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Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8448
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48184
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48241
Proceedings Papers
Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48592
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A083, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48277
Proceedings Papers
Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48122
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48417
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48393
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A033, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73162
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73063
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73043
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73033
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 47-57, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52020
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 113-121, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52053
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 81-94, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52042
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 95-106, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52043
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 113-118, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89085
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 229-237, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89020
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 199-209, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33636
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 137-145, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33829
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