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Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48242
https://doi.org/10.1115/IPACK2015-48242
View Paper titled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils
Proceedings Papers

A Semi-Empirically Thermal Optimization for Heat Sink/TEC Assemblies With Various External Thermal Resistances

M. C. Wu, T. Y. Wu, J. T. Horng, S. F. Chang, P. L. Chen, Y. H. Hung
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 205-212, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33281
https://doi.org/10.1115/IPACK2007-33281
View Paper titled, A Semi-Empirically Thermal Optimization for Heat Sink/TEC Assemblies With Various External Thermal Resistances
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Topics: Design, Heat capacity, Heat sinks, Optimization, Response surface methodology, Thermal resistance, Thermoelectric coolers
Proceedings Papers

Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability

Satoshi Kondo, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 855-861, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33242
https://doi.org/10.1115/IPACK2007-33242
View Paper titled, Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability
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Topics: Ball-Grid-Array packages, Design, Evaluation methods, Reliability, Ball-Grid-Array packaging, Engineers, Fatigue, Fatigue life, Printed circuit boards, Response surface methodology
Proceedings Papers

DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses

Ming-Che Hsieh, Wei Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 95-99, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33510
https://doi.org/10.1115/IPACK2007-33510
View Paper titled, DOE Analysis of Effects of Geometry and Materials on Cu/Low-K Interconnect Stresses
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Topics: Geometry, Stress, Copper, Finite element analysis, Dimensions, Dielectric materials, Response surface methodology, Design, Design methodology, Experimental design
Proceedings Papers

Thermal Optimal Design for Partially-Confined Compact Heat Sinks

M. P. Wang, H. T. Chen, J. T. Horng, T. Y. Wu, P. L. Chen, Y. H. Hung
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 143-150, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73118
https://doi.org/10.1115/IPACK2005-73118
View Paper titled, Thermal Optimal Design for Partially-Confined Compact Heat Sinks
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Topics: Design, Heat sinks, Pressure drop, Thermal resistance, Flow (Dynamics), Composite materials, Experimental design, Forced convection, Heat flux, Optimization
Proceedings Papers

A Research of Actuators for Micromirror Control

Hiroki Mamiya, Koji Ishikawa, Qiang Yu
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 233-238, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35123
https://doi.org/10.1115/IPACK2003-35123
View Paper titled, A Research of Actuators for Micromirror Control
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Topics: Actuators, Response surface methodology
Proceedings Papers

Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 875-886, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35342
https://doi.org/10.1115/IPACK2003-35342
View Paper titled, Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects
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Topics: Diluents, Displacement, Electroplating, Geometry, Integrated circuit fabrication, Manufacturing, Microelectromechanical systems, Optimization, Packaging, Photolithography