPACK2019-6429
View Paper titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles
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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

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Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74278
https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

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Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74026
https://doi.org/10.1115/IPACK2017-74026
View Paper titled, Large Flip Chip Assembly Challenges and Risk Mitigation Process
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Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)
Proceedings Papers

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

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Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74322
https://doi.org/10.1115/IPACK2017-74322
View Paper titled, Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures
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Topics: Bending (Stress), Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, Temperature, Fracture (Materials), Elongation, Shock (Mechanics), Failure
Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

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Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74073
https://doi.org/10.1115/IPACK2017-74073
View Paper titled, Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging
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Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress
Proceedings Papers

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

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Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74190
https://doi.org/10.1115/IPACK2017-74190
View Paper titled, Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components
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Topics: Electronic components, Failure, Vibration, Engineering standards, Reliability, Damage, Electronics, Failure mechanisms, Risk, Roads
Proceedings Papers

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

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Pradeep Lall, Hao Zhang, Rahul Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74232
https://doi.org/10.1115/IPACK2017-74232
View Paper titled, Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics
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Topics: Biometry, Design, Flexible electronics, Sensors, Electronics, Manufacturing, Reliability, Thermal stresses, Biomedicine, Copper
Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

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Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74010
https://doi.org/10.1115/IPACK2017-74010
View Paper titled, Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
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Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)