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Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

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Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52047
https://doi.org/10.1115/IPACK2011-52047
View Paper titled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

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Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects

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Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takso Mori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 523-529, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33170
https://doi.org/10.1115/IPACK2007-33170
View Paper titled, Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects in another window
Topics: Fatigue damage, Flip-chip, Flip-chip devices, Nondestructive evaluation, Synchrotron radiation, X-rays, Solders, Cycles, Fatigue cracks, Computerized tomography