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Proceedings Papers

Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Matthew Bowman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140062
https://doi.org/10.1115/IPACK2024-140062
View Paper titled, Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures
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Topics: Temperature, Testing, Circuits, Failure, Failure mechanisms, Extruding, Polysulfone, Shock (Mechanics), Silver, Accelerometers
Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
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Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors

Pradeep Lall, Shriram Kulkarni, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111980
https://doi.org/10.1115/IPACK2023-111980
View Paper titled, Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors
Open the PDF for Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors in another window
Topics: Capacitors, Inductors, Resistors, Printing, Circuits, Drops, Electronics, Inks, Particulate matter, Resolution (Optics)
Proceedings Papers

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97204
https://doi.org/10.1115/IPACK2022-97204
View Paper titled, Power Envelope Analysis for the Thermal Optimization of a Chiplet Module
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Topics: Design, Heat sinks, Junctions, Optimization, Reliability, Resistors, Risk, Simulation, Temperature
Proceedings Papers

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2614
https://doi.org/10.1115/IPACK2020-2614
View Paper titled, PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Printed circuit boards, Thermomechanics, Stress, Ceramics, Control panels, Deformation, Electronic components, Experimental methods, Finite element analysis, Reliability
Proceedings Papers

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Richard C. Jaeger, Jun Chen, Jeffrey C. Suhling, Leonid Fursin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8219
https://doi.org/10.1115/IPACK2018-8219
View Paper titled, Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide
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Topics: Calibration, Design, Sensors, Silicon, Stress, Resistors, Temperature, Aerospace systems, Drilling, Geothermal power stations
Proceedings Papers

Thermal Characterization of Si BEOL Microelectronic Structures

Assaad El Helou, Peter E. Raad, Archana Venugopal, Dhishan Kande
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8350
https://doi.org/10.1115/IPACK2018-8350
View Paper titled, Thermal Characterization of Si BEOL Microelectronic Structures
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Topics: Computer simulation, Design, Dimensions, Heat sinks, Operating temperature, Reliability, Resistors, Temperature, Thermal characterization, Thermal properties
Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8355
https://doi.org/10.1115/IPACK2018-8355
View Paper titled, Multifunctional Chip for Use in Thermal Analysis of Power Systems
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Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)
Proceedings Papers

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74130
https://doi.org/10.1115/IPACK2017-74130
View Paper titled, Power Packaging Thermal and Stress Model for Quick Parametric Analyses
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Topics: Packaging, Stress, Finite element analysis, Design, Matlab, Temperature, Thermal stresses, Computer-aided design, Resistors, Computer-aided engineering
Proceedings Papers

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Matthew Ernst, Cholmin Choi, Abhijit Dasgupta
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73200
https://doi.org/10.1115/IPACK2013-73200
View Paper titled, Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading
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Topics: Time-domain analysis, Transients (Dynamics), Finite element analysis, Cycles, Dynamic analysis, Vibration, Cantilever beams, Circuits, Durability, Manufacturing
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73278
https://doi.org/10.1115/IPACK2013-73278
View Paper titled, Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Proceedings Papers

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Darin J. Sharar, Brian Morgan, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 133-142, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52079
https://doi.org/10.1115/IPACK2011-52079
View Paper titled, Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics
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Topics: Army, Electronics, Vehicles, Temperature, Energy dissipation, Heat, Coolants, Cooling, Design, Electrical resistivity
Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52047
https://doi.org/10.1115/IPACK2011-52047
View Paper titled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Proceedings Papers

A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design

Qing He, Duo Chen, Dan Jiao
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 647-652, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52276
https://doi.org/10.1115/IPACK2011-52276
View Paper titled, A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design
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Topics: Circuits, Design, Simulation, Capacitors, Complementary metal oxide semiconductors, Computation, Electromagnetic force, Electromagnetism, Inductors, Resistors
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89092
https://doi.org/10.1115/InterPACK2009-89092
View Paper titled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Bankeem V. Chheda, Sathishkumar Sakthivelan, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 309-316, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89321
https://doi.org/10.1115/InterPACK2009-89321
View Paper titled, Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies
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Topics: Thermal shock, Solders, Alloys, Failure, Chain, Manufacturing, Solder joints, Ball-Grid-Array packaging, Finishes, Lead-free solders
Proceedings Papers

Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

Richard C. Jaeger, Jeffrey C. Suhling, Safina Hussain, Jordan C. Roberts, Mohammad A. Motalab, Chun-Hyung Cho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 15-25, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89245
https://doi.org/10.1115/InterPACK2009-89245
View Paper titled, Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon
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Topics: Errors, Flip-chip packages, Sensors, Silicon, Stress, Temperature, Integrated circuits, Electronic packages, Finite element model, Flip-chip
Proceedings Papers

Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

Yoshiyuki Okamoto, Takeshi Takayanagi, Toshihiko Sayama, Yasuhiro Ejiri, Hiroyuki Nakano, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 809-814, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89262
https://doi.org/10.1115/InterPACK2009-89262
View Paper titled, Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints
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Topics: Fatigue cracks, Solder joints, Tin, Cycles, Fatigue damage, Fracture (Materials), Printed circuit boards, Resistors, Scanning electron microscopes, Solders
Proceedings Papers

Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes

Anand Kannabiran, Sreekanth Varma Penmatsa, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 945-952, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33963
https://doi.org/10.1115/IPACK2007-33963
View Paper titled, Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes
Open the PDF for Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes in another window
Topics: Finishes, Printed circuit boards, Solders, Tin, Manufacturing, Solder joints, Testing, Design, Intermetallic compounds, Surface mount packaging