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Proceedings Papers

Molybdenum Disulfide (MoS 2 ) Nanomechanical Resonators Integrated on Microchannels

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Rui Yang, Zhenyu Li, Philip X.-L. Feng
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48590
https://doi.org/10.1115/IPACK2015-48590
View Paper titled, Molybdenum Disulfide (MoS 2 ) Nanomechanical Resonators Integrated on Microchannels
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Topics: Microchannels, Molybdenum, Nanomechanical resonators, Resonance, Microfluidics, Plasma desorption mass spectrometry, Thermomechanics, Cantilevers, Fluids, Membranes
Proceedings Papers

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

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Jingshi Meng, Abhijit Dasgupta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48669
https://doi.org/10.1115/IPACK2015-48669
View Paper titled, Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency
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Topics: Failure mechanisms, Resonance, Reflection, Stress, Circuits, Diluents, Disperse systems, Electrical wires, Impulse (Physics), Microelectromechanical systems
Proceedings Papers

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

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Chang Yong Ha, Soo Il Lee
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 179-184, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52100
https://doi.org/10.1115/IPACK2011-52100
View Paper titled, Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging
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Topics: Bonding, Integrated circuits, Optimization, Packaging, Topology, Design, Modal assurance criterion, Vibration, Errors, Finite element model
Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

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David A. Miller
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52293
https://doi.org/10.1115/IPACK2011-52293
View Paper titled, Characterization of a Macrofiber Piezoelectric Composite
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)
Proceedings Papers

Power/Ground Pin-Map Design for Power Integrity

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Jingook Kim, James Drewniak, Jun Fan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 675-679, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52287
https://doi.org/10.1115/IPACK2011-52287
View Paper titled, Power/Ground Pin-Map Design for Power Integrity
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Topics: Design, Circuits, Cavities, Performance, Resonance
Proceedings Papers

Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors

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Chandradip Patel, Allen Jones, Joshua Davis, Patrick McCluskey, David Lemus
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 507-512, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89370
https://doi.org/10.1115/InterPACK2009-89370
View Paper titled, Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors
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Topics: Microelectromechanical systems, Reliability, Sensors, Temperature effects, Temperature, Displacement, Displacement measurement, Fire, High temperature, Resonance
Proceedings Papers

Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films

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Toshiaki Tanaka, Aiko Sato, Hitoshi Asano, Mitsuru Takenaga
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 517-520, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89058
https://doi.org/10.1115/InterPACK2009-89058
View Paper titled, Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films
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Topics: Chain, Electric fields, Electrodes, Film thickness, Glass, Irradiation (Radiation exposure), Microscopy, Polymer films, Resonance, Silicon
Proceedings Papers

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

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Y. Zhou, M. Al-Bassyiouni, A. Dasgupta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 143-148, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89178
https://doi.org/10.1115/InterPACK2009-89178
View Paper titled, Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects
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Topics: Accelerometers, Approximation, Bending (Stress), Damage, Durability, Fatigue, Finite element analysis, Manufacturing, Printed circuit boards, Random excitation
Proceedings Papers

Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools

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Ryan T. Marinis, Ryszard J. Pryputniewicz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 471-476, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89222
https://doi.org/10.1115/InterPACK2009-89222
View Paper titled, Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools
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Topics: Errors, Rotation, Interferometry, Coriolis force, Excitation, Resonance, Sensors, Shapes
Proceedings Papers

Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors

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Vijay Sarihan, Jian Wen, Gary Li
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 501-505, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89330
https://doi.org/10.1115/InterPACK2009-89330
View Paper titled, Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors
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Topics: Microelectromechanical systems, Reliability, Resonance, Sensors
Proceedings Papers

Design Optimization of Fixed-Valve Micropumps for Miniature Cooling Systems

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Fred K. Forster, Travis Walter
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 137-145, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33829
https://doi.org/10.1115/IPACK2007-33829
View Paper titled, Design Optimization of Fixed-Valve Micropumps for Miniature Cooling Systems
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Topics: Cooling systems, Design, Micropumps, Optimization, Valves, Pumps, Flow (Dynamics), Pressure, Stress, Actuators
Proceedings Papers

Analytical Solution of Whispering-Gallery Modes

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Haiyong Quan, Zhixiong Guo
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 489-497, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33124
https://doi.org/10.1115/IPACK2007-33124
View Paper titled, Analytical Solution of Whispering-Gallery Modes
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Topics: Boundary-value problems, Cavities, Electric fields, Filters, Microelectromechanical systems, Nanoelectromechanical systems, Nanosensors, Resonance, Separation (Technology), Wave equations
Proceedings Papers

Study of Printed Circuit Board Shock Transmissibility

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Frank Fan Wang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 151-155, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33074
https://doi.org/10.1115/IPACK2007-33074
View Paper titled, Study of Printed Circuit Board Shock Transmissibility
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Topics: Printed circuit boards, Shock (Mechanics), Stress, Deflection, Resonance, Electronics, Excitation
Proceedings Papers

A Novel Discrete Passives Integration on Organic Substrate

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Vasudivan Sunappan, Chee Wai Lu, Lai Lai Wai, Wei Fan, Boon Keng Lok
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1963-1967, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73102
https://doi.org/10.1115/IPACK2005-73102
View Paper titled, A Novel Discrete Passives Integration on Organic Substrate
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Topics: Capacitors, Inductors, Integrated circuits, Lamination, Manufacturing, Printed circuit boards, Reliability, Resistors, Resonance, Solder joints
Proceedings Papers

Development of 1D Optical Micro Scanner Driven by Piezoelectric Actuators

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Takeshi Kobayashi, Jiunnjye Tsaur, Ryutaro Maeda
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 789-792, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73431
https://doi.org/10.1115/IPACK2005-73431
View Paper titled, Development of 1D Optical Micro Scanner Driven by Piezoelectric Actuators
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Topics: Piezoelectric actuators, Cantilevers, Hinges, Microelectromechanical systems, Microfabrication, Mirrors, Resonance, Rotation, Silicon-on-insulator
Proceedings Papers

Power Distribution Analysis of Multi-Layer Substrates With Power Decoupling Capacitors

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Albert Chee Wai Lu, Lin Jin, Kai M. Chua, Wei Fan, Lai L. Wai
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1985-1988, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73347
https://doi.org/10.1115/IPACK2005-73347
View Paper titled, Power Distribution Analysis of Multi-Layer Substrates With Power Decoupling Capacitors
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Topics: Capacitors, Resonance, Ceramics, Design, Low temperature, Modeling, Waves
Proceedings Papers

Dynamic and Thermal Elastic Problems for STM Flatpack Hardware

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Fred Cutting
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 803-817, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73015
https://doi.org/10.1115/IPACK2005-73015
View Paper titled, Dynamic and Thermal Elastic Problems for STM Flatpack Hardware
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Topics: Design, Energy dissipation, Fatigue, Hardware, Heat, Random vibration, Resonance, Rotational inertia, Spectral energy distribution, Springs
Proceedings Papers

Effects of Acoustic Resonance on Hydrodynamics and Evaporation of a Pendant Liquid Droplet

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Jong Hoon Moon, Byung Ha Kang, Ho-Young Kim
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2005-2009, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73111
https://doi.org/10.1115/IPACK2005-73111
View Paper titled, Effects of Acoustic Resonance on Hydrodynamics and Evaporation of a Pendant Liquid Droplet
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Topics: Acoustics, Drops, Evaporation, Hydrodynamics, Oscillations, Resonance, Waves
Proceedings Papers

Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment

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Frank Fan Wang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1083-1088, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73005
https://doi.org/10.1115/IPACK2005-73005
View Paper titled, Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment
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Topics: Electronic equipment, Shock (Mechanics), Stress, Vibration, Resonance, Damage, Excitation, Random vibration, Spectral energy distribution, Waves
Proceedings Papers

Impingement Air Cooling With Synthetic Jets Over Small and Large Heated Surfaces

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Jivtesh Garg, Mehmet Arik, Stanton Weaver
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 277-285, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73211
https://doi.org/10.1115/IPACK2005-73211
View Paper titled, Impingement Air Cooling With Synthetic Jets Over Small and Large Heated Surfaces
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Topics: Cooling, Jets, Heat transfer, Natural convection, Electronics, Energy consumption, Heat, Heat transfer coefficients, Imaging, Resonance