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Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

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Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface

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Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A032, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143310
https://doi.org/10.1115/IPACK2024-143310
View Paper titled, Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface
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Topics: Damage, Delamination, Displacement, Failure, Fracture (Materials), High temperature, Reliability, Stress
Proceedings Papers

Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces

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Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan, Madhu Kasturi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A031, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143308
https://doi.org/10.1115/IPACK2024-143308
View Paper titled, Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces
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Topics: Copper, Delamination, Diseases, Displacement, Electronics, Fracture (Materials), High temperature, Liver, Reliability, Stress
Proceedings Papers

Comparing Wire Bonding Strategies for High Power Applications

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Whit Vinson, Frida Torres, David Huitink
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140965
https://doi.org/10.1115/IPACK2024-140965
View Paper titled, Comparing Wire Bonding Strategies for High Power Applications
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Topics: Alloys, Aluminum, Current density, Electrical resistivity, Electrodiffusion, Failure, Heating, Intermetallic compounds, Joules, Nickel
Proceedings Papers

Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses

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Mujahid Abbas Syed, Qiang Yu
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139572
https://doi.org/10.1115/IPACK2024-139572
View Paper titled, Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses
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Topics: Geometry, Printed circuit boards, Reliability, Stress, Thermomechanics
Proceedings Papers

Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics

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Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141889
https://doi.org/10.1115/IPACK2024-141889
View Paper titled, Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics
Open the PDF for Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics in another window
Topics: Electronics, High temperature, Printing, Reliability
Proceedings Papers

Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive

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Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141858
https://doi.org/10.1115/IPACK2024-141858
View Paper titled, Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive
Open the PDF for Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive in another window
Topics: Adhesives, Aerosols, Circuits, Printing, Reliability, Sustainability, Temperature, Water based printing inks
Proceedings Papers

Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

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Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A029, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142109
https://doi.org/10.1115/IPACK2024-142109
View Paper titled, Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure
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Topics: Delamination, Fracture toughness, High temperature, Reliability, Failure mechanisms, Semiconductors (Materials), Automobiles, Ball-Grid-Array packaging, Durability, Electronics
Proceedings Papers

Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration

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Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A023, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141845
https://doi.org/10.1115/IPACK2024-141845
View Paper titled, Study on the Impact of Prolonged High-Temperature Exposure on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration
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Topics: Finite element analysis, High temperature, Lead-free solders, Reliability, Solders, Vibration
Proceedings Papers

Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation

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Pradeep Lall, Md Golam Sarwar, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141863
https://doi.org/10.1115/IPACK2024-141863
View Paper titled, Performance and Reliability of In-Mold Direct-Write Signal Processing Circuits in Sustained High-Temperature Operation
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Topics: Adhesives, Circuits, High temperature, Printing, Reliability, Signal processing
Proceedings Papers

Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter

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Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141874
https://doi.org/10.1115/IPACK2024-141874
View Paper titled, Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter
Open the PDF for Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter in another window
Topics: Filters, Low-pass filters, Reliability, Automobiles, Durability, Electronics, Adhesives, Computer software, Cutting, Engineering simulation
Proceedings Papers

Predictive Machine Learning Models for LiDAR Sensor Reliability in Autonomous Vehicles

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Saba A. Farahani, Jae Yun Lee, Hunjae Kim, Yoonjin Won
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141038
https://doi.org/10.1115/IPACK2024-141038
View Paper titled, Predictive Machine Learning Models for LiDAR Sensor Reliability in Autonomous Vehicles
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Topics: Autonomous vehicles, Contamination, Lidar, Machine learning, Reliability, Sensors
Proceedings Papers

Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects

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Souvik Chakraborty, Debabrata Mondal, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141356
https://doi.org/10.1115/IPACK2024-141356
View Paper titled, Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects
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Topics: Dimensions, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Fatigue life, Finite element analysis, Solders, Boundary-value problems, Design, Energy consumption
Proceedings Papers

Reliability of Direct Write Additively Printed Sustainable Flexible Circuitry With ECA Under Sustained High-Temperature Operation

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Pradeep Lall, Md Golam Sarwar, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142111
https://doi.org/10.1115/IPACK2024-142111
View Paper titled, Reliability of Direct Write Additively Printed Sustainable Flexible Circuitry With ECA Under Sustained High-Temperature Operation
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Topics: High temperature, Printing, Reliability, Sustainability
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

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Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
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Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

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Mahdi Farahikia, Ping-Chuan Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
https://doi.org/10.1115/IPACK2023-111725
View Paper titled, Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
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Topics: Additive manufacturing, Pressure drop, Temperature uniformity, Thermal management, Water, Temperature, Temperature distribution, Heat transfer, Integrated circuits, Laminar flow
Proceedings Papers

Quick Turn Methodology for High Temperature Solder Fatigue Reliability

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Matthew Norris, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113999
https://doi.org/10.1115/IPACK2023-113999
View Paper titled, Quick Turn Methodology for High Temperature Solder Fatigue Reliability
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Topics: Fatigue, High temperature, Lead-free solders, Reliability, Solders, Cycles, Failure, Geometry, Temperature, Thermal shock
Proceedings Papers

Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems

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Pardeep Shahi, Ali Heydari, Chandraprakash Hinge, Lochan Sai Reddy Chinthaparthy, Himanshu Modi, Harold Miyamura, Mohammad Tradat, Uschas Chowdhury, Vahideh Radmard, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110576
https://doi.org/10.1115/IPACK2023-110576
View Paper titled, Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems
Open the PDF for Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems in another window
Topics: Coolants, Cooling, Data centers, Event history analysis, Reliability
Proceedings Papers

Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments

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Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113781
https://doi.org/10.1115/IPACK2023-113781
View Paper titled, Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments
Open the PDF for Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments in another window
Topics: Copper, Critical heat flux, Data centers, Heat, Heat transfer, Microcoolers, Pool boiling, Refrigerants, Reliability
Proceedings Papers

Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions

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Collin Ruby, David R. Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113756
https://doi.org/10.1115/IPACK2023-113756
View Paper titled, Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions
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Topics: Reliability, Shear stress, Solder joints, Stress, Temperature