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Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022

Paper No: IPACK2022-97416

DOI: https://doi.org/10.1115/IPACK2022-97416

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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks

Proceedings Papers

Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

John Kim, Raffaele L. Amalfi

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 26–28, 2021

Paper No: IPACK2021-72618

DOI: https://doi.org/10.1115/IPACK2021-72618

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Topics: Computer cooling, Heat transfer, Machine learning, Machinery, Refrigerants, Two-phase flow

Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021

Paper No: IPACK2021-72612

DOI: https://doi.org/10.1115/IPACK2021-72612

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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design

Proceedings Papers

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, M. Arik

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020

Paper No: IPACK2020-2569

DOI: https://doi.org/10.1115/IPACK2020-2569

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Topics: Air flow, Computer cooling, Cooling, Design, Fins, Flow (Dynamics), Forced convection, Heat flux, Heat sinks, Heat transfer

Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020

Paper No: IPACK2020-2542

DOI: https://doi.org/10.1115/IPACK2020-2542

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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants

Proceedings Papers

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Kunrong Shen, Zhichuan Sun, Xiaolong Yan, Wei Li, David J. Kukulka, Jianxin Zhou, Deyu Luan, Yan He, Bin Zhang

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A023, August 27–30, 2018

Paper No: IPACK2018-8449

DOI: https://doi.org/10.1115/IPACK2018-8449

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Topics: Condensation, Evaporation, Heat transfer, Heat transfer coefficients, Refrigerants, Pressure drop, Temperature, Vapors, Climate change, Flux (Metallurgy)

Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018

Paper No: IPACK2018-8322

DOI: https://doi.org/10.1115/IPACK2018-8322

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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine

Proceedings Papers

State of the Art of Electronics Cooling for Radar Antenna Applications

Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017

Paper No: IPACK2017-74080

DOI: https://doi.org/10.1115/IPACK2017-74080

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Topics: Computer cooling, Radar, Cooling, Heat flux, Defense industry, Design, Electronics, Refrigerants, Two-phase flow, Analytical methods

Proceedings Papers

Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000

Fanghao Yang, Xiaochuan Li, Wenming Li, Chen Li

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A006, July 6–9, 2015

Paper No: IPACK2015-48737

DOI: https://doi.org/10.1115/IPACK2015-48737

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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Nanostructures , Fluids, Heat sinks, Nanolithography, Nanoparticles, Nanoscale phenomena

Proceedings Papers

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

Tianyi Gao, Marcelo del Valle, Alfonso Ortega, Bahgat G. Sammakia

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015

Paper No: IPACK2015-48377

DOI: https://doi.org/10.1115/IPACK2015-48377

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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Computer simulation, Flow (Dynamics), Temperature, Coolers

Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015

Paper No: IPACK2015-48814

DOI: https://doi.org/10.1115/IPACK2015-48814

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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities

Proceedings Papers

Micro Cryogenic Coolers With Mixed Refrigerants

Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013

Paper No: IPACK2013-73290

DOI: https://doi.org/10.1115/IPACK2013-73290

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Topics: Coolers, Refrigerants, Microelectromechanical systems, Flow (Dynamics), Heat exchangers, Low temperature, Microchannel flow, Pressure, Temperature, Valves

Proceedings Papers

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Vibhash Jha, Serguei Dessiatoun, Michael Ohadi, Amir Shooshtari, Ebrahim Al-Hajri

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 277-283, July 6–8, 2011

Paper No: IPACK2011-52179

DOI: https://doi.org/10.1115/IPACK2011-52179

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Topics: Heat recovery, Heat transfer, Flow (Dynamics), Heat transfer coefficients, Pressure drop, Refrigerants, Thermal management, Absorption, Cooling, Electronic products

Proceedings Papers

Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers

Takeshi Tsukamoto, Jyunji Takayoshi, Roger R. Schmidt, Madhusudan K. Iyengar

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 915-921, July 19–23, 2009

Paper No: InterPACK2009-89258

DOI: https://doi.org/10.1115/InterPACK2009-89258

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Topics: Cooling, Data centers, Heat exchangers, Refrigeration, Server racks, Refrigerants, Water, Compression, Construction, Coolants

Proceedings Papers

Boiling Characteristics of Refrigerant Mixture Flow in Micro Scale Heat Exchangers Enhanced With Micro-Coils

Yasir M. Shariff

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 291-299, July 8–12, 2007

Paper No: IPACK2007-33075

DOI: https://doi.org/10.1115/IPACK2007-33075

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Topics: Boiling, Flow (Dynamics), Heat exchangers, Refrigerants, Heat flux, Heat transfer, Heat transfer coefficients, Heating, Subcooling, Wire

Proceedings Papers

High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler

Velimir Jovanovic, Saeid Ghamaty, Daniel Krommenhoek, John C. Bass

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 595-601, July 8–12, 2007

Paper No: IPACK2007-33838

DOI: https://doi.org/10.1115/IPACK2007-33838

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Topics: Quantum wells, Cooling, Sensors, Temperature, National Institute of Standards and Technology, Thin films, Air conditioning, Compression, Compressors, Cooling systems

Proceedings Papers

Closed-Loop Flow Boiling Module With a Plated Heat Sink

Hitoshi Sakamoto, Kazuyuki Mikubo

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 301-306, July 8–12, 2007

Paper No: IPACK2007-33260

DOI: https://doi.org/10.1115/IPACK2007-33260

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Topics: Boiling, Flow (Dynamics), Heat sinks, Heat, Heat transfer, Cooling, Refrigerants, Bubbles, Fluids, Plating

Proceedings Papers

Analysis of Alternative Data Center Cooling Approaches

Robert Hannemann, Herman Chu

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 743-750, July 8–12, 2007

Paper No: IPACK2007-33176

DOI: https://doi.org/10.1115/IPACK2007-33176

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Topics: Cooling, Data centers, Heat, Stress, Density, Refrigerants, Water, Computers, Heat exchangers

Proceedings Papers

Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

Ali Heydari

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 859-870, July 8–12, 2007

Paper No: IPACK2007-33848

DOI: https://doi.org/10.1115/IPACK2007-33848

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Topics: Cooling, Cooling systems, Data centers, Energy efficiency, Modeling, Thermodynamics, Heat exchangers, Computational fluid dynamics, Refrigeration, Density

Proceedings Papers

Design of a Transient, Temperature Control System for a Low-Temperature Infrared Optical Telescope Utilizing a Ramai R-Cooled Thermoelectric Assembly as the Condenser of a Two-Phase Cooling System

Donald C. Price, W. Gerald Wyatt, Pete Townsend, Mark C. Woods, Brad W. Fennell

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 683-695, July 17–22, 2005

Paper No: IPACK2005-73496

DOI: https://doi.org/10.1115/IPACK2005-73496

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Topics: Condensers (steam plant), Cooling systems, Design, Low temperature, Manufacturing, Telescopes, Temperature control, Transients (Dynamics), Temperature, Optical elements

NARROW

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

State of the Art of Electronics Cooling for Radar Antenna Applications

Integrate Monolithic Nanostructures in Microchannels to Enhance Flow Boiling Heat Transfer of HFE-7000

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Micro Cryogenic Coolers With Mixed Refrigerants

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers

Boiling Characteristics of Refrigerant Mixture Flow in Micro Scale Heat Exchangers Enhanced With Micro-Coils

High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler

Closed-Loop Flow Boiling Module With a Plated Heat Sink

Analysis of Alternative Data Center Cooling Approaches

Thermodynamics Energy Efficiency Analysis and Thermal Modeling of Data Center Cooling Using Open and Closed-Loop Cooling Systems

Design of a Transient, Temperature Control System for a Low-Temperature Infrared Optical Telescope Utilizing a Ramai R-Cooled Thermoelectric Assembly as the Condenser of a Two-Phase Cooling System

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